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Dell
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POWeReDGe
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technical GuiDebOOk
insiDe the POWeReDGe M610
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Dell™ PowerEdge™ M610 Technical Guidebook TABLE OF CONTENTS sectiOn 1. s ysteM O veR vieW 5 A. Overview / Description 5 sectiOn 2. Mechanical 6 A. Dimensions and Weight (blade only) 6 B. Front Panel View and Features 6 C. Side Views and Features 8 D. Security 8 E. USB Key 9 F. Battery 9 G. Field Replaceable Units (FRU) 9 sectiOn 3. POWeR, theRMal, a c Oustic 9 A. Environmental Specifications 9 B. Acoustics 10 sectiOn 4. bl Ock Dia GRaM 10 sectiOn 5. PROcessORs 11 A. Overview / Description 11 B.
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Dell™ PowerEdge™ M610 Technical Guidebook sectiOn 11. st ORa Ge 21 A. Overview / Description 21 B. Storage Controllers 21 sectiOn 12. viDe O 22 A. Overview / Description 22 sectiOn 13. OPeR atinG systeMs 23 A. Overview / Description 23 sectiOn 14. viRtualiZatiOn 25 sectiOn 15. systeMs Mana GeMent 25 A. Overview / Description 25 B. Server Management 25 C. Embedded Server Management 26 I. Unmanaged Persistent Storage 26 II. Lifecycle Controller / Unified Server Configurator 27 III. iDRAC6 Expre
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Dell™ PowerEdge™ M610 Technical Guidebook the Dell™ POWeReDGe™ M610 The Dell PowerEdge M-Series blade servers help cut operating expenses through energy efficiency, product flexibility, and efficient use of data center space. When combined with Dell’s world-class storage, management, and support offerings, the result is a total enterprise solution that can help you simplify and save on IT expenses. strong it Foundation To build the most efficient data center solutions, Dell sought input fro
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Dell™ PowerEdge™ M610 Technical Guidebook sectiOn 1. s ysteM OveR vieW A. Overview / Description The PowerEdge M610 is the next generation of Intel single-slot blade with enhanced processors, RAM, and management while still taking advantage of the M1000e chassis architecture. Along with the M1000e, it leads the industry in high speed, redundant IO throughput and power consumption. FeatuRe Details ® ® Processor Nehalem EP - 2-Socket Intel Xeon 5500 Series Front Side Bus Intel Quickpath Intercon
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Dell™ PowerEdge™ M610 Technical Guidebook sectiOn 2. Mechanical A. Dimensions and Weight (blade only) Height: 38.5cm (15.2in) Width: 5cm (2in) Depth: 48.6cm (19.2in) Weight: 11.1kg (24.5lbs.) - Maximum configuration B. Front Panel View and Features 1 2 3 4 5 6 1. Blade Handle Release Button 4. USB Connectors (2) 2. Blade Power Indicator 5. Blade Status / Indentification Indicator 3. Blade Power Button 6. Hard Drives (2) Figure: Front Panel Features PowerEdge M610 6
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Dell™ PowerEdge™ M610 Technical Guidebook FeatuRe ic On DescRiPtiOn Off – Power is not available to the blade, the blade is in standby mode, the blade is not turned on, or the blade is installed incorrectly. For detailed information on installing a blade, see "Installing a Blade." Blade Power Indicator Green increasing from low brightness to full brightness – Blade power on request is pending. Green on – The blade is turned on. Off – The blade power is off. Blue – Normal operating state.
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Dell™ PowerEdge™ M610 Technical Guidebook C. Side Views and Features D. Security Trusted Platform Module (TPM) The TPM is used to generate/store keys, protect/authenticate passwords, and create/store digital certificates. TPM can also be used to enable the BitLocker™ hard drive encryption feature in Windows ® Server 2008. TPM is enabled through a BIOS option and uses HMAC-SHA1-160 for binding. There will be different part numbers to accommodate different TPM solutions around the world. Power
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Dell™ PowerEdge™ M610 Technical Guidebook E. USB KEy The PowerEdge M610 supports the following USB devices: • D VD (bootable; r equir es tw o USB ports ) • USB K e y (bootable ) • K e yboar d ( only one USB k e yboar d is support ed) • Mouse ( only one USB mouse is support ed) F. Battery A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the Real-Time Clock and CMOS RAM on the ICH9 chip. G. Field Replaceable Units (FRU) The planar
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Dell™ PowerEdge™ M610 Technical Guidebook B. Acoustics The acoustical design of the PowerEdge M610 reflects the following: • A dher enc e t o Dell’ s high sound quality s tandar ds. Sound quality is diff er ent fr om sound po w er level and sound pressure level in that it describes how humans respond to annoyances in sound, like whistles, hums, etc. One of the sound quality metrics in the Dell specification is prominence ratio of a tone, and this is listed in the table below. • Har dw
