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R
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Intel 6700PXH 64-bit PCI Hub
Thermal/Mechanical Design Guidelines
August 2004
Document Number: 302817-003
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R ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel may make
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R Contents 1 Introduction.....................................................................................................................7 1.1 Definition of Terms...............................................................................................7 1.2 Reference Documents .........................................................................................8 2 Packaging Technology...........................................................................................
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R Figures ® 2-1. Intel 6700PXH 64-bit PCI Hub Package Dimensions (Top View) .............................9 ® 2-2. Intel 6700PXH 64-bit PCI Hub Package Dimensions (Side View).............................9 ® 2-3. Intel 6700PXH 64-bit PCI Hub Package Dimensions (Bottom View) ......................10 5-1. Zero Degree Angle Attach Heatsink Modifications ...................................................16 5-2. Zero Degree Angle Attach Methodology (Top View) ................................
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R Revision History Revision Description Date Number -001 Initial release Jul 2004 -002 Added “reference thermal solution rails to PXH package” footprint drawing in Aug 2004 Section 6.5 -003 Removed inaccurate text in three graphics Sep 2004 ® Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines 5
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R Introduction ® 6 Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines
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R 1 Introduction As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks. The goals of this document are to: ® • Outline the thermal and Mechanical operating limits and specifications for the Intel 6700PXH 64-bit PCI Hub component. ® • Describe a reference thermal solutio
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R Introduction T Maximum die temperature allowed. This temperature is measured at the geometric center case_max of the top of the package die. T Minimum die temperature allowed. This temperature is measured at the geometric center case_min of the top of the package die. TDP Thermal design power. Thermal solutions should be designed to dissipate this target power level. TDP is not the maximum power that the chipset can dissipate. 1.2 Reference Documents The reader of this specificati
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R 2 Packaging Technology ® The Intel 6700PXH 64-bit PCI Hub component uses a 31 mm x 31 mm, 8-layer FC-BGA package (see Figure 2-1Figure 2-1Figure 2-1, Figure 2-2Figure 2-2Figure 2-2, and Figure 2-3Figure 2-3Figure 2-3). ® Figure 2-1. Intel 6700PXH 64-bit PCI Hub Package Dimensions (Top View) Die Handling Keepout 0.491 in. Exclusion Area Area 0.291 in. PXH 0.247 in. 17.00 mm 21.00 mm 31.00 mm Die 0.547 in. 0.200 in. 17.00 mm 21.00 mm 31.00 mm ® Figure 2-2. Intel 6700PXH 64-bit PCI Hu
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R Packaging TechnologyPackaging TechnologyPackaging Technology ® Figure 2-3. Intel 6700PXH 64-bit PCI Hub Package Dimensions (Bottom View) AD AC AB AA Y W V U T R P 4X 0.635 N 31.000 + 0.100 M L K J H G 4X 15.500 F E D 1.270 23X C + B A + 2 4 6 8 10 12 14 16 18 20 22 24 A 1 3 5 7 9 11 13 15 17 19 21 23 23X 1.270 (0.895) 8X 14.605 29.2100 31.000 + 0.100 B 0.200 C A NOTES: 1. All dimensions are in millimeters. 2. All dimensions and tolerances conform to ANSI Y14.5M-1994. 2.1 Package Mec
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R 3 Thermal Specifications 3.1 Thermal Design Power (TDP) Analysis indicates that real applications are unlikely to cause the PXH component to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption based on known platform benchmark applications. The resulting power consumption is referred to as the Thermal Design Power (TDP). TDP is the target power
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R Thermal SpecificationsThermal Simulation ® 12 Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines
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R 4 Thermal Simulation ® Intel provides thermal simulation models of the Intel 6700PXH 64-bit PCI Hub component and associated user's guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated, system-level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool “FLOTHERM”* (version 3.1 or higher) by Flomerics, Inc. These models are also available in IcePak*
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R Thermal SimulationThermal Simulation ® 14 Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines
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R 5 Thermal Metrology The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the PXH die temperatures. Section 5.1 provides guidelines on how to accurately measure the PXH die temperatures. 5.1 Die Case Temperature Measurements To ensure functionality and reliability, the T of the PXH must be maintained at or between the case maximum/minimum operating range
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R Thermal MetrologyThermal MetrologyThermal Metrology Figure 5-1. Zero Degree Angle Attach Heatsink Modifications NOTE: Not to scale. Figure 5-2. Zero Degree Angle Attach Methodology (Top View) Die Thermocouple Wire Cement + Thermocouple Bead Substrate 001321 NOTE: Not to scale. ® 16 Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines
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R 6 Reference Thermal Solution Intel has developed one reference thermal solution to meet the cooling needs of the PXH component under operating environments and specifications defined in this document. This chapter describes the overall requirements for the reference thermal solution including critical-to-function dimensions, operating environment, and validation criteria. Other chipset components may or may not need attached thermal solutions, depending on your specific system local-a
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R Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution 6.3 Mechanical Design Envelope While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on the PXH thermal solution are shown in Figure 6-2Figure 6-2Figure 6-2. When using heatsinks that extend beyond the PXH reference heatsink envelope shown in Figure 6-2Figure 6-2Figure 6-2, any motherboard compon
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R Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution Figure 6-3. Torsional Clip Heatsink Board Component Keepout Component keepout area 1.756 PXH 1.886 2x 0.943 Parallel Mean Airflow Direction Max component Height 0.50 2x 0.878 NOTE: All dimensions are in inches. Figure 6-4. Retention Mechanism Component Keepout Zones Component Keepout Area 0.500 2x 0.060 0.120 0.345 (0.345) 0.225 0.050" Component 0.170 0.750 See Detail Keepout A (0.165) Detail A 0.100 0.165
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R Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution 6.5.1 Heatsink Orientation Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned with the direction of the heatsink fins. Figure 6-5. Torsional Clip Heatsink Assembly Figure 6-6 Heatsink Rails to PXH Package Footprint 6.5.2 Extruded Heatsink Profiles The reference torsional clip heatsink uses an extruded heatsink for cooling the PXH component. Figure 6-7Fi
