Руководство по эксплуатации Philips TDA1552Q

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INTEGRATED CIRCUITS
DATA SHEET
TDA1552Q
2 x 22 W BTL stereo car radio
power amplifier
July 1994
Product specification
File under Integrated Circuits, IC01

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Philips Semiconductors Product specification 2 x 22 W BTL stereo car radio power TDA1552Q amplifier GENERAL DESCRIPTION The TDA1552Q is an integrated class-B output amplifier in a 13-lead single-in-line (SIL) plastic power package. The circuit contains 2 x 22 W amplifiers in Bridge Tied Load (BTL) configuration. The device is primarily developed for car radio applications. Features • Thermally protected • Requires very few external components • Reverse polarity safe • High output power • Low offse

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Philips Semiconductors Product specification 2 x 22 W BTL stereo car radio power TDA1552Q amplifier V V handbook, full pagewidth P1 P2 3 10 1 mute switch C m input 1 4 VA output 1A 2 kΩ 18 kΩ power stage mute switch C m 6 VA output 1B 60 kΩ 2 kΩ 18 kΩ power stage V P 11 mute/stand-by stand-by switch 12 stand-by not connected reference VA voltage 15 kΩ x1 mute switch TDA1552Q 15 kΩ V ref 13 mute switch C m input 2 9 VA output 2B 2 kΩ 18 kΩ power stage mute switch C m 7 VA output 2A 60 kΩ 2 kΩ V ref

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Philips Semiconductors Product specification 2 x 22 W BTL stereo car radio power TDA1552Q amplifier PINNING 1 IP1 input 1 8 GND2 power ground 2 (substrate) 2 GND ground (signal) 9 OUT2B output 2B 3V positive supply voltage 1 10 V positive supply voltage 2 P1 P2 4 OUT1A output 1A 11 M/SS mute/stand-by switch 5 GND1 power ground 1 (substrate) 12 n.c. not connected 6 OUT1B output 1B 13 IP2 input 2 7 OUT2A output 2A FUNCTIONAL DESCRIPTION The TDA1552Q contains two identical amplifiers with differentia

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Philips Semiconductors Product specification 2 x 22 W BTL stereo car radio power TDA1552Q amplifier Fig.2 Power derating curve. July 1994 5

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Philips Semiconductors Product specification 2 x 22 W BTL stereo car radio power TDA1552Q amplifier DC CHARACTERISTICS V = 14.4 V; T = 25 °C; measurements taken using Fig.3; unless otherwise specified P amb PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply Supply voltage range note 1 V 6.0 14.4 18.0 V P Total quiescent current I - 80 160 mA tot DC output voltage note 2 V - 6.9 - V O DC output offset voltage |ΔV | -- 150 mV O Mute/stand-by switch Switch-on voltage level V 8.5 -- V ON V 3.3 - 6.

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Philips Semiconductors Product specification 2 x 22 W BTL stereo car radio power TDA1552Q amplifier AC CHARACTERISTICS V = 14.4 V; R = 4 Ω; f = 1 kHz; T = 25 °C; measurements taken using Fig.3; unless otherwise specified P L amb PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Output power THD = 0.5% P 15 17 - W o THD = 10% P 20 22 - W o = 13.2 V THD = 0.5% P - 12 - W Output power at V P o THD = 10% P - 17 - W o Total harmonic distortion P = 1 W THD - 0.1 - % o Power bandwidth THD = 0.5% = - 1 dB

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Philips Semiconductors Product specification 2 x 22 W BTL stereo car radio power TDA1552Q amplifier APPLICATION INFORMATION handbook, full pagewidth mute/stand-by switch V P not connected 14.4 V 100 2200 nF μF 12 11 3 10 220 nF 1 input 1 4 R = 4 Ω 60 L kΩ 6 2 ground (signal) TDA1552Q reference voltage 220 nF 13 input 2 9 60 R = 4 Ω L kΩ 7 58 MLB951 power ground (substrate) Fig.3 Application circuit diagram. July 1994 8

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Philips Semiconductors Product specification 2 x 22 W BTL stereo car radio power TDA1552Q amplifier PACKAGE OUTLINE DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6 non-concave D h x D E h view B: mounting base side d A 2 B j E A L 3 L Q c 113 e m e w M v M Z 1 2 b p e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) (1) (1) (1) UNIT A A b cDdeD E e e E j LL m Q v w x Z 2 p h 1 2 h 3 17.0 4.6 0.75 0.48 24.0 20.0 12.2 3.4 12.4 2.4 2.1 2.00 6 mm 10 3.4 1.7

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Philips Semiconductors Product specification 2 x 22 W BTL stereo car radio power TDA1552Q amplifier SOLDERING The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the Introduction specified maximum storage temperature (T ). If the stg max printed-circuit board has been pre-heated, forced cooling There is no soldering method that is ideal for all IC may be necessary immediately after soldering to keep the packages. Wave soldering is often prefer