Manual do usuário HP (Hewlett-Packard) Hewlett-Packard450 G1

Resumo do conteúdo contido na página número 1

Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP ProBook 450 G1 Notebook PC




Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical

Resumo do conteúdo contido na página número 2

refractory ceramic fibers Components, parts and materials containing NO 0 radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Description #1 Cross screwdriver #1 Description #2 P1 screwdriver #1 Description #3 Description #4 Description #5 3

Resumo do conteúdo contido na página número 3

Disassembly Process-1 Take off the battery package from system bottom side. Release DIMM/HDD door knob and take off DIMM/HDD door. + Loose HDD & ODD module screws and take off HDD & ODD module from system. Loose WLAN/WWAN screws and take off WLAN/WWAN,DIMM module from system.

Resumo do conteúdo contido na página número 4

Disassembly Process-2 + Loose KB module screw, and then take off KB module. + Loose L-case to U-case screws on bottom side & U-case to L-case screw on top side, and take off U-case from system.

Resumo do conteúdo contido na página número 5

Disassembly Process-3 + Loose the screw of the speaker ,power board, function board, touchpad module, FPR, SD board ,and USB board then take off them. Loose screw of hinge to L-case, take off LCD module from L-case.

Resumo do conteúdo contido na página número 6

Disassembly Process-4 + Loose screw of MB to U-case, take off MB. Loose screw of thermal module from MB, take off thermal module

Resumo do conteúdo contido na página número 7

Disassembly Process-5 + Loose screw and screw mylar, take off hinge cover and lcd bezel. Loose LCD & Hinge screw, take off LCD , hinge and panel.