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AMD CrossFire™ Series Chipset
Packaging and Branding Guidelines
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Introduction Your Guide to Consistent Marketing and Packaging Guidelines These guidelines are intended to assist you in creating powerful marketing for your products that use the newly rebranded AMD CrossFire™ Series chipset products. By using these guidelines you will generate greater interest in your products and affinity with your audiences. The following pages offer resources and guidelines for creating compelling packaging and marketing materials that effectively align with CrossFire.
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Summary of All Products Belonging to the AMD CrossFire™ Series Chipset The list below summarizes the CrossFire™ Chipset product offering for the AMD platform BRAND NAMES ASIC Variant Platform Chipset RD480 DT AMD 480X RD550 DT AMD 550X RD580 DT AMD 580X A M D 5 8 0 X Master Logic Multi Brand GPU 3 AMD CrossFire Chipset
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Section 1 Logos and Text Treatment 4 AMD CrossFire Chipset
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Logos and Text Treatment Logos and text treatments lend brand value to your marketing and packaging. By including these graphic elements in your packaging, you create immediate awareness and connection with your audience. This guide outlines the proper usage of all AMD Chipset logos. All logos must be used as is and cannot be altered in any way. If there are any questions regarding these logo or brand identity guidelines, please contact your regional partner marketing manager. 5 AMD CrossFire
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Logos and Text Treatment AMD should be in full caps. All AMD Chipset and product feature names should be spelled out in lower case with the first letter capitalized. Do not spell the entire product or product feature name in capital letters only. For ‘CrossFire’, ‘C’and ‘F’are in capital letters and should be followed by “TM”. Correct Examples Incorrect Examples AMD 580X CrossFire™ Chipset AMD 480X CROSSFIRE™ Chipset AMD 580X CrossFire™ Chipset Amd 480X Crossfire™ Chipset AMD 580X CrossFire
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Logos and Text Treatment Use of trademark “™” and “®” COPY In all copy, the applicable trademark notice must be used beside all product and product feature names used in: (i) all headlines; and (ii) the first use of the product or product feature name in the text. PACKAGING The applicable trademark notice must be used beside all product names prominently featured (greater than 2X text size) on the packaging. For all packaging copy, the applicable trademark notice must be used beside the fir
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Logos and Text Treatment Using AMD CrossFire Chipset Logos Use AMD CrossFire Chipset logos when promoting motherboards or systems with these chipset. The logos must be used in the following applications: • On the heat sink for Northbridge. (Logo on the Southbridge is optional) • On the PC boot up screen (BIOS Splash) • On retail packaging • Advertising and promotional material (print and online) 8 AMD CrossFire Chipset
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Logos and Text Treatment This logo is used on the Northbridge and or Southbridge on the Motherboard heat sink File name: _HS.eps These logos are used on the PC boot up Screen (BIOS Splash), for motherboard packaging (see packaging guidelines for more details), advertisement, collateral material etc. Logo Use File name: Splash Screen _BIOS.bmp Print/Package _PRINT.eps Web/Electronic _GP 9 AMD CrossFire Chipset
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Logos and Text Treatment Requirements for BIOS Splash Screen Logo The BIOS Splash screen logo must be placed either in the center of the monitor or the upper top left-hand corner of the screen The logo must be no smaller than 2 inches in width (length to be proportional) The logo must be present for a minimum of 2 seconds 2 inches 10 AMD CrossFire Chipset
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Section 2 Packaging Guidelines 11 AMD CrossFire Chipset
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Packaging Guidelines These packaging standards have been developed to provide consistent brand recognition for the logo established for all AMD products, and to more clearly communicate the consumer benefits of AMD products. Please follow these guidelines for all motherboard packaging with the AMD CrossFire chipset product line. 12 AMD CrossFire Chipset
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Packaging Guidelines Mandatory Box Layout Requirements: There is only one mandatory element for all partner packaging: The AMD CrossFire Chipset product logo MUST be on the front and back panels of the retail box. This elements must be reproduced without variation in the positions identified. Partner artwork can then be placed in the grey zones of the marked illustration below. 13 AMD CrossFire Chipset
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Packaging Guidelines Other Mandatory Requirements: 1. The proportion of logo size to package area shown must be maintained (see below) 2. To ensure sufficient visibility, an unobstructed area should surround the Chipset badge logo. 3. The ™ should be placed after CrossFire. The ™ must always appear at least once. 4. Pantone color 347 is always used for AMD green. Pantone color 185 is always used for CrossFire red. 5. Partners must include the following standard legal line on all packaging o
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Packaging Guidelines Logo Sizing Requirements 1. Logo must be 0.375” away from box edge and other logos. 2. The logo must be at least 2” wide. 2” 0.375” 15 AMD CrossFire Chipset
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Packaging Guidelines Incorrect Use of Chipset Package Art Template 1. The chipset badge logo is not placed on the front/top side of the packaging 2. The badge is two small, not meeting the 2” wide criteria 3. Partners may not add unauthorized numeric or alphabetical extensions after the Chipset technology brand name. e.g. AMD 580X Pro Lite etc. 4. The Chipset badge cannot be place in alternative locations on a partner pack 2” 16 AMD CrossFire Chipset
