Streszczenie treści zawartej na stronie nr. 1
Front cover
IBM Eserver p5 570
Technical Overview chnical Overview
and Introduction Introduction
Finer system granulation using Micro-Partitioning
technology to help lower TCO
Modular midrange solution for
managing on demand business
Extreme flexibility with
outstanding performance
Giuliano Anselmi
Gregor Linzmeier
Wolfgang Seiwald
Philippe Vandamme
ibm.com/redbooks Redpaper
Streszczenie treści zawartej na stronie nr. 2
Streszczenie treści zawartej na stronie nr. 3
International Technical Support Organization IBM Sserver p5 570 Technical Overview and Introduction July 2004
Streszczenie treści zawartej na stronie nr. 4
Note: Before using this information and the product it supports, read the information in “Notices” on page vii. First Edition (July 2004) This edition applies to the IBM Sserver p5 570 and AIX 5L™ Version 5.3, product number 5765-G03. © Copyright International Business Machines Corporation 2004. All rights reserved. Note to U.S. Government Users Restricted Rights -- Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp.
Streszczenie treści zawartej na stronie nr. 5
Contents Notices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vii Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . viii Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix The team that wrote this Redpaper . . . . . . . . . . . . . . . . . .
Streszczenie treści zawartej na stronie nr. 6
2.5.4 SCSI adapters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 2.6 Internal storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 2.6.1 Internal hot swappable SCSI disks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 2.6.2 Internal RAID options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Streszczenie treści zawartej na stronie nr. 7
3.3.4 Service Update Management Assistant . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 3.4 Cluster 1600 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Related publications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 IBM Redbooks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Streszczenie treści zawartej na stronie nr. 8
vi p5-570 Technical Overview and Introduction
Streszczenie treści zawartej na stronie nr. 9
Notices This information was developed for products and services offered in the U.S.A. IBM may not offer the products, services, or features discussed in this document in other countries. Consult your local IBM representative for information on the products and services currently available in your area. Any reference to an IBM product, program, or service is not intended to state or imply that only that IBM product, program, or service may be used. Any functionally equivalent product, progra
Streszczenie treści zawartej na stronie nr. 10
Trademarks The following terms are trademarks of the International Business Machines Corporation in the United States, other countries, or both: Advanced Micro-Partitioning™ HACMP™ PowerPC® AIX® i5/OS™ pSeries® AIX 5L™ IBM® Redbooks™ Chipkill™ Micro-Partitioning™ Redbooks (logo) ™ Electronic Service Agent™ POWER™ RS/6000® POWER4™ Service Director™ Enterprise Storage Server® Eserver® POWER4+™ TotalStorage® Eserver® POWER5™ The following terms are trademarks of other companies: UNIX is a registe
Streszczenie treści zawartej na stronie nr. 11
Preface This document is a comprehensive guide covering the IBM® Sserver™ p5 570 UNIX® servers. It introduces major hardware offerings and discusses their prominent functions. Professionals wishing to acquire a better understanding of IBM Sserver p5 products should read this document. The intended audience includes: Customers Sales and marketing professionals Technical support professionals IBM Business Partners Independent software vendors This document expands the current set of I
Streszczenie treści zawartej na stronie nr. 12
The project that produced this document was managed by: Scott Vetter IBM U.S. Thanks to the following people for their contributions to this project: Ron Arroyo, John Banchy, Barb Hewitt, Thoi Nguyen, Jan Palmer, Charlie Reeves, Craig Shempert, Scott Smylie, Joel Tendler, Ed Toutant, Jane Arbeitman, Tenley Jackson, Andy McLaughlin. IBM U.S. Derrick Daines, Dave Williams. IBM UK Volker Haug IBM Germany Become a published author Join us for a two- to six-week residency program! Help write an IBM
