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INTEGRATED CIRCUITS
DATA SHEET
TDA7056A
3 W BTL mono audio output
amplifier with DC volume control
July 1994
Product specificiation
File under Integrated Circuits, IC01
Resumo do conteúdo contido na página número 2
Philips Semiconductors Product specificiation 3 W BTL mono audio output amplifier TDA7056A with DC volume control FEATURES GENERAL DESCRIPTION • DC volume control The TDA7056A is a mono BTL output amplifier with DC volume control. It is designed for use in TV and monitors, • Few external components but also suitable for battery-fed portable recorders and • Mute mode radios. • Thermal protection Missing Current Limiter (MCL) • Short-circuit proof • No switch-on and off clicks A MCL protection circu
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Philips Semiconductors Product specificiation 3 W BTL mono audio output amplifier with TDA7056A DC volume control V P handbook, full pagewidth 2 1 n.c. TDA7056A 9 n.c. I + i 6 positive output 3 positive input 5 DC volume control I – i 8 negative output STABILIZER TEMPERATURE V PROTECTION ref 4 7 MGA072 - 1 signal power ground ground Fig.1 Block diagram. PINNING SYMBOL PIN DESCRIPTION n.c. 1 not connected handbook, halfpage V 2 positive supply voltage n.c. 1 P V 3 voltage input I V 2 P GND1
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Philips Semiconductors Product specificiation 3 W BTL mono audio output amplifier with TDA7056A DC volume control FUNCTIONAL DESCRIPTION Thus, a reduced power supply and smaller capacitors can be used which results in cost savings. The TDA7056A is a mono BTL output amplifier with DC For portable applications there is a trend to decrease the volume control, designed for use in TV and monitor but supply voltage, resulting in a reduction of output power at also suitable for battery-fed portable recor
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Philips Semiconductors Product specificiation 3 W BTL mono audio output amplifier with TDA7056A DC volume control CHARACTERISTICS V = 12 V; f = 1 kHz; R = 16 Ω; T = 25 °C; unless otherwise specified (see Fig.6) P L amb SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V positive supply voltage range 4.5 - 18 V P I total quiescent current V = 12 V; R = ∞; note 1 - 816 mA P P L Maximum gain (V = 1.4 V) 5 P output power O THD = 10%; R = 16 Ω 3 3.5 - W L THD = 10%; R = 8Ω- 5.2 - W L THD total harmonic di
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Philips Semiconductors Product specificiation 3 W BTL mono audio output amplifier with TDA7056A DC volume control MGA075 MGA076 - 1 1000 40 handbook, halfpage handbook, halfpage gain V noise (dB) (μV) 20 800 0 600 – 20 400 – 40 200 – 60 0 – 80 0 0.4 0.8 1.2 1.6 2.0 0 0.4 0.8 1.2 1.6 2.0 V (V) V (V) 5 5 Fig.4 Noise output voltage as a function of DC Fig.3 Gain as a function of DC volume control. volume control. MGA077 - 1 100 handbook, halfpage I 5 (μA) 60 20 – 20 – 60 – 100 0 0.4 0.8 1.2 1.6 2.0
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Philips Semiconductors Product specificiation 3 W BTL mono audio output amplifier with TDA7056A DC volume control APPLICATION INFORMATION (1) V P handbook, full pagewidth 100 220 μF nF 2 1 n.c. 9 TDA7056A n.c. I + i 6 0.47 μF positive 3 input 5 R = 16 Ω L I – i 8 5 R S kΩ STABILIZER TEMPERATURE V PROTECTION ref DC volume 4 7 control MGA073 - 1 ground (1) This capacitor can be omitted if the 220 μF electrolytic capacitor is connected close to pin 2. Fig.6 Test and application diagram.
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Philips Semiconductors Product specificiation 3 W BTL mono audio output amplifier with TDA7056A DC volume control PACKAGE OUTLINE SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1 D D 1 q A P P 2 1 A 3 q 2 q 1 A A 4 E pin 1 index c L 19 b Z e Q b w M 2 b 1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) (1) A 2 Z (1) (1) UNIT A Abc b b D D E eL P P Q q q q w A 3 4 1 2 1 1 1 2 max. max. 18.5 8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48 3.9 2.75 3.4 1.75 15.1
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Philips Semiconductors Product specificiation 3 W BTL mono audio output amplifier with TDA7056A DC volume control SOLDERING The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the Introduction specified maximum storage temperature (T ). If the stg max printed-circuit board has been pre-heated, forced cooling There is no soldering method that is ideal for all IC may be necessary immediately after soldering to keep the packages. Wave soldering i
