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CY7C1019D
1-Mbit (128K x 8) Static RAM
[1]
Features Functional Description
• Pin- and function-compatible with CY7C1019B The CY7C1019D is a high-performance CMOS static RAM
organized as 131,072 words by 8 bits. Easy memory
• High speed
expansion is provided by an active LOW Chip Enable (CE), an
—t = 10 ns
AA
active LOW Output Enable (OE), and tri-state drivers. This
• Low active power
device has an automatic power-down feature that significantly
reduces power consumption when deselected. The e
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CY7C1019D Pin Configuration SOJ/TSOPII Top View A 1 32 A 0 16 A 1 31 A 2 15 A 30 3 2 A 14 A 3 4 29 A 13 28 CE 5 OE 27 IO 6 0 IO 7 26 IO IO 7 1 6 25 V 8 V CC SS V 24 SS 9 V CC 23 IO IO 2 10 5 IO 22 IO 3 11 4 A 21 WE 12 12 A A 4 11 13 20 A A 5 19 10 14 A A 6 15 18 9 A A 17 16 8 7 Selection Guide –10 (Industrial) Unit Maximum Access Time 10 ns Maximum Operating Current 80 mA Maximum Standby Current 3 mA Document #: 38-05464 Rev. *E Page 2 of 11 [+] Feedback
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CY7C1019D Current into Outputs (LOW) ........................................ 20 mA Maximum Ratings Static Discharge Voltage........................................... > 2001V Exceeding the maximum ratings may impair the useful life of (per MIL-STD-883, Method 3015) the device. These user guidelines are not tested. Latch-up Current .................................................... > 200 mA Storage Temperature .................................–65°C to +150°C Ambient Temperature with Operating
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CY7C1019D [3] Capacitance Parameter Description Test Conditions Max Unit C Input Capacitance T = 25°C, f = 1 MHz, V = 5.0V 6 pF IN A CC C Output Capacitance 8 pF OUT [3] Thermal Resistance 400-Mil Parameter Description Test Conditions TSOP II Unit Wide SOJ Θ Thermal Resistance Still Air, soldered on a 3 × 4.5 inch, 56.29 62.22 °C/W JA (Junction to Ambient) four-layer printed circuit board Θ Thermal Resistance 38.14 21.43 °C/W JC (Junction to Case) [4] AC Test Loads and Waveforms ALL INPUT PU
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CY7C1019D [5] Switching Characteristics (Over the Operating Range) –10 (Industrial) Parameter Description Unit Min Max Read Cycle [6] t V (typical) to the first access 100 µs power CC t Read Cycle Time 10 ns RC t Address to Data Valid 10 ns AA t Data Hold from Address Change 3 ns OHA t CE LOW to Data Valid 10 ns ACE t OE LOW to Data Valid 5 ns DOE t OE LOW to Low Z 0 ns LZOE [7, 8] t OE HIGH to High Z 5ns HZOE [8] t CE LOW to Low Z 3ns LZCE [7, 8] t CE HIGH to High Z 5ns HZCE [9] t CE LOW to Pow
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CY7C1019D Data Retention Characteristics (Over the Operating Range) Parameter Description Conditions Min Max Unit V V for Data Retention 2.0 V DR CC I Data Retention Current V = V = 2.0V, CE > V – 0.3V, 3mA CCDR CC DR CC V > V – 0.3V or V < 0.3V IN CC IN [3] t Chip Deselect to Data Retention Time 0 ns CDR [12] t Operation Recovery Time t ns R RC Data Retention Waveform DATA RETENTION MODE 4.5V 4.5V V V > 2V DR CC t t CDR R CE Switching Waveforms [13, 14] Read Cycle No. 1 (Address Transition Co
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CY7C1019D Switching Waveforms (continued) [16, 17] Write Cycle No. 1 (CE Controlled) t WC ADDRESS t SCE CE t SA t SCE t t AW HA t PWE WE t t SD HD DATA IO DATA VALID [16, 17] Write Cycle No. 2 (WE Controlled, OE HIGH During Write) t WC ADDRESS t SCE CE t t AW HA t t SA PWE WE OE t t SD HD DATA VALID DATA IO IN NOTE 18 t HZOE Notes 16. Data IO is high impedance if OE = V . IH 17. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state. 18. During this pe
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CY7C1019D Switching Waveforms (continued) [11, 17] Write Cycle No. 3 (WE Controlled, OE LOW) t WC ADDRESS t SCE CE t t AW HA t t SA PWE WE t t SD HD DATA IO NOTE 18 DATA VALID t t LZWE HZWE Truth Table CE OE WE IO –IO Mode Power 0 7 H X X High Z Power-Down Standby (I ) SB L L H Data Out Read Active (I ) CC L X L Data In Write Active (I ) CC L H H High Z Selected, Outputs Disabled Active (I ) CC Ordering Information Speed Package Operating Ordering Code Package Type (ns) Diagram Range 10 CY7C10
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CY7C1019D Package Diagrams Figure 1. 32-pin (400-Mil) Molded SOJ (51-85033) 51-85033-*B Document #: 38-05464 Rev. *E Page 9 of 11 [+] Feedback
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CY7C1019D Package Diagrams (continued) Figure 2. 32-pin Thin Small Outline Package Type II (51-85095) 51-85095-** All product or company names mentioned in this document may be the trademarks of their respective holders. Document #: 38-05464 Rev. *E Page 10 of 11 © Cypress Semiconductor Corporation, 2006-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodie
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CY7C1019D Document History Page Document Title: CY7C1019D, 1-Mbit (128K x 8) Static RAM Document Number: 38-05464 Orig. of REV. ECN NO. Issue Date Description of Change Change ** 201560 See ECN SWI Advance Information data sheet for C9 IPP *A 233715 See ECN RKF DC parameters are modified as per EROS (Spec # 01-2165) Pb-free offering in the Ordering Information *B 262950 See ECN RKF Added T Spec in Switching Characteristics table power Added Data Retention Characteristics table and waveforms Sh
