Streszczenie treści zawartej na stronie nr. 1
QuickSpecs
H H H HP P P P Co Co Co Com m m mp p p pa a a aq q q q t5 t5 t5 t57 7 7 73 3 3 30 0 0 0 Th Th Th Thin Cl in Cl in Cl in Clie ie ie ient nt nt nt
Overview
H H H HP P P P Compaq Compaq Compaq Compaq tttt5 5 5 5730 730 730 730 Thin Thin Thin Thin C C C Cllllient ient ient ient
Front Front Front Front Ba Ba Ba Back ck ck ck
1. Power button 1. Audio out
2. Power on indicator 2. Ethernet RJ-45 connector
3. Flash activity indicator 3. USB connectors (four)
4. Audio conn
Streszczenie treści zawartej na stronie nr. 2
QuickSpecs H H H HP P P P Co Co Co Com m m mp p p pa a a aq q q q t5 t5 t5 t57 7 7 73 3 3 30 0 0 0 Th Th Th Thin Cl in Cl in Cl in Clie ie ie ient nt nt nt Overview with optional t5 with optional t5 with optional t5 with optional t5730 730 730 730/t5 /t5 /t5 /t57 7 7 73 3 3 35 5 5 5 E E E Ex x x xpan pan pan pansion Module Kit sion Module Kit sion Module Kit sion Module Kit 1. Power button 1. Audio out 2. Power on indicator 2. Ethernet RJ-45 connector 3. Flash activity indicator 3.
Streszczenie treści zawartej na stronie nr. 3
QuickSpecs H H H HP P P P Co Co Co Com m m mp p p pa a a aq q q q t5 t5 t5 t57 7 7 73 3 3 30 0 0 0 Th Th Th Thin Cl in Cl in Cl in Clie ie ie ient nt nt nt Overview Top Top Top Top 1. Wireless antenna (option) 2. Cable lock slot At A At A At A At A Gla Gla Gla Glan n n nc c c ce e e e • AMD Sempron 2100+ processor for leading performance • 1 GB flash memory provides ample storage for drivers and applications • Up to 1 GB system memory (32 MB reserved for graphics memory) • XP
Streszczenie treści zawartej na stronie nr. 4
QuickSpecs H H H HP P P P Co Co Co Com m m mp p p pa a a aq q q q t5 t5 t5 t57 7 7 73 3 3 30 0 0 0 Th Th Th Thin Cl in Cl in Cl in Clie ie ie ient nt nt nt Standard Features - Models KD219AA#ABA Pro Pro Pro Proc c c cesso esso esso essor r r r AMD Sempron 2100+ (standard) Operatin O O Op p peratin eratin erating S g S g S g Sy y y ystem stem stem stem Microsoft Windows XP Embedded, Service Pack 2 Flash Memory Flash Memory 1 GB Flash Memory Flash Memory KD219AT#ABA Me M Me Me emor m
Streszczenie treści zawartej na stronie nr. 5
QuickSpecs H H H HP P P P Co Co Co Com m m mp p p pa a a aq q q q t5 t5 t5 t57 7 7 73 3 3 30 0 0 0 Th Th Th Thin Cl in Cl in Cl in Clie ie ie ient nt nt nt Standard Features - Models each thin client. T Te erminal Personalities rminal Personalities Standard T Te erminal Personalities rminal Personalities Ke Ke Ke Key y y yb b b board oard oard oard USB or PS/2 Type of included keyboard (USB or PS/2) varies by region. Mous Mous Mous Mouse e e e USB or PS/2 Type of included mouse (U
Streszczenie treści zawartej na stronie nr. 6
QuickSpecs H H H HP P P P Co Co Co Com m m mp p p pa a a aq q q q t5 t5 t5 t57 7 7 73 3 3 30 0 0 0 Th Th Th Thin Cl in Cl in Cl in Clie ie ie ient nt nt nt Options Part Nu Part Numb mber er Part N Part Nu umb mber er A A A Acce cce cce ccess ss ss ssorie orie orie ories s s s HP t5730/t5735 Expansion Module GZ286AA HP Quick Release Kit EM870AA HP/Kensington Cable Lock PC766A 1 1 1 1 2 Communications Communications Communications Communications Modem Serial – Zoom 3
