Intel CORETM 2 DUO MOBILE 320028-001 user manual

User manual for the device Intel CORETM 2 DUO MOBILE 320028-001

Device: Intel CORETM 2 DUO MOBILE 320028-001
Category: Computer Hardware
Manufacturer: Intel
Size: 1.58 MB
Added : 12/25/2013
Number of pages: 42
Print the manual

Download

How to use this site?

Our goal is to provide you with a quick access to the content of the user manual for Intel CORETM 2 DUO MOBILE 320028-001. Using the online preview, you can quickly view the contents and go to the page where you will find the solution to your problem with Intel CORETM 2 DUO MOBILE 320028-001.

For your convenience

If looking through the Intel CORETM 2 DUO MOBILE 320028-001 user manual directly on this website is not convenient for you, there are two possible solutions:

  • Full Screen Viewing - to easily view the user manual (without downloading it to your computer), you can use full-screen viewing mode. To start viewing the user manual Intel CORETM 2 DUO MOBILE 320028-001 on full screen, use the button Fullscreen.
  • Downloading to your computer - You can also download the user manual Intel CORETM 2 DUO MOBILE 320028-001 to your computer and keep it in your files. However, if you do not want to take up too much of your disk space, you can always download it in the future from ManualsBase.
Intel CORETM 2 DUO MOBILE 320028-001 User manual - Online PDF
Advertisement
« Page 1 of 42 »
Advertisement
Print version

Many people prefer to read the documents not on the screen, but in the printed version. The option to print the manual has also been provided, and you can use it by clicking the link above - Print the manual. You do not have to print the entire manual Intel CORETM 2 DUO MOBILE 320028-001 but the selected pages only. paper.

Summaries

Below you will find previews of the content of the user manuals presented on the following pages to Intel CORETM 2 DUO MOBILE 320028-001. If you want to quickly view the content of pages found on the following pages of the manual, you can use them.

Abstracts of contents
Summary of the content on the page No. 1

Intel® Core™ 2 Duo Mobile
Processors on 45-nm process for
Embedded Applications
Thermal Design Guide
June 2008
Order Number: 320028-001

Summary of the content on the page No. 2

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel Corporation may have

Summary of the content on the page No. 3

Core™ 2 Duo Mobile Processors—Contents Contents 1.0 Introduction ............................................................................................................. 6 1.1 Design Flow ....................................................................................................... 6 1.2 Definition of Terms ............................................................................................. 7 1.3 Reference Documents..........................................................

Summary of the content on the page No. 4

Figures—Core™ 2 Duo Mobile Processors Figures 1 Thermal Design Process..............................................................................................7 2 Primary Side Keep Out Zone Requirements— Micro-FCPGA ............................................ 12 3 Primary Side Keep Out Zone Requirements— Micro-FCBGA............................................ 13 4 Secondary Side Keep Out Zone Requirements.............................................................. 14 5 Processor Thermal

Summary of the content on the page No. 5

Core™ 2 Duo Mobile Processors—Tables Revision History Date Revision Description June 2008 1.0 First Public release. Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide TDG June 2008 5 Order Number: 320028-001

Summary of the content on the page No. 6

Introduction—Core™ 2 Duo Mobile Processors 1.0 Introduction The power dissipation of electronic components has risen along with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over the product’s life cycle, the heat generated by the device must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting, and/or the use of heatsinks. The goals of this document are to: • Identify the t

Summary of the content on the page No. 7

Core™ 2 Duo Mobile Processors—Introduction Figure 1. Thermal Design Process Step 1: Thermal Simulation • Package Level Thermal Models Step 2: Heatsink Design • Thermal Model User’s Guide and Selection • Reference Heatsinks • Reference Mounting Hardware Step 3: Thermal Validation • Vendor Contacts • Thermal Testing Software • Thermal Test Vehicle • User Guides 1.2 Definition of Terms Table 1. Definition of Terms (Sheet 1 of 2) Term Definition Flip Chip Pin Grid Array. A pin grid array

Summary of the content on the page No. 8

Introduction—Core™ 2 Duo Mobile Processors Table 1. Definition of Terms (Sheet 2 of 2) Term Definition Thermal Interface Material – the thermally conductive compound between the TIM heatsink and die. This material fills air gaps and voids, and enhances spreading of the heat from the die to the heatsink. A unit of measure used to define server rack spacing height. 1U is equal to 1.75 U inches, 2U equals 3.50 inches, etc. WWatt 1.3 Reference Documents The reader of this specification should als

Summary of the content on the page No. 9

Core™ 2 Duo Mobile Processors—Package Information 2.0 Package Information The Intel® Core™2 Duo Processor (XE and SV) is available in 478-pin Micro-FCPGA packages as well as 479-ball Micro-FCBGA packages. The Intel® Core™2 Duo Processor SFF processor (LV and ULV) is available in 956-ball Micro-FCBGA packages. The package mechanical dimensions can be found in the product’s datasheet. The Micro-FCBGA package incorporates land-side capacitors. The land-side capacitors are electrically conductiv

Summary of the content on the page No. 10

Thermal Specifications—Core™ 2 Duo Mobile Processors 3.0 Thermal Specifications 3.1 Thermal Design Power The Thermal Design Power (TDP) specification is listed in Table 2. Heat transfer through the micro- FCBGA, micro-FCPGA package and socket via the base board is negligible. The cooling capacity without a thermal solution is also minimal, so Intel requires the use of a heatsink for all usage conditions. 3.2 Maximum Allowed Component Temperature The device must maintain a maximum temperature a

