Philips TDA2616Q user manual

User manual for the device Philips TDA2616Q

Device: Philips TDA2616Q
Category: Stereo Amplifier
Manufacturer: Philips
Size: 0.07 MB
Added : 6/16/2013
Number of pages: 12
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Abstracts of contents
Summary of the content on the page No. 1

INTEGRATED CIRCUITS
DATA SHEET
TDA2616/TDA2616Q
2 x 12 W hi-fi audio power
amplifiers with mute
July 1994
Product specification
File under Integrated Circuits, IC01

Summary of the content on the page No. 2

Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifiers TDA2616/TDA2616Q with mute FEATURES GENERAL DESCRIPTION • Requires very few external components The TDA2616 and TDA2616Q are dual power amplifiers. The TDA2616 is supplied in a 9-lead single-in-line (SIL9) • No switch-on/switch-off clicks plastic power package (SOT131), while the TDA2616Q is • Input mute during switch-on and switch-off supplied in a 9-lead SIL-bent-to-DIL plastic power package • Low offset voltage be

Summary of the content on the page No. 3

Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifiers with TDA2616/TDA2616Q mute + V P handbook, full pagewidth 7 V A TDA2616 V ref1 20 kΩ 680 Ω CM V B 1 INV1 20 kΩ 4 OUT1 4 kΩ 2 MUTE – V P 5 kΩ + V P V ref3 10 kΩ + V P + V ref2 THERMAL V ref1 PROTECTION 3 1/2 V / GND P voltage comparator V V B 10 kΩ A – V ref2 – V – V P P 20 kΩ 6 OUT2 9 CM INV2 680 Ω 8 V B INV1, 2 20 kΩ V ref1 V A 5 MCD375 - 1 – V P Fig.1 Block diagram. July 1994 3

Summary of the content on the page No. 4

Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifiers with TDA2616/TDA2616Q mute PINNING FUNCTIONAL DESCRIPTION The TDA2616 is a hi-fi stereo amplifier designed for mains SYMBOL PIN DESCRIPTION fed applications, such as stereo radio and TV. The circuit - INV1 1 non-inverting input 1 is optimally designed for symmetrical power supplies, but MUTE 2 mute input is also well-suited to asymmetrical power supply systems. 1/2V /GND 3 1/2 supply voltage or ground P An output pow

Summary of the content on the page No. 5

Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifiers with TDA2616/TDA2616Q mute LIMITING VALUES In accordance with the Absolute maximum System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT ±V supply voltage - 21 V P I non-repetitive peak output current - 4A OSM P total power dissipation see Fig.3 - 25 W tot T storage temperature range - 55 +150 °C stg T crystal temperature - +150 °C XTAL T ambient operating temperature range - 25 150 °C amb t short circuit time

Summary of the content on the page No. 6

Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifiers with TDA2616/TDA2616Q mute CHARACTERISTICS SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply ±V supply voltage range - 16 21 V P I repetitive peak output current - 2.2 - A ORM Operating position; note 1 ±V supply voltage range 7.5 16 21 V P I total quiescent current R = ∞ 18 40 70 mA P L P output power O THD = 0.5% 10 12 - W THD = 10% 12 15 - W THD total harmonic distortion P = 6 W - 0.15 0.2 % O B power bandwid

Summary of the content on the page No. 7

Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifiers with TDA2616/TDA2616Q mute SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT ⎪ΔV ⎪ DC output offset voltage - 40 200 mV GND Operating position; note 6 I total quiescent current 18 40 70 mA P P output power O THD = 0.5% 5 6 - W THD = 10% 6.5 8 - W THD = 0.5%; R = 4Ω- 10 - W L THD = 10%; R = 4Ω- 14 - W L THD total harmonic distortion P = 4 W - 0.13 0.2 % O B power bandwidth THD = 0.5%; note 2 - 40 to - Hz 20 000 G voltag

Summary of the content on the page No. 8

Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifiers with TDA2616/TDA2616Q mute mute input + V P handbook, full pagewidth 2200 μF 2 7 680 Ω 20 kΩ 4 220 nF 1 V I 22 nF 20 kΩ 3 TDA2616 8.2 Ω R = 8 Ω L 20 kΩ 100 nF 220 nF 9 V I 6 22 nF 680 Ω 20 kΩ 8 8.2 Ω R = 8 Ω L 5 – V P MCD374 - 3 2200 μF Fig.4 Test and application circuit with symmetrical power supply. July 1994 8

Summary of the content on the page No. 9

Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifiers with TDA2616/TDA2616Q mute R V S P mute input V S handbook, full pagewidth 100 nF 2200 μF 2 2 7 680 Ω 20 kΩ 4 220 nF 1 V I 22 nF 680 μF 20 kΩ 3 8.2 Ω R = 8 Ω L internal TDA2616 100 μF 1/2 V P 20 kΩ 220 nF 9 V I 6 22 nF 680 μF 680 Ω 20 kΩ 8 8.2 Ω R = 8 Ω L 5 MCD373 - 2 Fig.5 Test and application circuit with asymmetrical power supply. July 1994 9

Summary of the content on the page No. 10

Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifiers with TDA2616/TDA2616Q mute PACKAGE OUTLINES SIL9P: plastic single in-line power package; 9 leads SOT131-2 non-concave D h x D E h view B: mounting base side d A 2 B E j A 1 b L c 19 e w M Q Z b p 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) A b 1 (1) (1) (1) UNIT A b cDdeD E EjL Q w x Z 2 p h h max. max. 4.6 0.75 0.48 24.0 20.0 12.2 3.4 17.2 2.1 2.00 mm 2.0 1.1 10 2.54 6 0.25 0.03 4.2 0.60 0.38 23.6 19

Summary of the content on the page No. 11

Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifiers with TDA2616/TDA2616Q mute DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm) SOT157-2 non-concave D h x D E h view B: mounting base side d A 2 B j E A L 3 L Q c 19 e m e w M v M Z 1 2 b p e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) (1) (1) (1) UNIT A A b cDdeD E e e E j LL m Q v w x Z 2 p h 1 2 h 3 17.0 4.6 0.75 0.48 24.0 20.0 12.2 3.4 12.4 2.4 2.1 2.00 mm 10 5.08 2.54 5.08 6 4.

Summary of the content on the page No. 12

Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifiers with TDA2616/TDA2616Q mute SOLDERING The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the Introduction specified maximum storage temperature (T ). If the stg max printed-circuit board has been pre-heated, forced cooling There is no soldering method that is ideal for all IC may be necessary immediately after soldering to keep the packages. Wave soldering is oft


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