Streszczenie treści zawartej na stronie nr. 7
QuickSpecs H H H HP P P P Co Co Co Com m m mp p p pa a a aq q q q t5 t5 t5 t57 7 7 73 3 3 30 0 0 0 Th Th Th Thin Cl in Cl in Cl in Clie ie ie ient nt nt nt Technical Specifications Po Possi ssibl ble M e Me emo mory ry Co Conf nfig igur uratio ations ns Po Possi ssibl ble M e Me emo mory ry Co Conf nfig igur uratio ations ns Flas Flash Memory Flash Memory Flash Memory h Memory Me M Memory Me emor m mor ory y y Slo S S Slllot ot ott (DDR-2) 1 GB 512 MB 1 GB 1 GB Pro Pro Pro Pro
Streszczenie treści zawartej na stronie nr. 8
QuickSpecs H H H HP P P P Co Co Co Com m m mp p p pa a a aq q q q t5 t5 t5 t57 7 7 73 3 3 30 0 0 0 Th Th Th Thin Cl in Cl in Cl in Clie ie ie ient nt nt nt Technical Specifications Support for Smart Card options T Te erminal S rminal Se errv ver er Citrix ICA 10.x and Microsoft RDP 5.2 for remote terminal services T Te erminal S rminal Se errv ver er Protocols Protocols Protocols Protocols and S and S and S and Se e e es s s ss s s siiiion on on on Brok Bro Bro Brok k kers ers ers e
Streszczenie treści zawartej na stronie nr. 9
QuickSpecs H H H HP P P P Co Co Co Com m m mp p p pa a a aq q q q t5 t5 t5 t57 7 7 73 3 3 30 0 0 0 Th Th Th Thin Cl in Cl in Cl in Clie ie ie ient nt nt nt Technical Specifications T Te emperatu mperaturre rang e range o e on n 50° to 104° F (10 to 40° C) T Te emperatu mperaturre rang e range o e on n wh when u en us sing the Q ing the Qu uic ick k wh when u en us sing the Q ing the Qu uic ick k R R R Re e e elease lease lease lease with a flat panel with a flat panel with a flat p
Streszczenie treści zawartej na stronie nr. 10
QuickSpecs H H H HP P P P Co Co Co Com m m mp p p pa a a aq q q q t5 t5 t5 t57 7 7 73 3 3 30 0 0 0 Th Th Th Thin Cl in Cl in Cl in Clie ie ie ient nt nt nt Technical Specifications VT UTF8 VT420, VT131, VT132, M2200, VT510, VT520, VT525 VT PCTerm Wyse PCTerm WY50 WY50+ Y60 En Env viro iron nment ment--friendly friendly Ro RoHS HS C Co ompliance mpliance Hewlett-Packard is committed to compliance with all applicable E En nviro vironment nment--friendly friendly Ro RoHS
Streszczenie treści zawartej na stronie nr. 11
QuickSpecs H H H HP P P P Co Co Co Com m m mp p p pa a a aq q q q t5 t5 t5 t57 7 7 73 3 3 30 0 0 0 Th Th Th Thin Cl in Cl in Cl in Clie ie ie ient nt nt nt Technical Specifications product packaging: • Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials. • Eliminate the use of ozone-depleting substances (ODS) in packaging materials. • Design packaging materials for ease of disassembly. • Maximize the use of post-consumer recycled co
Streszczenie treści zawartej na stronie nr. 12
QuickSpecs H H H HP P P P Co Co Co Com m m mp p p pa a a aq q q q t5 t5 t5 t57 7 7 73 3 3 30 0 0 0 Th Th Th Thin Cl in Cl in Cl in Clie ie ie ient nt nt nt Technical Specifications The warranties for HP products and services are set forth in the express limited warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.