Summary of the content on the page No. 11

Core™ 2 Duo Mobile Processors—Mechanical Specifications 4.0 Mechanical Specifications 4.1 Package Mechanical Requirements 4.1.1 Die Pressure/Load Upper Limit From a die mechanical integrity standpoint, the maximum allowable normal die load is the lesser of 2 2 15 lbs or 100 psi. Considering the 15 lbs load limit and the nominal die area of 1.45 cm (0.22 in. ), this equates to a die pressure of 66.7 psi (below 100 psi specification). Considering the maximum pressure specification, the die load

Summary of the content on the page No. 12

Mechanical Specifications—Core™ 2 Duo Mobile Processors Figure 2. Primary Side Keep Out Zone Requirements— Micro-FCPGA Notes: 1. Dimension in millimeters [inches]. Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications June 2008 TDG Order Number: 320028-001 12

Summary of the content on the page No. 13

Core™ 2 Duo Mobile Processors—Mechanical Specifications Figure 3. Primary Side Keep Out Zone Requirements— Micro-FCBGA Notes: 1. Dimension in millimeters [inches]. Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide TDG June 2008 13 Order Number: 320028-001

Summary of the content on the page No. 14

Mechanical Specifications—Core™ 2 Duo Mobile Processors Figure 4. Secondary Side Keep Out Zone Requirements Notes: 1. Dimension in millimeters [inches]. Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications June 2008 TDG Order Number: 320028-001 14

Summary of the content on the page No. 15

Core™ 2 Duo Mobile Processors—Thermal Solution Requirements 5.0 Thermal Solution Requirements 5.1 Thermal Solution Characterization The thermal characterization parameter, Ψ (“psi”), is used to characterize thermal solution performance, as well as compare thermal solutions in identical situations (i.e., heating source, local ambient conditions, etc.). It is defined by the following equation: Equation 1. Junction-to-Local Ambient Thermal Characterization Parameter (Ψ ) JA T −T J A Ψ = JA TDP Ψ

Summary of the content on the page No. 16

Thermal Solution Requirements—Core™ 2 Duo Mobile Processors Figure 5. Processor Thermal Characterization Parameter Relationships T T A A Ψ Ψ SA SA HEATSINK Ψ Ψ JA TIM T T S S Ψ Ψ TIM T J Device ® 5.1.1 Calculating the Required Thermal Performance for the Intel Core™2 Duo processor Overall thermal performance, Ψ is then defined using the thermal characterization parameter: JA, • Define a target component temperature T and corresponding TDP. JUNCTION • Define a target local ambient t

Summary of the content on the page No. 17

Core™ 2 Duo Mobile Processors—Thermal Solution Requirements It is evident from the above calculations that a reduction in the local ambient temperature can have a significant effect on the junction-to-ambient thermal resistance requirement. This effect can contribute to a more reasonable thermal solution including reduced cost, heatsink size, heatsink weight, or a lower system airflow rate. Table 3 summarizes the thermal budget required to adequately cool the Intel® Core™ 2 Duo Mobile Proces

Summary of the content on the page No. 18

Reference Thermal Solutions—Core™ 2 Duo Mobile Processors 6.0 Reference Thermal Solutions Intel has developed reference thermal solutions designed to meet the cooling needs of embedded form factor applications. This chapter describes the overall requirements for the reference thermal solution including critical-to-function dimensions, operating environment, and verification criteria. This document details solutions that are compatible with the AdvancedTCA* and Server System Infrastructure (1

Summary of the content on the page No. 19

Core™ 2 Duo Mobile Processors—Reference Thermal Solutions 6.2 Keep Out Zone Requirements The keep out zone requirements on the PCB to use this heatsink are detailed in Appendix B, “Mechanical Drawings”. Because it extends beyond the footprint of the device, it is critical for the board designer to allocate space on the board for the heatsink. 6.3 Thermal Performance The AdvancedTCA reference heatsink is an all copper (C1100) design. The performance of this heatsink has been tested at flow rat

Summary of the content on the page No. 20

Reference Thermal Solutions—Core™ 2 Duo Mobile Processors Figure 8. 1U Reference Heatsink Assembly 6.4.1 Keep Out Zone Requirements The keep out zone requirements on the PCB to use this heatsink are detailed in Appendix B, “Mechanical Drawings”. Because it extends beyond the footprint of the device, it is critical for board designers to allocate space for the heatsink. 6.4.2 Thermal Performance The 1U reference heatsink employs a thick copper (C1100) base with aluminum (Al 1050) stamped fins,


Alternative user manuals
# User manual Category Download
1 Intel 386 User manual Computer Hardware 7
2 Intel 8086-1 User manual Computer Hardware 12
3 Intel 87C196CA User manual Computer Hardware 8
4 Intel 8XC196Kx User manual Computer Hardware 2
5 Intel ARK |Core i7-4770K Processor BX80646I74770K User manual Computer Hardware 27
6 Intel AXXRAKSAS2 User manual Computer Hardware 1
7 Intel 430TX User manual Computer Hardware 16
8 Intel 32882 User manual Computer Hardware 1
9 Intel BX80605I7880 User manual Computer Hardware 1
10 Intel 80302 User manual Computer Hardware 1
11 Intel 6300ESB ICH User manual Computer Hardware 4
12 Intel 80C186EA User manual Computer Hardware 1
13 Intel 460GX User manual Computer Hardware 4
14 Intel 6700PXH User manual Computer Hardware 4
15 Intel BX80623I72600S User manual Computer Hardware 1
16 Sony MSAKIT-PC4A User manual Computer Hardware 2
17 Sony MRW62E-S1 2694866142 User manual Computer Hardware 5
18 Philips MATCH LINE 9596 User manual Computer Hardware 17
19 Sony 64GB SDHC Class 10 Memory Card Readers SF32UY User manual Computer Hardware 1
20 Philips PSC702 User manual Computer Hardware 1