Transcend Information CompactFlash TS1GCF133 user manual

User manual for the device Transcend Information CompactFlash TS1GCF133

Device: Transcend Information CompactFlash TS1GCF133
Category: Computer Hardware
Manufacturer: Transcend Information
Size: 2.11 MB
Added : 11/16/2014
Number of pages: 81
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Abstracts of contents
Summary of the content on the page No. 1

TS1G~32GCF133 133X CompactFlash Card
TS1G~32GCF133
TS1G~32GCF133

Features
Description
• CompactFlash Specification Version 4.1 Complaint
The Transcend CF 133X is a High Speed Compact
• RoHS compliant products
Flash Card with high quality Flash Memory assembled
• Single Power Supply: 3.3V±5% or 5V±10%
on a printed circuit board.
o o
• Operating Temperature: -25 C to 85 C

o o
• Storage Temperature: -40 C to 85 C
Placement
• Operation Modes:
PC Card Memory Mode


PC

Summary of the content on the page No. 2

TS1G~32GCF133 133X CompactFlash Card TS1G~32GCF133 TS1G~32GCF133 Transcend Transcend Information Inc. 2

Summary of the content on the page No. 3

TS1G~32GCF133 133X CompactFlash Card TS1G~32GCF133 TS1G~32GCF133 Block Diagram Transcend Information Inc. 3

Summary of the content on the page No. 4

TS1G~32GCF133 133X CompactFlash Card TS1G~32GCF133 TS1G~32GCF133 Pin Assignments and Pin Type Transcend Information Inc. 4

Summary of the content on the page No. 5

TS1G~32GCF133 133X CompactFlash Card TS1G~32GCF133 TS1G~32GCF133 Note: 1) These signals are required only for 16 bit accesses and not required when installed in 8 bit systems. Devices should allow for 3-state signals not to consume current. 2) The signal should be grounded by the host. 3) The signal should be tied to VCC by the host. 4) The mode is required for CompactFlash Storage Cards. 5) The -CSEL signal is ignored by the card in PC Card modes. Howe

Summary of the content on the page No. 6

TS1G~32GCF133 133X CompactFlash Card TS1G~32GCF133 TS1G~32GCF133 Signal Description Signal Name Dir. Pin Description A10 – A00 I 8,10,11,12, These address lines along with the -REG signal are used to select the following: (PC Card Memory Mode) 14,15,16,17, The I/O port address registers within the CompactFlash Storage Card , the 18,19,20 memory mapped port address registers within the CompactFlash Storage Card, a byte in the card's information structure and its configuration contr

Summary of the content on the page No. 7

TS1G~32GCF133 133X CompactFlash Card TS1G~32GCF133 TS1G~32GCF133 Signal Name Dir. Pin Description These input signals are used both to select the card and to indicate to the card -CE1, -CE2 I 7,32 whether a byte or a word operation is being performed. -CE2 always accesses (PC Card Memory Mode) the odd byte of the word.-CE1 accesses the even byte or the Odd byte of the Card Enable word depending on A0 and -CE2. A multiplexing scheme based on A0,-CE1, -CE2 allows 8 bit hosts to access a

Summary of the content on the page No. 8

TS1G~32GCF133 133X CompactFlash Card TS1G~32GCF133 TS1G~32GCF133 Signal Name Dir. Pin Description -INPACK O 43 This signal is not used in this mode. (PC Card Memory Mode) The Input Acknowledge signal is asserted by the CompactFlash Storage Card -INPACK (PC Card I/O Mode) when the card is selected and responding to an I/O read cycle at the address that Input Acknowledge is on the address bus. This signal is used by the host to control the enable of any input data buffers betwe

Summary of the content on the page No. 9

TS1G~32GCF133 133X CompactFlash Card TS1G~32GCF133 TS1G~32GCF133 Signal Name Dir. Pin Description -IOWR This signal is not used in this mode. I 35 (PC Card Memory Mode) -IOWR The I/O Write strobe pulse is used to clock I/O data on the Card Data bus into the (PC Card I/O Mode) CompactFlash Storage Card controller registers when the CompactFlash Storage Card is configured to use the I/O interface. The clocking shall occur on the negative to positive edge of the signal (trailing

