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User’s Guide
1998 Mixed-Signal Products
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TPA311 Audio Power Amplifier Evaluation Module User’s Guide SLOU013 February 1998 Printed on Recycled Paper
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IMPORTANT NOTICE Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current. TI warrants performance of its semiconductor products and related software to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testi
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Preface Related Documentation From Texas Instruments TI Plug-N-Play Audio Amplifier Evaluation Platform (literature number SLOU011) provides detailed information on the evaluation platform and its use with TI audio evaluation modules. TPA311 350-mW LOW-VOLTAGE AUDIO POWER AMPLIFIER (literature number SLOS207) This is the data sheet for the TPA311 audio amplifier integrated circuit. FCC Warning This equipment is intended for use in a laboratory test environment only. It generates, uses, and c
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If You Need Assistance If You Need Assistance. . . If you want to. . . Do this. . . † Request more information about Call the PIC hotline: Texas Instruments Digital Signal (972) 644–5580 Processing (DSP) products Or send a fax to the PIC: (972) 480–7800 Or write to: Texas Instruments Incorporated Product Information Center, MS 3123 P.O. Box 660246 Dallas, Texas 75266 † Order Texas Instruments docu- Call the PIC hotline: mentation (972) 644–5580 † Ask questions about product op- Call the PIC hotl
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Running Title—Attribute Reference Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.1 Feature Highlights . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3 1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4 1.3 TPA3
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Running Title—Attribute Reference Figures 1–1 The TI TPA311 Audio Amplifier Evaluation Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4 2–1 Quick Start Platform Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 2–2 Quick Start Module Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4 3–1 The TI Plug-N-Play Audio Amplifier Evaluation Platfo
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Chapter 1 Introduction This chapter provides an overview of the Texas Instruments (TI) TPA311 Audio Amplifier Evaluation Module (SLOP116). It includes a list of EVM features, a brief description of the module illustrated with a pictorial diagram, and a list of EVM specifications. Topic Page 1.1 Feature Highlights 1–3 1.2 Description 1–4 1.3 TPA311 EVM Specifications 1–4 Introduction 1-1
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1-2 Introduction
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Feature Highlights 1.1 Feature Highlights The TI TPA311 Audio Amplifier Evaluation Module and the TI Plug-N-Play Audio Amplifier Evaluation Platform include the following features: TPA311 Low-Voltage Audio Power Amplifier Evaluation Module Single channel, bridge-tied load (BTL) or single-ended operation 3.3-V and 5-V operation 350 mW output power into 8 W at 5 V, BTL Ultra-low current consumption in shutdown/mute mode Internal thermal and short-circuit protection Module gain adjust
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Description 1.2 Description The TPA311 Audio Power Amplifier Evaluation Module is a complete, low- power single-channel audio power amplifier. It consists of the TI TPA311 350-mW Low-Voltage Audio Power Amplifier IC along with a small number of other parts mounted on a circuit board that is approximately one and a quarter inches square (Figure 1–1). Figure 1–1. The TI TPA311 Audio Amplifier Evaluation Module VDD GND Shutdown –3 C5 S1 C3 009227 OUT– R1 GND C2 R5 OUT+ U1 C4 Literature # R3 SE\BTL*
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Chapter 2 Quick Start The steps in this chapter can be followed to quickly prepare the TPA311 audio amplifier EVM for use. While using the TPA311 with the TI Plug-N-Play Audio Amplifier Evaluation Platform is a quick and easy way to connect power, signal and control inputs, and signal outputs to the EVM using standard connectors, the audio amplifier evaluation module can be used stand-alone by making connections directly to the module pins, and can be wired directly into existing circuits or e
