Instrukcja obsługi Toshiba 3 Tb 3.5 MG03ACA300

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Media Advisory


Toshiba Announces Availability of Latest Enterprise-Class HDDs and SSDs
High capacity HDDs and SSDs address capacity, performance and efficiency
demands of data-intensive enterprise and cloud storage applications

The accompanying image can be downloaded at:
www.pinnaclecrc.com/PR_PICTURES/Toshiba/6347/

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Düsseldorf, Germany, 22 May, 2013 – Toshiba – the inventor of NAND Flash memory -
has announced full European availability of its latest Enterprise-class PX02S

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Media Advisory is available with capacities of 1TB (MG03ACA100), 2TB (MG03ACA200), 3TB (MG03ACA300) and 4TB (MG03ACA400). The MG03SCAx series is fitted with a SAS interface and is also available with capacities of 1TB (MG03SCA100), 2TB (MG03SCA200), 3TB (MG03SCA300) and 4TB (MG03SCA400). These new devices aim to provide organizations with ability to meet the capacity, security and efficiency challenges of the cloud computing and big data revolutions that are expected to transform t

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Media Advisory SSD Specifications Model Number PX02SMF020 PX02SMF040 PX02SMF080 PX02SMB160 Functional Specifications Formatted Storage 200GB 400GB 800GB 1.6TB Capacity NAND 24nm eMLC (64GB/die) Interface SAS 6.0/12 Gbps Performance: Random Read 120,000 IOPS (4KiB) Random Write 25,000 IOPS (4KiB) Sequential Read 900 MiB/s (64 KiB) Sequential Write 400 MiB/s (64 KiB) Physical Specifications Form factor 2.5 inch Height 7mm 7mm 7mm 15mm Width 69.85 mm Depth 100.45

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Media Advisory HDD Specifications Model Number SATA 2.6/3.0 MG03ACA100 MG03ACA200 MG03ACA300 MG03ACA400 Interface SAS 2.0 Interface MG03SCA100 MG03SCA200 MG03SCA300 MG03SCA400 Functional Specifications Formatted Storage 1TB 2TB 3TB 4TB Capacity Rotational Speed 7,200 rpm Interface Speed 1.5, 3.0, 6.0 Gbps Data Buffer Size 64 MiB Logical Data Block 512 Byte Physical Specification Form factor 3.5 inch Height 26.1mm Width 101.6 mm Depth 147 mm Weight (max.) 720g Aco

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Media Advisory About Toshiba Electronics Europe Toshiba Electronics Europe (TEE) is the European electronic components business of Toshiba Corporation, which is ranked among the world’s largest semiconductor vendors. TEE offers one of the industry's broadest IC and discrete product lines including high-end memory, microcontrollers, ASICs and ASSPs for automotive, multimedia, industrial, telecoms and networking applications. The company also has a wide range of power semiconductor solu