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TS2G~16GCF300
TS2G~16GCF300 300X CompactFlash Card
TS2G~16GCF300
Features
Description
• CompactFlash Specification Version 4.1 Complaint
The Transcend CF 300X is a High Speed Compact
• RoHS compliant products
Flash Card with high quality Flash Memory assembled
• Single Power Supply: 3.3V ± 5% or 5V ± 10%
on a printed circuit board.
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• Operating Temperature: -25 C to 85 C
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• Storage Temperature: -40 C to 85 C
Placement
• Operation Modes:
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TS2G~16GCF300 TS2G~16GCF300 300X CompactFlash Card TS2G~16GCF300 Transcend Transcend Information Inc. 2 V1.1
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TS2G~16GCF300 TS2G~16GCF300 300X CompactFlash Card TS2G~16GCF300 Block Diagram Transcend Information Inc. 3 V1.1
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TS2G~16GCF300 TS2G~16GCF300 300X CompactFlash Card TS2G~16GCF300 Pin Assignments and Pin Type PC Card Memory Mode PC Card I/O Mode True IDE Mode4 Pin Signal Pin Signal Pin In, Out Pin Signal Pin In, Out In, Out Type Pin Num Num Name Type Name Type Type Num Name Type Type 1 GND Ground 1 GND Ground 1 GND Ground 2 D03 I/O I1Z, OZ3 2 D03 I/O I1Z, OZ3 2 D03 I/O I1Z, OZ3 3 D04 I/O I1Z, OZ3 3 D04 I/O I1Z, OZ3 3 D04
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TS2G~16GCF300 TS2G~16GCF300 300X CompactFlash Card TS2G~16GCF300 PC Card Memory Mode PC Card I/O Mode True IDE Mode4 Pin Pin In, Out Pin Pin In, Out Pin Pin In, Out Signal Name Signal Name Signal Name Num Type Type Num Type Type Num Type Type 7 -IORD -IORD -IORD 10 10 8 34 HSTROBE I I3U 34 HSTROBE I I3U 34 I I3Z HSTROBE 11 11 9 HDMARDY -HDMARDY -HDMARDY 7 -IOWR -IOWR -IOWR 35 I I3U 35 I I3U 35 I I3Z 10,11 10,11 8,9
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TS2G~16GCF300 TS2G~16GCF300 300X CompactFlash Card TS2G~16GCF300 Signal Description Signal Name Dir. Pin Description A10 – A00 I 8,10,11,12, These address lines along with the -REG signal are used to select the following: (PC Card Memory Mode) 14,15,16,17, The I/O port address registers within the CompactFlash Storage Card , the 18,19,20 memory mapped port address registers within the CompactFlash Storage Card, a byte in the card's information structur
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TS2G~16GCF300 TS2G~16GCF300 300X CompactFlash Card TS2G~16GCF300 Signal Name Dir. Pin Description These input signals are used both to select the card and to indicate to the card -CE1, -CE2 I 7,32 whether a byte or a word operation is being performed. -CE2 always accesses (PC Card Memory Mode) the odd byte of the word.-CE1 accesses the even byte or the Odd byte of the Card Enable word depending on A0 and -CE2. A multiplexing scheme based on A0,-CE1, -CE2 a
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TS2G~16GCF300 TS2G~16GCF300 300X CompactFlash Card TS2G~16GCF300 Signal Name Dir. Pin Description -INPACK O 43 This signal is not used in this mode. (PC Card Memory Mode except Ultra DMA Protocol Active) The Input Acknowledge signal is asserted by the CompactFlash Storage Card -INPACK when the card is selected and responding to an I/O read cycle at the address (PC Card I/O Mode except Ultra that is on the address bus. This signal is used by the host
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TS2G~16GCF300 TS2G~16GCF300 300X CompactFlash Card TS2G~16GCF300 Signal Name Dir. Pin Description -IOWR This signal is not used in this mode. I 35 (PC Card Memory Mode– Except Ultra DMA Protocol Active) The I/O Write strobe pulse is used to clock I/O data on the Card Data bus into -IOWR the CompactFlash Storage Card controller registers when the CompactFlash (PC Card I/O Mode –Except Ultra Storage Card is configured to use the I/O interface. DMA P
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TS2G~16GCF300 TS2G~16GCF300 300X CompactFlash Card TS2G~16GCF300 Signal Name Dir. Pin Description This signal is used during Memory Cycles to distinguish between Common -REG I 44 Memory and Register (Attribute) Memory accesses. High for Common Memory, (PC Card Memory Mode– Except Low for Attribute Memory. Ultra DMA Protocol Active) Attribute Memory Select In PC Card Memory Mode, when Ultra DMA Protocol is supported by the host and the host has enabled