Summary of the content on the page No. 10

TS1G~32GCF133 133X CompactFlash Card TS1G~32GCF133 TS1G~32GCF133 Signal Name Dir. Pin Description -REG This signal is used during Memory Cycles to distinguish between Common I 44 (PC Card Memory Mode) Memory and Register (Attribute) Memory accesses. High for Common Memory, Attribute Memory Select Low for Attribute Memory. -REG The signal shall also be active (low) during I/O Cycles when the I/O address is on (PC Card I/O Mode) the Bus. -DMACK This is a DMA Acknowledge signal tha

Summary of the content on the page No. 11

TS1G~32GCF133 133X CompactFlash Card TS1G~32GCF133 TS1G~32GCF133 Signal Name Dir. Pin Description -VS1 O 33 Voltage Sense Signals. -VS1 is grounded on the Card and sensed by the Host so -VS2 40 that the CompactFlash Storage Card CIS can be read at 3.3 volts and -VS2 is (PC Card Memory Mode) reserved by PCMCIA for a secondary voltage and is not connected on the Card. -VS1 This signal is the same for all modes. -VS2 (PC Card I/O Mode) -VS1 This signal is the same for all modes.

Summary of the content on the page No. 12

TS1G~32GCF133 133X CompactFlash Card TS1G~32GCF133 TS1G~32GCF133 Electrical Specification The following tables indicate all D.C. Characteristics for the CompactFlash Storage Card. Unless otherwise stated, conditions are: Vcc = 5V ±10% Vcc = 3.3V ± 5% Absolute Maximum Conditions Input Power Input Leakage Current Input Characteristics Transcend Information Inc. 12

Summary of the content on the page No. 13

TS1G~32GCF133 133X CompactFlash Card TS1G~32GCF133 TS1G~32GCF133 Output Drive Type Output Drive Characteristics Transcend Information Inc. 13

Summary of the content on the page No. 14

TS1G~32GCF133 133X CompactFlash Card TS1G~32GCF133 TS1G~32GCF133 Signal Interface Transcend Information Inc. 14

Summary of the content on the page No. 15

TS1G~32GCF133 133X CompactFlash Card TS1G~32GCF133 TS1G~32GCF133 Notes: 1) Control Signals: each card shall present a load to the socket no larger than 50 pF 10 at a DC current of 700 μA low state and 150 μA high state, including pull-resistor. The socket shall be able to drive at least the following load 10 while meeting all AC timing requirements: (the number of sockets wired in parallel) multiplied by (50 pF with DC current 700 μA low state and 150 μA high state per socket). 2) Resi

Summary of the content on the page No. 16

TS1G~32GCF133 133X CompactFlash Card TS1G~32GCF133 TS1G~32GCF133 Ultra DMA Electrical Requirements Host and Card signal capacitance limits for Ultra DMA operation The host interface signal capacitance at the host connector shall be a maximum of 25 pF for each signal as measured at 1 MHz. The card interface signal capacitance at the card connector shall be a maximum of 20 pF for each signal as measured at 1 MHz. Series termination required for Ultra DMA operation Series termination

Summary of the content on the page No. 17

TS1G~32GCF133 133X CompactFlash Card TS1G~32GCF133 TS1G~32GCF133 Table: Ultra DMA Termination with Pull-up or Pull down Example Printed Circuit Board (PCB) Trace Requirements for Ultra DMA On any PCB for a host or device supporting Ultra DMA: The longest D[15:00] trace shall be no more than 0.5" longer than either STROBE trace as measured from the IC pin to the connector. The shortest D[15:00] trace shall be no more than 0.5" shorter than either

Summary of the content on the page No. 18

TS1G~32GCF133 133X CompactFlash Card TS1G~32GCF133 TS1G~32GCF133 Attribute Memory Read Timing Specification Transcend Information Inc. 18

Summary of the content on the page No. 19

TS1G~32GCF133 133X CompactFlash Card TS1G~32GCF133 TS1G~32GCF133 Configuration Register (Attribute Memory) Write Timing Specification Transcend Information Inc. 19

Summary of the content on the page No. 20

TS1G~32GCF133 133X CompactFlash Card TS1G~32GCF133 TS1G~32GCF133 Common Memory Read Timing Specification Transcend Information Inc. 20


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