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Intel® Core™ 2 Duo Mobile
Processors on 45-nm process for
Embedded Applications
Thermal Design Guide
June 2008
Order Number: 320028-001
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Core™ 2 Duo Mobile Processors—Contents Contents 1.0 Introduction ............................................................................................................. 6 1.1 Design Flow ....................................................................................................... 6 1.2 Definition of Terms ............................................................................................. 7 1.3 Reference Documents..........................................................
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Figures—Core™ 2 Duo Mobile Processors Figures 1 Thermal Design Process..............................................................................................7 2 Primary Side Keep Out Zone Requirements— Micro-FCPGA ............................................ 12 3 Primary Side Keep Out Zone Requirements— Micro-FCBGA............................................ 13 4 Secondary Side Keep Out Zone Requirements.............................................................. 14 5 Processor Thermal
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Core™ 2 Duo Mobile Processors—Tables Revision History Date Revision Description June 2008 1.0 First Public release. Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide TDG June 2008 5 Order Number: 320028-001
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Introduction—Core™ 2 Duo Mobile Processors 1.0 Introduction The power dissipation of electronic components has risen along with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over the product’s life cycle, the heat generated by the device must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting, and/or the use of heatsinks. The goals of this document are to: • Identify the t
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Core™ 2 Duo Mobile Processors—Introduction Figure 1. Thermal Design Process Step 1: Thermal Simulation • Package Level Thermal Models Step 2: Heatsink Design • Thermal Model User’s Guide and Selection • Reference Heatsinks • Reference Mounting Hardware Step 3: Thermal Validation • Vendor Contacts • Thermal Testing Software • Thermal Test Vehicle • User Guides 1.2 Definition of Terms Table 1. Definition of Terms (Sheet 1 of 2) Term Definition Flip Chip Pin Grid Array. A pin grid array
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Introduction—Core™ 2 Duo Mobile Processors Table 1. Definition of Terms (Sheet 2 of 2) Term Definition Thermal Interface Material – the thermally conductive compound between the TIM heatsink and die. This material fills air gaps and voids, and enhances spreading of the heat from the die to the heatsink. A unit of measure used to define server rack spacing height. 1U is equal to 1.75 U inches, 2U equals 3.50 inches, etc. WWatt 1.3 Reference Documents The reader of this specification should als
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Core™ 2 Duo Mobile Processors—Package Information 2.0 Package Information The Intel® Core™2 Duo Processor (XE and SV) is available in 478-pin Micro-FCPGA packages as well as 479-ball Micro-FCBGA packages. The Intel® Core™2 Duo Processor SFF processor (LV and ULV) is available in 956-ball Micro-FCBGA packages. The package mechanical dimensions can be found in the product’s datasheet. The Micro-FCBGA package incorporates land-side capacitors. The land-side capacitors are electrically conductiv
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Thermal Specifications—Core™ 2 Duo Mobile Processors 3.0 Thermal Specifications 3.1 Thermal Design Power The Thermal Design Power (TDP) specification is listed in Table 2. Heat transfer through the micro- FCBGA, micro-FCPGA package and socket via the base board is negligible. The cooling capacity without a thermal solution is also minimal, so Intel requires the use of a heatsink for all usage conditions. 3.2 Maximum Allowed Component Temperature The device must maintain a maximum temperature a
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Core™ 2 Duo Mobile Processors—Mechanical Specifications 4.0 Mechanical Specifications 4.1 Package Mechanical Requirements 4.1.1 Die Pressure/Load Upper Limit From a die mechanical integrity standpoint, the maximum allowable normal die load is the lesser of 2 2 15 lbs or 100 psi. Considering the 15 lbs load limit and the nominal die area of 1.45 cm (0.22 in. ), this equates to a die pressure of 66.7 psi (below 100 psi specification). Considering the maximum pressure specification, the die load
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Mechanical Specifications—Core™ 2 Duo Mobile Processors Figure 2. Primary Side Keep Out Zone Requirements— Micro-FCPGA Notes: 1. Dimension in millimeters [inches]. Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications June 2008 TDG Order Number: 320028-001 12
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Core™ 2 Duo Mobile Processors—Mechanical Specifications Figure 3. Primary Side Keep Out Zone Requirements— Micro-FCBGA Notes: 1. Dimension in millimeters [inches]. Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide TDG June 2008 13 Order Number: 320028-001
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Mechanical Specifications—Core™ 2 Duo Mobile Processors Figure 4. Secondary Side Keep Out Zone Requirements Notes: 1. Dimension in millimeters [inches]. Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications June 2008 TDG Order Number: 320028-001 14
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Core™ 2 Duo Mobile Processors—Thermal Solution Requirements 5.0 Thermal Solution Requirements 5.1 Thermal Solution Characterization The thermal characterization parameter, Ψ (“psi”), is used to characterize thermal solution performance, as well as compare thermal solutions in identical situations (i.e., heating source, local ambient conditions, etc.). It is defined by the following equation: Equation 1. Junction-to-Local Ambient Thermal Characterization Parameter (Ψ ) JA T −T J A Ψ = JA TDP Ψ
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Thermal Solution Requirements—Core™ 2 Duo Mobile Processors Figure 5. Processor Thermal Characterization Parameter Relationships T T A A Ψ Ψ SA SA HEATSINK Ψ Ψ JA TIM T T S S Ψ Ψ TIM T J Device ® 5.1.1 Calculating the Required Thermal Performance for the Intel Core™2 Duo processor Overall thermal performance, Ψ is then defined using the thermal characterization parameter: JA, • Define a target component temperature T and corresponding TDP. JUNCTION • Define a target local ambient t
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Core™ 2 Duo Mobile Processors—Thermal Solution Requirements It is evident from the above calculations that a reduction in the local ambient temperature can have a significant effect on the junction-to-ambient thermal resistance requirement. This effect can contribute to a more reasonable thermal solution including reduced cost, heatsink size, heatsink weight, or a lower system airflow rate. Table 3 summarizes the thermal budget required to adequately cool the Intel® Core™ 2 Duo Mobile Proces
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Reference Thermal Solutions—Core™ 2 Duo Mobile Processors 6.0 Reference Thermal Solutions Intel has developed reference thermal solutions designed to meet the cooling needs of embedded form factor applications. This chapter describes the overall requirements for the reference thermal solution including critical-to-function dimensions, operating environment, and verification criteria. This document details solutions that are compatible with the AdvancedTCA* and Server System Infrastructure (1
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Core™ 2 Duo Mobile Processors—Reference Thermal Solutions 6.2 Keep Out Zone Requirements The keep out zone requirements on the PCB to use this heatsink are detailed in Appendix B, “Mechanical Drawings”. Because it extends beyond the footprint of the device, it is critical for the board designer to allocate space on the board for the heatsink. 6.3 Thermal Performance The AdvancedTCA reference heatsink is an all copper (C1100) design. The performance of this heatsink has been tested at flow rat
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Reference Thermal Solutions—Core™ 2 Duo Mobile Processors Figure 8. 1U Reference Heatsink Assembly 6.4.1 Keep Out Zone Requirements The keep out zone requirements on the PCB to use this heatsink are detailed in Appendix B, “Mechanical Drawings”. Because it extends beyond the footprint of the device, it is critical for board designers to allocate space for the heatsink. 6.4.2 Thermal Performance The 1U reference heatsink employs a thick copper (C1100) base with aluminum (Al 1050) stamped fins,
