Streszczenie treści zawartej na stronie nr. 1
ThinkS tation
User Guide
Machine T ypes: 4262, 4263, 4264, 4265, 4266, 4269, 4271, and 4272
Streszczenie treści zawartej na stronie nr. 2
Not e: Befor e using this information and the pr oduct it suppor ts, be sur e t o r ead and understand the ThinkS tation Safety and W arr anty Guide and Appendix B “Notices” on page 73 . Thir d Edition (December 2011) © Copyright L enovo 2010, 2011. LIMITED AND RES TRIC TED RIGHT S NO TICE: If data or softwar e is deliver ed pursuant a Gener al Ser vices Administr ation “GSA ” contr act, use, r epr oduction, or disclosur e is subject t o r estrictions set for th in Contr act No. GS-35F-05925.
Streszczenie treści zawartej na stronie nr. 3
Contents Impor tant safety information . . . . . iii Using the Rescue and Recover y workspace . . . 44 Cr eating and using a r escue medium . . . . . . 45 Chapt er 1. P r oduct over view . . . . . . 1 Cr eating a r escue medium . . . . . . . . 45 F eatur es . . . . . . . . . . . . . . . . . . 1 Using a r escue medium . . . . . . . . . 45 Specifications . . . . . . . . . . . . . . . . 3 Installing or r einstalling device drivers . . . . . 46 Softwar e over view . . . . . . . . . . . . . . 4 Solvi
Streszczenie treści zawartej na stronie nr. 4
Updating (flashing) the BIOS fr om a disc . . . . 57 L enovo ThinkV antage T ools . . . . . . . . 65 Updating (flashing) the BIOS fr om your oper ating L enovo W elcome . . . . . . . . . . . . 65 syst em . . . . . . . . . . . . . . . . . . 58 Safety and warr anty . . . . . . . . . . . 66 Recovering fr om a POS T/BIOS updat e failur e . . 58 L enovo W eb sit e (http://w w w .lenovo.com) . . 66 Help and ser vice . . . . . . . . . . . . . . 66 Chapt er 7. T r oubleshooting and Using the documentati
Streszczenie treści zawartej na stronie nr. 5
Impor tant safety information C A UTION: Befor e using this manual, be sur e t o r ead and understand all the r elat ed safety information for this pr oduct. Refer t o the ThinkS tation Safety and W arr anty Guide that you r eceived with this pr oduct for the lat est safety information. Reading and understanding this safety information r educes the risk of personal injur y and or damage t o your pr oduct. If you no longer have a copy of the ThinkCentr e Safety and W arr anty Guide , you can obta
Streszczenie treści zawartej na stronie nr. 6
iv ThinkS tation User Guide
Streszczenie treści zawartej na stronie nr. 7
Chapt er 1. P r oduct over view This chapt er pr ovides information about the comput er featur es, specifications, pr einstalled softwar e pr ogr ams, and connect or and par t locations. This chapt er contains the following t opics: • “F eatur es” on page 1 : This section pr ovides information about the comput er featur es. • “Specifications” on page 3 : This section lists the physical specifications for your comput er . • “Softwar e over view” on page 4 : This section pr ovides information abou
Streszczenie treści zawartej na stronie nr. 8
Audio subsyst em • Int egr at ed high-definition (HD) audio • Micr ophone connect or and headphone connect or on the fr ont panel • Eight audio connect ors on the r ear panel – Audio line-in connect or – Audio line-out fr ont speak er connect or – Audio line-out r ear speak er connect or – Audio line-out side speak er connect or – Audio line-out subwoofer/cent er speak er connect or – Micr ophone connect or – Optical Sony Philips Digital Int er connect F ormat (SPDIF) in connect or – Optical SPD
Streszczenie treści zawartej na stronie nr. 9
• One PCI Expr ess x4 car d slot (x16 mechanical) • Thr ee har d disk drives • T wo PCI car d slots • T wo PCI Expr ess x16 car d slots P ower supply • 800-watt aut o-sensing power supply Security featur es • Cover pr esence switch (also called intrusion switch) (available in some models) • Enabling or disabling SA T A devices • Enabling or disabling the serial por t • Enabling or disabling USB connect ors individually • User passwor d and administr at or passwor d t o det er unauthoriz ed use o
Streszczenie treści zawartej na stronie nr. 10
Dimensions W idth: 130 mm (5.12 inches) Height: 427 mm (16.81 inches) Depth: 444 mm (17.48 inches) W eight Maximum configur ation: 18.5 kg (40.8 lbs) Envir onment • Air t emper atur e: Oper ating: 10°C t o 35°C (50°F t o 95°F) S t or age: -10°C t o 60°C (14°F t o 140°F) without package • Humidity: Oper ating: 10% t o 80% (10% per hour , non-condensing) S t or age: 10% t o 90% (10% per hour , non-condensing) • Maximum altitude: 7 000 ft (2 133.6 m) Electrical input • Input voltage: – L ow r ange:
Streszczenie treści zawartej na stronie nr. 11
