Summary of the content on the page No. 7
TDA8946J Philips Semiconductors 2 x 15 W stereo BTL audio amplifier 9. Limiting values Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V supply voltage no signal - 0.3 +25 V CC operating - 0.3 +18 V V input voltage - 0.3 V + 0.3 V I CC I repetitive peak output current - 2 A ORM T storage temperature non-operating - 55 +150 °C stg T operating ambient temperature - 40 +70 °C amb P total power dissipation - 28 W tot
Summary of the content on the page No. 8
TDA8946J Philips Semiconductors 2 x 15 W stereo BTL audio amplifier MGU006 MGU005 50 50 handbook, halfpage handbook, halfpage I I q q (mA) (mA) 40 40 V = 18 V 30 30 CC 12 V 20 20 10 10 0 0 04 8 12 16 20 04 8 12 16 20 V (V) V (V) CC MODE Fig 3. Quiescent supply current as function of supply Fig 4. Quiescent supply current as function of mode voltage. voltage. 12. Dynamic characteristics Table 8: Dynamic characteristics V =18V; T =25 °C; R =8 Ω; f = 1 kHz; V = 0 V; measured in test circuit Figure 1
Summary of the content on the page No. 9
TDA8946J Philips Semiconductors 2 x 15 W stereo BTL audio amplifier MGU008 10 handbook, full pagewidth V o (V) 1 - 1 10 - 2 10 - 3 10 - 4 10 V = 18 V CC 12 V - 5 10 041 8 2 16 20 V (V) MODE Fig 5. Output voltage as function of mode voltage. MGU003 2 10 handbook, halfpage THD (%) 10 V = 12 V 18 V CC 1 - 1 10 - 2 10 - 2 - 1 2 10 10 1 10 10 P (W) o Fig 6. Total harmonic distortion as function of output power. 9397 750 06863 © Philips Electronics N.V. 2000. All rights reserved. Product specification R
Summary of the content on the page No. 10
TDA8946J Philips Semiconductors 2 x 15 W stereo BTL audio amplifier MGU004 10 handbook, full pagewidth THD (%) 1 V = 12 V CC P = 0.1 W o V = 18 V CC V = 12 V CC P = 1 W o V = 18 V CC - 1 10 - 2 10 2 3 4 5 6 10 10 10 10 10 10 f (Hz) No bandpass filter applied. Fig 7. Total harmonic distortion as function of frequency. MGU010 MGU011 20 20 handbook, halfpage handbook, halfpage P P o tot (W) (W) 16 16 R = 8 W L 12 12 R = 8 W L 8 8 16 W 16 W 4 4 0 0 04 8 12 16 20 04 8 12 16 20 V (V) V (V) CC CC THD = 1
Summary of the content on the page No. 11
TDA8946J Philips Semiconductors 2 x 15 W stereo BTL audio amplifier MGU013 MGU012 100 20 handbook, halfpage handbook, halfpage h P (%) (W) R = 8 W L 80 16 R = 16 W L 60 12 8 W 16 W 40 8 20 4 0 0 04 8 12 16 04 8 12 16 P (W) P (W) o o V =18V. V =18V. CC CC Fig 10. Efficiency as function of output power. Fig 11. Power dissipation as function of output power. MGU009 0 handbook, halfpage a cs (dB) - 20 - 40 - 60 - 80 - 100 2 3 4 5 10 10 10 10 10 f (Hz) No bandpass filter applied. Fig 12. Channel separat
Summary of the content on the page No. 12
TDA8946J Philips Semiconductors 2 x 15 W stereo BTL audio amplifier MGU007 0 handbook, full pagewidth SVRR (dB) - 20 - 40 B CH2 - 60 A CH1 - 80 2 3 4 5 10 10 10 10 10 f (Hz) V = 18 V; R =0 Ω; V = 700 mV (RMS); no bandpass filter applied. CC S ripple Curves A: inputs short-circuited Curves B: inputs short-circuited and connected to ground (asymmetrical application) Fig 13. Supply voltage ripple rejection as function of frequency. 9397 750 06863 © Philips Electronics N.V. 2000. All rights reserved.