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Dell™ PowerEdge™ M610 Technical Guidebook 6 7 8 1 2 3 4 5 1. 2 2.5” Hard Drives 5. 12 DDR3 DIMM Slots Hard drive controller underneath 6. High-speed Mezz Card Slots 2. Internal USB On-board NICs underneath 3. Chipset 7. iDRAC6 Enterprise 4. 2 Processor Sockets 8. Persistent Storage (underneath iDRAC6) Figure: PowerEdge M610 Main Components sectiOn 5. PROcessORs A. Overview / Description ® The Intel 5500 series 2S processor (Nehalem - Efficient Processor (EP)), is the microprocessor design
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Dell™ PowerEdge™ M610 Technical Guidebook B. Features K e y f ea tur es of the 5500 series 2S pr oc es sor (Nehalem EP) include: • F our or tw o c or es per pr oc es sor • T w o point-t o-point QuickP a th Int er c onnect links a t up t o 6.4 G T / s • 1366-pin F C -L GA pack age • 45 nm pr oc es s t echnology • No t ermina tion r equir ed f or non-popula t ed CPUs (mus t popula t e CPU sock et 1 firs t) • Int egr a t ed thr ee-channel DDR3 memory c ontr oller a t u
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Dell™ PowerEdge™ M610 Technical Guidebook Performance Enhancements ® Intel Xeon 5500 Series Processor (Nehalem-EP) ® ® Intel Turbo Boost Intel Hyper-Threading Technology Technology Increases performance by increasing processor Increases performance for threading applications frequency and enabling faster speeds when delivering greater throughput and responsiveness conditions allow Normal 4C Turbo <4C Turbo All cores All cores Fewer cores operate operate may operate at rated at higher
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Dell™ PowerEdge™ M610 Technical Guidebook MODel sPeeD POWeR cache c ORes X5570 2.93GHz 95W 8M 4 X5560 2.80GHz 95W 8M 4 X5550 2.66GHz 95W 8M 4 E5540 2.53GHz 80W 8M 4 E5530 2.40GHz 80W 8M 4 E5520 2.26GHz 80W 8M 4 L5520 2.26GHz 60W 8M 4 E5506 2.13GHz 80W 4M 4 L5506 2.13GHz 60W 4M 4 E5504 2.00GHz 80W 4M 4 E5502 1.86GHz 80W 4M 2 CPU Power Voltage Regulation Modules (EVRD 11.1) Voltage regulation to the 5500 series 2S processor (Nehalem EP) is provided by EVRD (Enterprise Voltage Regulator-Down). E
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Dell™ PowerEdge™ M610 Technical Guidebook B1 A6 B6 A1 Figure: Memory Locations for Poweredge M610 b. DiMMs supported The DDR3 memory interface consists of three channels, with up to two RDIMMs or UDIMMs per channel for single-/dual-rank and up to two RDIMMs per channel for quad rank. The interface uses 2GB, 4GB, or 8GB RDIMMs. 1GB, or 2GB UDIMMs are also supported. The memory mode is dependent on how the memory is populated in the system: Three channels per CPU populated identically: •
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Dell™ PowerEdge™ M610 Technical Guidebook • T he DIMM sock ets ar e plac ed 450 mils (11.43 mm) apart, c ent er-t o-c ent er in or der t o pr o vide enough space for sufficient airflow to cool stacked DIMMs. • The PowerEdge M610 memory system supports up to 12 DIMMs. DIMMs must be installed in each channel starting with the DIMM farthest from the processor. Population order will be identified by the silkscreen designator and the System Information Label (SIL) located on the chassis co
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Dell™ PowerEdge™ M610 Technical Guidebook NHM-EP Platform Memory Overview • Platform capability (18 DIMMs): 1 – Up to 3 channels per CPU – Up to 3 DIMMS per channel Up to 3 channels NHM-EP NHM-EP 2 per CPU • Memory T ypes Supported: – DDR 1333, 1066, and 800 3 – Registered (RDIMM) and unbuffered (UDIMM) – Single-rank (SR), dual-rank (DR), quad-rank (QR) 1 2 3 Up to 3 • S ystem memory Speed (i.e. the speed at which the memory is DIMMs per actually running) is set by BIOS depending o
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Dell™ PowerEdge™ M610 Technical Guidebook sectiOn 7. chiPset a. Overview / Description The PowerEdge M610 planar incorporated the Intel 5520 chipset (code named Tylersburg) for I/O and processor interfacing. Tylersburg is designed to support Intel's 5500 series processors (code named Nehalem-EP), QPI int er c onnect, DDR3 memory t echnology , and PCI Expr es s Gener a tion 2. T he Tylersburg chipset consists of the Tylersburg-36D IOH and ICH9. Delivering Intelligent Performance ® Next Gener
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Dell™ PowerEdge™ M610 Technical Guidebook PCI Express Generation 2 PCI Express is a serial point-to-point interconnect for I/O devices. PCIe Gen2 doubles the signaling bit rate of each lane from 2.5 Gb/s to 5 Gb/s. Each of the PCIe Gen2 ports are backwards-compatible with Gen1 transfer rates. In the Tylersburg-36D IOH, there are two x2 PCIe Gen2 ports (1Gb/s) and eight x4 PCIe Gen2 ports (2 Gb/ s ). T he x2 ports can be c ombined as a x4 link; ho w e v er , this x4 link cannot be c ombined w
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Dell™ PowerEdge™ M610 Technical Guidebook The PowerEdge M610 BIOS does not support the following: • Embedded Diagnos tics ( embedded in MA SER) • BIO S language localiza tion • BIO S r ec o v ery aft er bad flash (but can be r ec o v er ed fr om iDRA C6 Expr es s ) 2 b. i c (inter-integrated circuit) 2 2 What is I C? A simple bi-directional 2-wire bus for efficient inter-integrated circuit control. All I C-bus compatible devices incorporate an on-chip interface which allows them