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TS2G~16GCF300 TS2G~16GCF300 300X CompactFlash Card TS2G~16GCF300 Signal Name Dir. Pin Description -VS1 Voltage Sense Signals. -VS1 is grounded on the Card and sensed by the Host O 33 -VS2 so that the CompactFlash Storage Card CIS can be read at 3.3 volts and -VS2 is 40 (PC Card Memory Mode) reserved by PCMCIA for a secondary voltage and is not connected on the Card. -VS1 This signal is the same for all modes. -VS2 (PC Card I/O Mode) -VS1 This sig
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TS2G~16GCF300 TS2G~16GCF300 300X CompactFlash Card TS2G~16GCF300 Electrical Specification The following tables indicate all D.C. Characteristics for the CompactFlash Storage Card. Unless otherwise stated, conditions are: Vcc = 5V ±10% Vcc = 3.3V ± 5% Absolute Maximum Conditions DC Characteristics CompactFlash Interface I/O at 5.0V Parameter Symbol Min. Max. Unit Remark Supply Voltage V 4.5 5.5 V CC High level output voltage V V ─ ── ─ 0.8 V
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TS2G~16GCF300 TS2G~16GCF300 300X CompactFlash Card TS2G~16GCF300 Input Power Input Leakage Current Input Characteristics for UDMA mode >4 In UDMA modes greater than 4, the following characteristics apply. Voltage output high and low values shall be met at the source connector to include the effect of series termination. Table: Input Characteristics (UDMA Mode > 4) Parameter Symbol MIN MAX Units DC supply voltage to drivers V 3.3 –8% 3.3% +
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TS2G~16GCF300 TS2G~16GCF300 300X CompactFlash Card TS2G~16GCF300 Output Drive Characteristics for UDMA mode > 4 In UDMA modes greater than 4, the characteristics specified in the following table apply. Voltage output high and low values shall be met at the source connector to include the effect of series termination. Table: Output Drive Characteristics (UDMA Mode > 4) Parameter Symbol MIN MAX Units DC supply voltage to drivers V 3.3 –8% 3.3% + 8% Volts
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TS2G~16GCF300 TS2G~16GCF300 300X CompactFlash Card TS2G~16GCF300 10 10 Item Signal Card Host -CE1 Pull-up to V 500 K Ω ≧ R ≧ 50 K Ω and CC -CE2 shall be sufficient to keep inputs inactive Control Signal -REG when the pins are not connected at the -IORD 1 host. -IOWR -OE 1,2 Pull-up to V 500 K Ω ≧ R ≧ 50 K Ω . CC -WE 1,2,9, RESET Pull-up to V 500 K Ω ≧ R ≧ 50 K Ω . CC READY 3 Status Signal -WAIT Pull-up to V R ≧ 10 K Ω . CC WP In PC
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TS2G~16GCF300 TS2G~16GCF300 300X CompactFlash Card TS2G~16GCF300 Notes: 1) Control Signals: each card shall present a load to the socket no larger than 50 pF 10 at a DC current of 700 μ A low state and 150 μ A high state, including pull-resistor. The socket shall be able to drive at least the following load 10 while meeting all AC timing requirements: (the number of sockets wired in parallel) multiplied by (50 pF with DC current 700 μ A low state and 150 μ A
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TS2G~16GCF300 TS2G~16GCF300 300X CompactFlash Card TS2G~16GCF300 4) The -WAIT and IORDY signals shall be ignored by the host. Devices supporting CF Advanced timing modes shall also support slower timing modes, to ensure operability with systems that do not support CF Advanced timing modes Transcend Information Inc. 17 V1.1
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TS2G~16GCF300 TS2G~16GCF300 300X CompactFlash Card TS2G~16GCF300 Ultra DMA Electrical Requirements Host and Card signal capacitance limits for Ultra DMA operation The host interface signal capacitance at the host connector shall be a maximum of 25 pF for each signal as measured at 1 MHz. The card interface signal capacitance at the card connector shall be a maximum of 20 pF for each signal as measured at 1 MHz. Series termination required for Ultra
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TS2G~16GCF300 TS2G~16GCF300 300X CompactFlash Card TS2G~16GCF300 Table: Ultra DMA Termination with Pull-up or Pull down Example Printed Circuit Board (PCB) Trace Requirements for Ultra DMA On any PCB for a host or device supporting Ultra DMA: The longest D[15:00] trace shall be no more than 0.5" longer than either STROBE trace as measured from the IC pin to the connector. The shortest D[15:00] trace shall be no mo
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TS2G~16GCF300 TS2G~16GCF300 300X CompactFlash Card TS2G~16GCF300 Attribute Memory Read Timing Specification Attribute Memory access time is defined as 300 ns. Detailed timing specs are shown in Table below Speed Version 300 ns Item Symbol IEEE Symbol Min ns. Max ns. Read Cycle Time tc(R) tAVAV 300 Address Access Time ta(A) tAVQV 300 Card Enable Access Time ta(CE) tELQV 300 Output Enable Access Time ta(OE) tGLQV 150 Output Di
