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DISCRETE SEMICONDUCTORS
DATA SHEET
handbook, halfpage
M3D167
BGY2016
UHF amplifier module
Product specification 2000 Oct 17
Supersedes data of 2000 Jan 04
Resumo do conteúdo contido na página número 2
Philips Semiconductors Product specification UHF amplifier module BGY2016 FEATURES PINNING - SOT365A • 26 V nominal supply voltage PIN DESCRIPTION • 16 W output power into a load of 50 Ω with an RF drive 1 RF input power of ≤20 mW. 2V S1 3V S2 APPLICATIONS 4 RF output • Base station transmitting equipment operating in the Flange ground 1805 to 1990 MHz frequency band. DESCRIPTION The BGY2016 is a three-stage UHF amplifier module in a handbook, halfpage SOT365A package with a plastic cap. It consis
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Philips Semiconductors Product specification UHF amplifier module BGY2016 CHARACTERISTICS T =25 °C; V =5V; V = 26 V; P = 16 W; Z =Z =50 Ω unless otherwise specified. mb S1 S2 L S L SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT f frequency 1805 - 1990 MHz I supply current - 80 - mA S1 I supply current P < - 60 dBm - 430 - mA S2 D P load power P <20mW 16 -- W L D G power gain 28 - 35 dB p ΔG in band gain variation f = 1805 to 1880 MHz; P =5W -- 2dB p L f = 1930 to 1990 MHz; P =5W -- 2dB L ⎪G -G ⎪ g
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Philips Semiconductors Product specification UHF amplifier module BGY2016 APPLICATION INFORMATION handbook, full pagewidth C7 C8 C5 C6 Z R1 L1 R2 L2 Z 1 2 C3 C4 C1 C2 50 Ω V V 50 Ω S1 S2 input output MGM861 Fig.2 Test circuit. List of components (See Figs 2 and 3) COMPONENT DESCRIPTION VALUE CATALOGUE NO. C1, C2 electrolytic capacitor 10 μF; 35 V - C3, C4 multilayer ceramic chip capacitor 10 nF; 50 V - C5, C6 multilayer ceramic chip capacitor 100 pF; 50 V - C7, C8 multilayer ceramic chip capacito
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Philips Semiconductors Product specification UHF amplifier module BGY2016 90 handbook, full pagewidth 42 C7 C8 C5 C6 R1 L1 L2 R2 C3 C4 Z Z 2 1 C1 C2 MGM862 output V V input S1 S2 Dimensions in mm. Fig.3 Printed-circuit board component layout. 2000 Oct 17 5
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Philips Semiconductors Product specification UHF amplifier module BGY2016 MOUNTING RECOMMENDATIONS The module should be mounted to the heatsink using 3 mm bolts with flat washers. The bolts should first be To ensure a good thermal contact and to prevent tightened to “finger tight” and then further tightened in mechanical stress when bolted down, the flatness of the alternating steps to a maximum torque of 0.4 to 0.6 Nm. mounting base is designed to be typically better than 0.1 mm. The mounting are
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Philips Semiconductors Product specification UHF amplifier module BGY2016 PACKAGE OUTLINE Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads SOT365A D A F y U q A U 2 p U E 1 L 1234 b w M v c A p e e e Z Q 1 0 10 20 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b c D E e e Fp L Qq U U U vw y Z p 1 1 2 9.5 0.56 4.0 0.3 30.1 18.6 3.25 6.5 4.1 40.74 48.0 15.4 7.75 12.8 mm 2.54 17.78 0.3 0.25 0.1 9.0 0.46 0.2 29.9 18.4 3.15 6.1 3.9 3.8 40.54
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Philips Semiconductors Product specification UHF amplifier module BGY2016 DATA SHEET STATUS PRODUCT (1) DATA SHEET STATUS DEFINITIONS STATUS Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right t
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Philips Semiconductors Product specification UHF amplifier module BGY2016 NOTES 2000 Oct 17 9
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Philips Semiconductors Product specification UHF amplifier module BGY2016 NOTES 2000 Oct 17 10
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Philips Semiconductors Product specification UHF amplifier module BGY2016 NOTES 2000 Oct 17 11
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