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STK11C88 Table 2. Software STORE/RECALL Mode Selection A – A Mode IO Notes CE WE 13 0 [1, 2] L H 0x0E38 Read SRAM Output Data 0x31C7 Read SRAM Output Data 0x03E0 Read SRAM Output Data 0x3C1F Read SRAM Output Data 0x303F Read SRAM Output Data 0x0FC0 Nonvolatile STORE Output Data [1, 2] L H 0x0E38 Read SRAM Output Data 0x31C7 Read SRAM Output Data 0x03E0 Read SRAM Output Data 0x3C1F Read SRAM Output Data 0x303F Read SRAM Output Data 0x0C63 Nonvolatile RECALL Output Data Notes 1. The six consecut
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STK11C88 Voltage on DQ ...................................–0.5V to Vcc + 0.5V Maximum Ratings 0-7 Power Dissipation ......................................................... 1.0W Exceeding maximum ratings may shorten the useful life of the DC Output Current (1 output at a time, 1s duration).... 15 mA device. These user guidelines are not tested. Storage Temperature .................................–65 °C to +150 °C Operating Range Temperature under bias ..............................–55 °C to +1
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STK11C88 Capacitance [4] In the following table, the capacitance parameters are listed. Parameter Description Test Conditions Max Unit C Input Capacitance T = 25 °C, f = 1 MHz, 5pF IN A V = 0 to 3.0 V CC C Output Capacitance 7 pF OUT Thermal Resistance [4] In the following table, the thermal resistance parameters are listed. 28-SOIC 28-SOIC Parameter Description Test Conditions Unit (300 mil) (330 mil) Θ Thermal Resistance Test conditions follow standard test methods and TBD TBD °C/W JA (Juncti
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STK11C88 AC Switching Characteristics SRAM Read Cycle Parameter 25 ns 45 ns Description Unit Cypress Alt Min Max Min Max Parameter t t Chip Enable Access Time 25 45 ns ACE ELQV [5] t t t Read Cycle Time 25 45 ns RC AVAV, ELEH [6] t t Address Access Time 25 45 ns AA AVQV t t Output Enable to Data Valid 10 20 ns DOE GLQV [6] t t Output Hold After Address Change 5 5 ns OHA AXQX [7] t t Chip Enable to Output Active 5 5 ns LZCE ELQX [7] t t Chip Disable to Output Inactive 10 15 ns HZCE EHQZ [7] t t
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STK11C88 SRAM Write Cycle Parameter 25 ns 45 ns Description Unit Cypress Alt Min Max Min Max Parameter t t Write Cycle Time 25 45 ns WC AVAV t t t Write Pulse Width 20 30 ns PWE WLWH, WLEH t t t Chip Enable To End of Write 20 30 ns SCE ELWH, ELEH t t t Data Setup to End of Write 10 15 ns SD DVWH, DVEH t t t Data Hold After End of Write 0 0 ns HD WHDX, EHDX t t t Address Setup to End of Write 20 30 ns AW AVWH, AVEH t t t Address Setup to Start of Write 0 0 ns SA AVWL, AVEL t t t Address Hold Aft
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STK11C88 STORE INHIBIT or Power Up RECALL STK11C88 Parameter Alt Description Unit Min Max [10] t t Power up RECALL Duration 550 μs HRECALL RESTORE [6] t t STORE Cycle Duration 10 ms STORE HLHZ V Low Voltage Reset Level 3.6 V RESET V Low Voltage Trigger Level 4.0 4.5 V SWITCH Switching Waveforms Figure 9. STORE INHIBIT/Power Up RECALL V CC 5V V SWITCH V RESET STORE INHIBIT POWER-UPRECALL t HRECALL DQ (DATA OUT) POWER-UP BROWN OUT BROWN OUT BROWN OUT RECALL STORE INHIBIT STORE INHIBIT STORE INH
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STK11C88 Software Controlled STORE/RECALL Cycle [11, 12] The software controlled STORE/RECALL cycle follows. 25 ns 45 ns Parameter Alt Description Unit Min Max Min Max t t STORE/RECALL Initiation Cycle Time 25 45 ns RC AVAV [11] t t Address Setup Time 0 0 ns SA AVEL [11] t t Clock Pulse Width 20 30 ns CW ELEH [11] t t Address Hold Time 20 20 ns HACE ELAX [11] RECALL Duration 20 20 μs t RECALL Switching Waveforms [12] Figure 10. CE Controlled Software STORE/RECALL Cycle t t RC RC ADDRESS # 1
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STK11C88 Part Numbering Nomenclature STK11C88 - N F 25 I TR Packaging Option: TR = Tape and Reel Blank = Tube Temperature Range: Blank - Commercial (0 to 70°C) I - Industrial (-40 to 85°C) Speed: 25 - 25 ns 45 - 45 ns Lead Finish F = 100% Sn (Matte Tin) Package: N = Plastic 28-pin 300 mil SOIC S = Plastic 28-pin 330 mil SOIC Ordering Information Speed Operating Ordering Code Package Diagram Package Type (ns) Range 25 STK11C88-NF25TR 51-85026 28-Pin SOIC (300 mil) Commercial STK11C88-NF25 51-85
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STK11C88 Package Diagrams Figure 11. 28-Pin (300 mil) SOIC (51-85026) NOTE : PIN 1 ID 1. JEDEC STD REF MO-119 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT DOES INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE. 14 1 MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE 3. DIMENSIONS IN INCHES MIN. MAX. 0.291[7.39] 4. PACKAGE WEIGHT 0.85gms 0.300[7.62] * 0.394[10.01] 0.419[10.64] PART # 15 28 0.026[0.66] S28.3 STANDARD PKG. 0.032[0.81] S
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STK11C88 Package Diagrams (continued) Figure 12. 28-Pin (330 mil) SOIC (51-85058) 51-85058-*A Document Number: 001-50591 Rev. ** Page 14 of 15 [+] Feedback
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STK11C88 Document History Page Document Title: STK11C88 256 Kbit (32K x 8) SoftStore nvSRAM Document Number: 001-50591 Orig. of Submission Rev. ECN No. Description of Change Change Date ** 2625096 GVCH/PYRS 12/19/08 New data sheet Sales, Solutions and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at cypress.com/sales. Products