L enovo ThinkV antage T ools ® The L enovo ThinkV antage T ools pr ogr am guides you t o a host of information sour ces and pr ovides easy access t o various t ools t o help you work mor e easily and secur ely . F or mor e information, see “L enovo ThinkV antage T ools” on page 65 . Not e: The L enovo ThinkV antage T ools pr ogr am is only available on comput ers with the W indows 7 oper ating syst em fr om L enovo. L enovo W elcome The L enovo W elcome pr ogr am intr oduces some innovative buil
Streszczenie treści zawartej na stronie nr. 12
See “Online Books folder ” on page 65 for mor e information about accessing and viewing the publications. Antivirus softwar e Y our comput er comes with antivirus softwar e that you can use t o det ect and eliminat e viruses. L enovo pr ovides a full version of antivirus softwar e on your comput er with a fr ee 30-day subscription. Aft er 30 days, you must r enew the license t o continue r eceiving the antivirus softwar e updat es. F or mor e information about how t o use your antivirus softwar
Streszczenie treści zawartej na stronie nr. 13
L ocating connect ors on the r ear of your comput er Figur e 2 “Rear connect or locations” on page 7 shows the locations of the connect ors on the r ear of your comput er . Some connect ors on the r ear of your comput er ar e color -coded t o help you det ermine wher e t o connect the cables on your comput er . Figur e 2. Rear connect or locations 1 eSA T A connect or 11 PCI car d slot cover 2 Optical SPDIF in connect or 12 PCI Expr ess x16 car d slot cover 3 Optical SPDIF out connect or 13 PCI
Streszczenie treści zawartej na stronie nr. 14
Connect or Description Audio line-in connect or Used t o r eceive audio signals fr om an e xt ernal audio device, such as a st er eo syst em. When you attach an e xt ernal audio device, a cable is connect ed between the audio line-out connect or of the device and the audio line-in connect or of the comput er . Audio line-out connect or (fr ont Used t o send audio signals fr om the comput er t o e xt ernal devices, such as speak er connect or) power ed st er eo speak ers (speak ers with built-in
Streszczenie treści zawartej na stronie nr. 15
Figur e 3. Component locations 1 Memor y modules 7 Har d disk drives (3) 2 Heat sink and fan assembly 2 8 P ower supply assembly 3 Optical drive br ack et 9 PCI car d 4 Optical drive 10 Heat sink and fan assembly 1 5 F r ont fan assembly br ack et 11 Rear fan assemblies (2) 6 Har d disk drive bay L ocating par ts and connect ors on the syst em boar d Not e: Y our comput er comes with one of the following syst em boar ds. Figur e 4 “S yst em boar d par t and connect or locations” on page 10 shows
Streszczenie treści zawartej na stronie nr. 16
35 34 33 32 31 Figur e 4. S yst em boar d par t and connect or locations 1 CPU 1 memor y slots (6) 19 Clear Complementar y Metal Oxide Semiconduct or (CMOS) /Recover y jumper 2 CPU 1 memor y fan connect or 20 Thermal sensor connect or 3 CPU 2 12 V power connect or 21 Cover pr esence switch connect or 4 Micr opr ocessor 2 22 P ersonal S yst em/2 (PS/2) k eyboar d and mouse connect or 5 24-pin power connect or 23 Int ernal speak er connect or 6 CPU 2 fan connect or 24 F r ont audio connect or 7 CP
Streszczenie treści zawartej na stronie nr. 17
Figur e 5 “S yst em boar d par t and connect or locations” on page 11 shows the locations of the par ts and connect ors on the other type of syst em boar d. Figur e 5. S yst em boar d par t and connect or locations 1 CPU 1 memor y slots (3) 18 Clear Complementar y Metal Oxide Semiconduct or (CMOS) /Recover y jumper 19 Thermal sensor connect or 2 CPU 1 memor y fan connect or 3 Micr opr ocessor 2 20 Cover pr esence switch connect or 4 CPU 2 12 V power connect or 21 PS/2 k eyboar d and mouse connec
Streszczenie treści zawartej na stronie nr. 18
33 Micr opr ocessor 1 16 SA T A connect ors (4) 17 Batt er y 12 ThinkS tation User Guide
Streszczenie treści zawartej na stronie nr. 19
Chapt er 2. Installing or r eplacing har dwar e This chapt er pr ovides instructions on how t o install or r eplace har dwar e for your comput er . This chapt er contains the following t opics: • “Installing or r eplacing har dwar e” on page 13 • “Obtaining device drivers” on page 38 • “Basic security featur es” on page 38 Installing or r eplacing har dwar e This section pr ovides instructions on how t o install or r eplace har dwar e for your comput er . Y ou can maintain your comput er or e xp
Streszczenie treści zawartej na stronie nr. 20
2. Use the k eys that came with your comput er t o unlock the k eylock 1 in the comput er cover . P r ess the comput er cover -r elease butt on 2 and then r emove the comput er cover . Place the comput er cover on a flat sur face. Figur e 6. Removing the comput er cover Removing and r einstalling the fr ont be z el A tt ention: Do not open your comput er or att empt any r epair befor e r eading and understanding the “Impor tant safety information” in the ThinkS tation Safety and W arr anty Guide