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+ J6 VDD VR2 J10 In/Out +– Right +– Left F2 Left J8 Right J9 J7 Out Out Out Out Spk(U2-U4) C3 C2 JP8 U6 JP6 LED2 + + POWER VDD JP7 U2 HP(U5) SUPPLY S3 U2-U4 HP Source U5 U3 U4 JP5 U5 IDD B1 Off On On S1 TP1 S2 Conditioning GND Off Pwr U1 LED1 VCC JP3 Batt D1 JP2 AC/DC D2 (J2) JP1 VCC(J1) D3 TEXAS DC J3 J5 J4 INSTRUMENTS SOURCE Right Stereo Left 1997 J1 In In In D4 J2 VCC In AC/DC + In Precautions 2.1 Precautions Power Supply Input Polarity and Maximum Voltage Always ensure that the polarity and
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Quick Start List for Platform 2.2 Quick Start List for Platform Use the following steps when using the TPA311 EVM with the TI Plug-N-Play Audio Amplifier Evaluation Platform (see the platform user’s guide, SLOU011, for additional details). Numbered callouts for selected steps are shown in Figure 2–1 and details appear in Chapter 3. Platform preparations 1) Ensure that all external power sources are set to OFF and that the platform power switch S1 is set to OFF 2) Install a TPA311 module in pla
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Quick Start List for Stand-Alone 2.3 Quick Start List for Stand-Alone Use the following steps to use the TPA311 EVM stand-alone or when connecting it into existing circuits or equipment. Connections to the TPA311 module header pins can be made via individual sockets, wire-wrapping, or soldering to the pins, either on the top or the bottom of the module circuit board. Numbered callouts for selected steps are shown in Figure 2–2 and details appear in Chapter 3. Figure 2–2. Quick Start Module Map 2
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Chapter 3 Details This chapter provides details on the TPA311 IC, the evaluation module, and the steps in the Quick-Start List, additional application information, and a parts list for the TPA311 evaluation module. Topic Page 3.1 Precautions 3–2 3.2 The TPA311 Audio Power Amplifier Evaluation Module 3–3 3.2.1 TPA311 Audio Amplifier IC 3–4 3.2.2 BTL Operation 3–4 3.2.3 Single-Ended Operation 3–5 3.2.4 Module Gain 3–5 3.2.5 Shutdown 3–5 3.3 Using The TPA311 EVM With The Plug-N-Play Evaluation Pl
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+ J6 VDD VR2 J10 In/Out +– Right +– Left F2 J8 Left Right J9 J7 Out Out Out Out Spk(U2-U4) C3 C2 JP8 U6 JP6 LED2 + + POWER VDD JP7 U2 HP(U5) SUPPLY S3 U2-U4 HP Source U5 U3 U4 JP5 U5 IDD B1 Off On On S1 TP1 S2 Conditioning GND Off Pwr U1 LED1 VCC JP3 Batt D1 JP2 AC/DC D2 (J2) JP1 VCC(J1) D3 TEXAS DC J3 J5 J4 INSTRUMENTS SOURCE Right Stereo Left 1997 J1 In In In D4 J2 VCC In AC/DC + In Precautions 3.1 Precautions Power Supply Input Polarity and Maximum Voltage Always ensure that the polarity and
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The TPA311 Audio Power Amplifier Evaluation Module 3.2 The TPA311 Audio Power Amplifier Evaluation Module The TPA311 Audio Power Amplifier Evaluation Module is powered by a TPA311 350-mW Low-Power Audio Amplifier IC and includes on-board gain adjustment, a shutdown control signal input with on-board switch, and can be operated in either the BTL or single-ended output mode. The module can be used with the TI Plug-N-Play Audio Amplifier Evaluation Platform (Figure 3–1) or wired directly into circu
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The TPA311 Audio Power Amplifier Evaluation Module 3.2.1 TPA311 Audio Amplifier IC The TPA311 audio amplifier IC is a CMOS device intended primarily for bridge-tied load (BTL) operation in battery-powered applications. It is supplied in a very small surface-mount package and has been designed to operate from low supply voltages (between approximately 2 V and 5.5 V) and deliver up to approximately 350 mW into an 8-W , BTL (Figure 3–4). Typical applications include portable phones, toys, games, an
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The TPA311 Audio Power Amplifier Evaluation Module 3.2.3 SIngle-Ended Operation For single-ended operation, the module SE/BTL control input pin must be held high. The speaker (or headphone) load is connected to the module OUT+ output pin through a coupling capacitor, and to platform/system ground. A 470-m F electrolytic coupling capacitor is provided on the platform in the signal path to the headphone output jack for this purpose and a control signal from the platform headphone jack can be route
