Streszczenie treści zawartej na stronie nr. 1
BE-IR30 / 31
Infrared B/W Camera Module
Operation Guide
Please read this operation Guide carefully for proper operation, and keep it for future refernce.
Streszczenie treści zawartej na stronie nr. 2
Table of Contents 1. Introduction 2 2. General 2 3. Composition 2 4. Specifications 2 5. Notes to users 5 6. External view 7 7. Optical dimensions 9 8. Installation 10 9. Typical connection 11 10 External sync (BE-IR31) 13 11 Function settings and changes 11-1 AGC on / off 14 11-2 Gamma response 15 11-3 Auto electronic shutter on / off 16 11-4 Changes to fixed shutter mode 17 11-5 BE-IR30 external sync 18 11-6 BE-IR31 internal sync 19 11-7 HD and VD outp
Streszczenie treści zawartej na stronie nr. 3
1. Introduction Thank you very much for your purchase of the Hitachi BE-IR30/31 Black and White Camera Module. Prior to using this camera , read this manual carefully. 2. General The BE-IR30/31 is a monochrome camera module featuring sensitivity in the near infrared spectrum using a 1/3-inch size CCD imaging device. Resolution is outstanding, while the very small size provides optimum suitability for incorporation into equipment where space is limited. Model coding BE-IR3 Signal system N: E
Streszczenie treści zawartej na stronie nr. 4
4． ． ． ．Specifications 2) Sensing area EIA : 6.00(H) 4.96(V)mm CCIR : 6.00(H) 4.96(V)mm 3) Signal format Conforming to EIA or CCIR. 4) Scanning system 2:1 interlaced 5) Hor. scanning frequency EIA : 15.734 kHz CCIR : 15.625 kHz 6) Vert. scanning frequency EIA : 59.94 Hz CCIR : 50 Hz 7) Sync system BE-IR30 : Internal sync BE-IR31 : External sync 8) External sync input HD & VD : 5V peak-to-peak negative Ω Input impedance : 1k ± Frequency deviation : 1% Ω 9) Video outpu
Streszczenie treści zawartej na stronie nr. 5
4． ． ． ．Specifications 21) Standard lens f3.8 (BE-IR30B/31B only) Focal distance f 3.8 mm F value 2.0 Picture angle H 70.9 V 52.9 21) Dimensions BE-IR30A/31A: 34 (W) × 34 (H) × 20 (D) mm BE-IR30B/31B: 34 (W) × 34 (H) × 32 (D) mm (less lens) BE-IR30C/31C: 34 (W) × 34 (H) × 24 (D) mm 22) Mass BE-IR30A/31A: Approx. 15g (less cable) BE-IR30B/31B: Approx. 26g (including cable, less lens) BE-IR30C/31C: Approx. 19g (less cable) 23) Options • BE-IR30A/31A mount adapter (LA-IR20) • BE-IR30B/31B l
Streszczenie treści zawartej na stronie nr. 6
5. Notes to users Power supply Connect a 9V DC voltage (8.5 to 9.5V) from an external regulated DC power supply. Use a stable power supply without ripple and noise. Prior to turning on the power switch , check that the polarities of the power cable are correct , referring to the connection diagram (Page 11 , 12) To protect CCD (sensor) Do not touch the glass surface of the CCD sensor to avoid deterioration in picture quality due to dirt and scratches. If the glass surface of the senso
Streszczenie treści zawartej na stronie nr. 7
5. Notes to users Phenomena inherent to CCD imaging device Following are phenomena inherent to a CCD imaging device , and not defects. Smear and blooming When strong light (lamp , fluorescent lamp , reflected light , etc.) is shot , pale bands are displayed vertically above and below the light. In this case , change the angle of the camera so that such strong light does not enter the camera through the lens. Fixed pattern noise When the camera is operated in a high temperatur
Streszczenie treści zawartej na stronie nr. 8
6. External view BE-IR30B/31B BE-IR30 / 31 7
Streszczenie treści zawartej na stronie nr. 9
6. External view BE-IR30C/31C BE-IR30 / 31 8
Streszczenie treści zawartej na stronie nr. 10
6. External view BE-IR30A/31A 7. Optical dimensions Lens Lens-mount 19.2 ± 0.5 (C-mount) Extension of optical path due CCD 1.4 ± 0.2 to the thickness of CCD glass is considered. Base plate Imaging face BE-IR30 / 31 9
Streszczenie treści zawartej na stronie nr. 11
8. Installation When installing the camera in a housing or unit of equipment, secure with two M2 screws inserted into the 2.5 mm diameters holes of the SENS board base plate. Two 2.5 mm Dia. SENS board 1. Use the SENS board holds to install the camera. Avoid using only the Main board, due to risk of damage to the board connector. Notes : 2. Avoid unnecessary stress on the printed board when engaging and disengaging the connectors. 3. The screws securing the base plate and SENS board protr
Streszczenie treści zawartej na stronie nr. 12