Summary of the content on the page No. 13
TDA8946J Philips Semiconductors 2 x 15 W stereo BTL audio amplifier 13. Internal circuitry Table 9: Internal circuitry Pin Symbol Equivalent circuit 6 and 8 IN1+ and IN1- V CC 12 and 9 IN2+ and IN2- V V CC CC 1.5 kW 1.5 kW 8, 9 6, 12 45 kW 45 kW 1/2 V CC (SVR) MGL946 1 and 4 OUT1- and OUT1+ 14 and 17 OUT2- and OUT2+ 100 W 1, 4, 14, 17 40 W 1/2 V CC MGL947 10 MODE V CC V CC 1 kW 1 kW 20 kW V CC 10 OFF MUTE HIGH HIGH MGL949 11 SVR V CC Standby 20 kW 11 20 kW MGL948 9397 750 06863 © Philips Electron
Summary of the content on the page No. 14
TDA8946J Philips Semiconductors 2 x 15 W stereo BTL audio amplifier 14. Application information +V CC 100 nF 1000 m F 3 16 30 kW 220 nF R IN1- 8 s - 1 OUT1- R i Symmetrical C 45 kW i + input - 1.5 + R 1/2 V L CC - 1/2 V nF CC + 8 W 220 nF R i + 4 OUT1+ 45 kW 220 nF R s 6 - IN1+ Asymmetrical C TDA8946J i input 30 kW IN2- 9 220 nF - R 14 OUT2- i signal 45 kW + - GND 1.5 + R 1/2 V L CC - 1/2 V nF CC + 8 W R i + OUT2+ 17 45 kW V CC 12 - IN2+ V CC R 30 kW MODE 10 STANDBY/ MUTE LOGIC 20 kW SHORT CIRCUI
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TDA8946J Philips Semiconductors 2 x 15 W stereo BTL audio amplifier 54 mm idth 56 mm OUT2- ON MUTE OUT2+ +- 10 m F 17 IN2- 220 nF IN2+ 1.5 nF IN1- IN1+ 220 nF V CC 1 OUT1- 100 nF 1000 m F GND OUT1+ MGU069 Fig 15. Printed-circuit board layout (single-sided); components view. 14.1.2 Power supply decoupling Proper supply bypassing is critical for low-noise performance and high supply voltage ripple rejection. The respective capacitor locations should be as close as possible to the device and grounde
Summary of the content on the page No. 16
TDA8946J Philips Semiconductors 2 x 15 W stereo BTL audio amplifier 14.2 Thermal behaviour and heatsink calculation The measured maximum thermal resistance of the IC package, R is 4.5 K/W. th(j-mb) A calculation for the heatsink can be made, with the following parameters: T =50 °C amb(max) V = 18 V and R =8 Ω CC L T = 150 °C. j(max) R is the total thermal resistance between the junction and the ambient th(tot) including the heatsink. In the heatsink calculations the value of R is ignored. th(mb-h
Summary of the content on the page No. 17
TDA8946J Philips Semiconductors 2 x 15 W stereo BTL audio amplifier 16. Package outline DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1 non-concave D h x D E h view B: mounting base side d A 2 B j E A L 3 L Q c v M 117 e e w M m Z 1 2 b p e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) (1) (1) (1) UNIT A A b cDde D E e e E j LL m Q v w x Z 2 p h 1 2 h 3 17.0 4.6 0.75 0.48 24.0 20.0 12.2 3.4 12.4 2.4 2.1 2.00 mm 10 2.54 1.27 5.08 6 0.8 4.3 0.4 0.03 1
Summary of the content on the page No. 18
TDA8946J Philips Semiconductors 2 x 15 W stereo BTL audio amplifier 17. Soldering 17.1 Introduction to soldering through-hole mount packages This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. 17.2 Soldering by dipping or b
Summary of the content on the page No. 19
TDA8946J Philips Semiconductors 2 x 15 W stereo BTL audio amplifier 18. Revision history Table 11: Revision history Rev Date CPCN Description 02 20000314 - Product specification; second version; supersedes initial version TDA8946J-01 of 14 April 1999 (9397 750 04882). Modifications: Table 1 on page 1: SVRR; Typ value 65 dB → added • • Ordering options removed Figure 1 on page 2: Block diagram; pin numbers changed OUT2-→ 14 and OUT2+ → 17 • • Figure 2 on page 3: Pin configuration; pin numbers changed
Summary of the content on the page No. 20
TDA8946J Philips Semiconductors 2 x 15 W stereo BTL audio amplifier Table 11: Revision history…continued Rev Date CPCN Description 02 20000314 - Modifications: • Section 14.1 “Printed-circuit board (PCB)” on page 14: → added Figure 15: figure added • • Section 14.2 “Thermal behaviour and heatsink calculation” on page 16: → added Section 15 “Test information” on page 16: Section 15.1 → updated • • Section 15.2 “Test conditions” on page 16: → added 01 19990414 - Preliminary specification; initial vers