Streszczenie treści zawartej na stronie nr. 13
1 Chapter 1. General description The IBM^ p5 570 rack-mount server is designed for greater application flexibility, with innovative technology, to capitalize on the e-business revolution at the midrange level for server environments. Introduced with the POWER4™ and POWER4+™ technology in 2001 and available from the 1-way entry-level through the 32-way high-end pSeries systems, the IBM POWER™ architecture achieved a new stage of capability characteristics by including features such as logica
Streszczenie treści zawartej na stronie nr. 14
combined system. Additional processor configurations are possible with the installation of Capacity on Demand (CoD) features. Main memory starting at 2 GB can be expanded to 128 GB in a single drawer, based on the available DIMMs, for higher performance and exploitation of 64-bit addressing, to meet the demands of enterprise computing, such as large database applications. 1 One p5-570 building block includes six hot-plug PCI-X slots with Enhanced Error Handling (EEH) and an enhanced blind-s
Streszczenie treści zawartej na stronie nr. 15
1.1 System specifications Table 1-1 lists the general system specifications of a single p5-570 drawer. Table 1-1 p5-570 specifications Description Range Operating temperature 5 to 35 degrees C (41 to 95 F) Relative humidity 8% to 80% Maximum wet bulb 23 degrees C (73 F) (operating) Noise level 6.5 bels (operating) Operating voltage 200 to 240 V AC 50/60 Hz Maximum power consumption 1,300 watts (maximum) Maximum power source loading 1.37 kVA (maximum configuration) a Maximum thermal output 4,4
Streszczenie treści zawartej na stronie nr. 16
View from the front PCI-X adapter with FSP card power supply 1 blind-swap mechanism power supply 2 I/O blowers two slim-line media bays three processor power regulators processor card 1 processor card 2 six disk drive bays operator panel optional RIO-2 ports HMC Eth ports CUoD card Power Supply 1 Power Supply 2 serial port 1 serial port 2 Rear view PCI-X slots 1 to 5 PCI-X slot 6 or RIO-2 expantion card Ethernet and USB ports default RIO-2 ports system connector Figure 1-1 Views of the p5-
Streszczenie treści zawartej na stronie nr. 17
Two SPCN ports In addition, the p5-570 building block features two internal Ultra320 SCSI controllers, redundant hot-swap power supply and redundant hot-swap cooling fans, and redundant processor power regulators (FC 7875). There is a CUoD card as part of the hardware configuration. This card stores VPD, and processor information required for management of CUoD features. Since the p5-570 can have processors in up to four physical building blocks, the card can be replaced or updated by th
Streszczenie treści zawartej na stronie nr. 18
Processor card FC Description CUoD (permanent) FC 7929 FC 7897 FC 7898 FC 7899 Reserve CoD not available FC 7956 FC 7959 FC 7959 On/Off CoD (1-day billing) not available FC 7951, 7952 FC 7951, 7953 FC 7951, 7955 Each processor card features one POWER5 chip, with two processor cores that share 1.9 MB of L2 cache, 36 MB of L3 cache, eight slots for memory DIMMs using DDR1 or DDR2 technology, and requires a minimum of 2 GB memory. (See “Memory features.”) 1.3.2 Memory features The processor card
Streszczenie treści zawartej na stronie nr. 19
Feature Code Description 3277 36.4 GB 15K RPM Ultra320 SCSI disk drive assembly 3274 73.4 GB 10K RPM Ultra320 SCSI disk drive assembly 3278 73.4 GB 15K RPM Ultra320 SCSI disk drive assembly 3275 146.8 GB 10K RPM Ultra320 SCSI disk drive assembly In a full configuration, with four connected p5-570 building blocks, the combined system supports up to eight slim-line media device bays. To support two slim-line devices in each p5-570 building block, the optional media enclosure and backplane (FC 78
Streszczenie treści zawartej na stronie nr. 20
The drawer has the following attributes: 4U rack-mount enclosure that can host one or two D10 drawers Six adapter slots – Five PCI-X slots: 3.3 V, keyed, 133 MHz blind-swap hot-plug – One PCI slot: 5 V, keyed, 33 MHz blind-swap hot-plug Default redundant hot-plug power and cooling devices Two RIO-2 and two SPCN ports Note: The 7311 Model D10 I/O drawers require FC 6431 to ensure RIO-2 port capability, or an upgrade to RIO-2 is requested to support the connection to the p5-570 system. 73