9. Typical connection BE-IR30 Image processor or Connector Video monitor B7B-ZR (Note 1) Housing ZHR-7 BLK YEL GRN Regulated power supply (More then 300 mA) RED Note1 : • When more than one video monitor is connected in series , set the 75Ω termination switch on the last unit to ON. DC9V Note2 : • Supply voltage range : 8.5 to 9.5V (Note 2) • Be sure to check the polarities of the power source before turning on the external DC power supply. BE-IR30 / 31 11
Streszczenie treści zawartej na stronie nr. 13
9. Typical connection BE-IR31 Image processor or Connector Video monitor B7B-ZR (Note 1) Housing ZHR-7 BLK YEL GRN Regulated power supply (More then 300 mA) RED HD VD External sync signal GND Note1 : • When more than one video monitor is connected in DC9V series , set the 75Ω termination switch on the last unit (Note 2) to ON. Note2 : • Supply voltage range : 8.5 to 9.5V • Be sure to check the polarities of the power source before turning on the external DC power sup
Streszczenie treści zawartej na stronie nr. 14
10. External sync (BE-IR31) Supply sync signals (HD and VD) for BE-IR31 operation. Refer to connection on page 12. Horizontal and vertical drive signal inputs HD EIA: f(H) = 15.734 kHz 1 % VD EIA: f(V) = 59.94 Hz (f(V) = f(H) 262.5) Input level HD 4 to 6 Vp-p negative VD 4 to 6 Vp-p negative Input impedance 1 k Drive signal input waveform Vertical drive signal (VD) Horizontal drive signal (HD) T=1/f(H) T=1/f(V) 4 6Vp-p 4 6Vp-p Approx. 6.7µ s Approx. 0.6ms HD and VD
Streszczenie treści zawartej na stronie nr. 15
11. Function setting and changes When changing the function settings , perform the work with thorough care. Be sure to use anti-static measures such as a grounding band. Also observe safety precautions when soldering to avoid burn and fire hazards. Hitachi Denshi assumes on liability for damage or injury resulting from such work. Since the function setting can be provided at the time of shipment , consult a Hitachi Denshi representative. 11-1 AGC on / off Factory setting is AGC off (fixed g
Streszczenie treści zawartej na stronie nr. 16
11. Function setting and changes 11-2 Gamma response The factory setting is gamma on. If necessary , the gamma response can be changed as follows. Change the gamma response by changing the chip part. Gamma(γ)response R217 R218 R219 ON Absent 0Ω 0Ω Factory setting OFF 0Ω Remove Remove 0Ω : Part code RME1784 Description ERJ3GEYJ0R00V Location of chip capacitors (Main board side B) BE-IR30 / 31 15
Streszczenie treści zawartej na stronie nr. 17
11. Function setting and changes 11-3 Auto electronic shutter on / off Factory setting for auto electronic shutter is off. If necessary , it can be set to on. Absent the R259 , R260 chip to set the auto electronic shutter to on. Auto electronic shutter R259 R260 OFF 0Ω 0Ω Factory setting ON Absent Absent 0Ω : Part code RME2068 Description ERJ2GE0R00X Location of chip resistors (Main board side B) BE-IR30 / 31 16
Streszczenie treści zawartej na stronie nr. 18
Fixed shutter mode 11. Function setting and changes 11-4 Changes to fixed shutter mode The fixed shutter mode can be changed by replacing the chip parts indicated below. Mode R259 R260 R261 R262 R263 R264 R265 R266 R267 R268 R269 Factory Normal mode 0Ω 0Ω Absent 0Ω Absent 6800 10k 27k 10k 10k 27k setting Auto electronic Remove Remove Absent 0Ω Absent shutter mode EIA 1/100 Remove 0Ω 0Ω Remove Absent 0Ω 0Ω Remove 0Ω 0Ω Remove CCIR 1/120 1/250 Remove Remove 0Ω 1/500 Absent Remove 0Ω 0Ω 0Ω Remove
Streszczenie treści zawartej na stronie nr. 19
11. Function setting and changes 11-5 BE-IR30 external sync The BE-IR30 factory setting is for internal sync. If required, this can be changed to external sync by changing chip parts. Change the following chip parts for external sync operation. Sync system R280 R281 R282 R284 Internal 100 Ω Absent Absent 0 Ω Factory setting External Delete 0 Ω 100 Ω Delete 0 Ω Part code RME1784 Type ERJ3GEYJ0R00V 100 Ω Part code RME1797 Type ERJ3GEYJ101V (Main board side A) (Main board side B) Location of c
Streszczenie treści zawartej na stronie nr. 20
11. Function setting and changes 11-6 BE-IR31 internal sync The BE-IR31 factory setting is for external sync. If required, this can be changed to internal sync by changing chip parts. Change the following chip parts for internal sync operation. Sync system R280 R281 R282 R284 External Absent 0 Ω 100 Ω Absent Factory setting Internal 100 Ω Delete Delete 0 Ω 0 Ω Part code RME1784 Type ERJ3GEYJ0R00V 100 Ω Part code RME1797 Type ERJ3GEYJ101V (Main board side A) (Main board side B) Location of c
