Summary of the content on the page No. 1
DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D188
BGY148A; BGY148B
HF amplifier modules
1998 May 13
Product specification
Supersedes data of 1997 Jul 14
Summary of the content on the page No. 2
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B FEATURES PINNING - SOT421A • Single 6 V nominal supply voltage PIN DESCRIPTION • 3 W output power 1 RF input • Easy control of output power by DC voltage 2V C • Silicon bipolar technology 3V S • Standby current less than 100 μA. 4 RF output Flange ground APPLICATIONS • Portable communication equipment operating in the 400 to 440 MHz and 430 to 488 MHz frequency ranges handbook, halfpage respectively. DESCRIPTION The
Summary of the content on the page No. 3
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B CHARACTERISTICS Z =Z =50 Ω;P = 10 mW; V = 6 V; V ≤ 3.5 V; T =25 °C; unless otherwise specified. S L D S C mb SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT f frequency range BGY148A 400 - 440 MHz BGY148B 430 - 488 MHz I total quiescent current V = 0; P =0 -- 100 μA Q C D I control current adjust V for P =3W -- 500 μA C C L P load power 3 -- W L G power gain adjust V for P = 3 W 24.8 -- dB p C L η efficiency adjust V
Summary of the content on the page No. 4
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B MGD553 MGD554 5 60 handbook, halfpage handbook, halfpage P L η (W) 400 MHz (%) 4 440 MHz 440 MHz 400 MHz 40 3 2 20 1 0 0 01 2 3 4 0 12 3 4 P (W) V (V) C L Z =Z =50 Ω; P = 10 mW; V = 6 V; T =25 °C. Z =Z =50 Ω; P = 10 mW; V = 6 V; T =25 °C. S L D S mb S L D S mb Fig.3 Load power as a function of control voltage; Fig.4 Efficiency as a function of load power; BGY148A; typical values. BGY148A; typical values. MGD555 MGD5
Summary of the content on the page No. 5
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B MGD557 MGD558 4 - 30 3.0 handbook, halfpage V C VSWR H H in 2, 3 (V) (dBc) 2.5 3 - 40 H VSWR 3 in 2 2.0 H V 2 C - 50 1 1.5 0 1.0 - 60 380 400 420 440 380 400 420 440 460 460 f (MHz) f (MHz) Z =Z =50 Ω; P = 10 mW; V = 6 V; P = 3 W; T =25 °C. Z =Z =50 Ω; P = 2 mW; V = 4.8 V; P = 3 W; T =25 °C. S L D S L mb S L D S L mb Fig.7 Control voltage and input VSWR as functions Fig.8 Harmonics as a function of frequency; of fre
Summary of the content on the page No. 6
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B MGD559 MGD560 5 60 handbook, halfpage handbook, halfpage P 430 MHz L η (W) (%) 4 430 MHz 488 MHz 40 488 MHz 3 2 20 1 0 0 01 2 3 4 0 12 3 4 P (W) V (V) C L Z =Z =50 Ω; P = 10 mW; V = 6 V; T =25 °C. Z =Z =50 Ω; P = 10 mW; V = 6 V; T =25 °C. S L D S mb S L D S mb Fig.10 Load power as a function of control voltage; Fig.11 Efficiency as a function of load power; BGY148B; typical values. BGY148B; typical values. MGD561 MG
Summary of the content on the page No. 7
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B MGD563 MGD564 4 - 30 3.0 handbook, halfpage V H H C 2, 3 VSWR in (V) (dBc) 2.5 3 - 40 H 2 V C 2 2.0 - 50 H 3 VSWR in 1 1.5 - 60 0 1.0 - 70 420 420 440 460 480 500 440 460 480 500 f (MHz) f (MHz) Z =Z =50 Ω; P = 10 mW; V = 6 V; P = 3 W; T =25 °C. Z =Z =50 Ω; P = 2 mW; V = 4.8 V; P = 3 W; T =25 °C. S L D S L mb S L D S L mb Fig.14 Control voltage and input VSWR as functions Fig.15 Harmonics as a function of frequency;
Summary of the content on the page No. 8
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B SOLDERING The indicated temperatures are those at the solder MGM159 300 interfaces. handbook, halfpage Advised solder types are types with a liquidus less than or T equal to 210 °C. (°C) Solder dots or solder prints must be large enough to wet 200 the contact areas. Soldering can be carried out using a conveyor oven, a hot air oven, an infrared oven or a combination of these ovens. A double reflow process is permitt
Summary of the content on the page No. 9
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B 22.6 handbook, full pagewidth DETAIL 2 0.8 0.4 1.7 2 1.5 8.45 1 2.9 2.7 0.6 2.7 0.1 1.1 1.1 2.4 2.6 0.1 7.48 DETAIL 15.1 0.5 0.7 MGK391 20.18 footprint metallization solder area. 21.8 handbook, full pagewidth 2 0.8 2 2 7.05 1.7 3.2 2 1.8 7.08 14.7 MGK392 19.78 solder area. Dimensions in mm. Fig.18 SOT421A footprint. 1998 May 13 9
Summary of the content on the page No. 10
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B PACKAGE OUTLINE Ceramic single-ended flat package; 4 in-line leads SOT421A U D A y Z E U 1 L Q 12 3 4 b wM c e d e e 1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b cD dE e e L Q U U wy Z 1 1 3.0 0.56 0.30 22.1 2.4 13.4 0.7 3.4 22.4 8.2 0.25 mm 5.08 7.62 0.25 0.15 2.6 0.46 0.20 21.7 2.0 13.0 0.3 3.0 22.0 7.8 0.05 REFERENCES OUTLINE EUROPEAN ISSUE DATE PROJECTION VERSION IEC JEDEC EIAJ SOT42
Summary of the content on the page No. 11
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 1
Summary of the content on the page No. 12
Philips Semiconductors – a worldwide company Argentina: see South America Middle East: see Italy Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Tel. +31 40 27 82785, Fax. +31 40 27 88399 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Fax. +43 160 101 1210 Tel. +64 9 849 4160, Fax. +64 9 849 7811 Belarus: Hotel Min
