Summary of the content on the page No. 1
ADS5423/24/33 and ADS5411 EVM
User Guide
User's Guide
February 2006
SLWU020B
Summary of the content on the page No. 2
2 SLWU020B–February 2005–Revised February 2006 Submit Documentation Feedback
Summary of the content on the page No. 3
Contents 1 Overview ................................................................................................................... 5 1.1 Purpose .............................................................................................................. 5 1.2 EVM Basic Functions............................................................................................... 5 1.3 Power Requirements .............................................................................................
Summary of the content on the page No. 4
List of Figures 4-1 Top Layer.................................................................................................................... 11 4-2 Layer 2, Ground Plane .................................................................................................... 12 4-3 Layer 3, Power Plane #1.................................................................................................. 13 4-4 Layer 4, Power Plane #2.................................................................
Summary of the content on the page No. 5
Chapter 1 SLWU020B–February 2005–Revised February 2006 Overview This User’s Guide document gives a general overview of the ADS5423/24/33 and ADS5411 evaluation module (EVM) and provides a general description of the features and functions to be considered while using this module. 1.1 Purpose The EVM provides a platform for evaluating the ADS5423/24/33 14-bit analog-to-digital converter (ADC) under various signals, references, and supply conditions. This evaluation module also allows the evaluatio
Summary of the content on the page No. 6
www.ti.com EVM Operational Procedure Table 1-1. Three Pin Jumper List Table JUMPER FUNCTION LOCATION: PINS 1–2 LOCATION: PINS 2–3 DEFAULT SJP3 Provides AIN+ source to ADC Source provided from T2 Source provided from Diff Amp 1–2 device SJP4 Provides AIN– source to ADC Source provided from Diff Amp Source provided from T2 2-3 device 2. Connect supplies to the EVM as follows: +5 V (4.75 V–5.25 V) ADC analog supply to J3 and return to J2. +3.3 V (3 V–3.6 V) digital buffer supply to J4 and J1 and re
Summary of the content on the page No. 7
Chapter 2 SLWU020B–February 2005–Revised February 2006 Circuit Description 2.1 Schematic Diagram The schematic diagram for the EVM is attached at the end of this document. 2.2 Circuit Function The following paragraphs describe the function of EVM circuits. See the relevant data sheet for the device operating characteristics. 2.2.1 Analog Inputs The EVM can be configured to provide the ADC with either transformer-coupled or differential amplifier inputs from a single-ended source. The default con
Summary of the content on the page No. 8
www.ti.com Circuit Function Table 2-1. Output Connector J9 J9 PIN DESCRIPTION J9 PIN DESCRIPTION 1 CLK 21 DATA BIT 6 2 GND 22 GND 3 NC 23 DATA BIT 7 4 GND 24 GND 5 NC 25 DATA BIT 8 6 GND 26 GND 7 NC 27 DATA BIT 9 8 GND 28 GND 9 DATA BIT 0 (LSB) 29 DATA BIT 10 10 GND 30 GND 11 DATA BIT 1 31 DATA BIT 11 12 GND 32 GND 13 DATA BIT 2 33 DATA BIT 12 14 GND 34 GND 15 DATA BIT 3 35 DATA BIT 13 (MSB) 16 GND 36 GND 17 DATA BIT 4 37 OVERFLOW 18 GND 38 GND 19 DATA BIT 5 39 DRV DD 20 GND 40 GND Table 2-2. Te
Summary of the content on the page No. 9
Chapter 3 SLWU020B–February 2005–Revised February 2006 Parts List Table 3-1 lists the parts used in constructing the EVM Table 3-1. Bill of Materials for EVM VALUE QTY PART NUMBER VENDOR REF DES NOT INSTALLED CAPACITORS 0.1 μF, 25 V, +80/–20% 4 ECJ-0EF1E104Z Panasonic C1, C2, C3, C4 Capacitor 0.01 μF, 25 V, +80/–20% 6 ECJ-0EF1E103Z Panasonic C30, C31, C32, C33, Capacitor C34, C35 220 pF, 50 V, 5%, Capacitor 6 ECJ-OEC1H221J Panasonic C41–C46 22 pF, 50 V, 5%, Capacitor 1 ECJ-1VC1H220J Panasonic C2
Summary of the content on the page No. 10
www.ti.com Table 3-1. Bill of Materials for EVM (continued) VALUE QTY PART NUMBER VENDOR REF DES NOT INSTALLED ICs ADS5423/24/33 or ADS5411 1 ADS5423/24/33 or Texas Instruments U1 ADS5411 SN74AVC16244 1 SN74AVC16244DGG Texas Instruments U2 THS4503 1 THS4503 Texas Instruments U3 THS4601 1 THS4601 Texas Instruments U4 Surface Mount Jumper Location: SJP3 (2–1), SJP4 (2–3) 10 Parts List SLWU020B–February 2005–Revised February 2006 Submit Documentation Feedback
Summary of the content on the page No. 11
Chapter 4 SLWU020B–February 2005–Revised February 2006 Physical Description This chapter describes the physical characteristics and PCB layout of the EVM and lists the components used on the module. 4.1 PCB Layout The EVM is constructed on a 6-layer, 4.77-inch × 3.4-inch, 0.062-inch thick PCB using FR-4 material. The individual layers are shown in Figure 4-1 through Figure 4-6. Figure 4-1. Top Layer SLWU020B–February 2005–Revised February 2006 Physical Description 11 Submit Documentation Feedbac
Summary of the content on the page No. 12
www.ti.com PCB Layout Figure 4-2. Layer 2, Ground Plane 12 Physical Description SLWU020B–February 2005–Revised February 2006 Submit Documentation Feedback
Summary of the content on the page No. 13
www.ti.com PCB Layout Figure 4-3. Layer 3, Power Plane #1 SLWU020B–February 2005–Revised February 2006 Physical Description 13 Submit Documentation Feedback
Summary of the content on the page No. 14
www.ti.com PCB Layout Figure 4-4. Layer 4, Power Plane #2 14 Physical Description SLWU020B–February 2005–Revised February 2006 Submit Documentation Feedback
Summary of the content on the page No. 15
www.ti.com PCB Layout Figure 4-5. Layer 5, Ground Plane SLWU020B–February 2005–Revised February 2006 Physical Description 15 Submit Documentation Feedback
Summary of the content on the page No. 16
www.ti.com PCB Layout Figure 4-6. Layer 6, Bottom Layer 16 Physical Description SLWU020B–February 2005–Revised February 2006 Submit Documentation Feedback
Summary of the content on the page No. 17
www.ti.com Schematics 4.2 Schematics SLWU020B–February 2005–Revised February 2006 Physical Description 17 Submit Documentation Feedback
Summary of the content on the page No. 18
1 2 3 4 5 6 D D +VCC J10 SMA_PCB_MT_MOD R17 R14 R6 1 J5 T3 499 499 24.9 SMA_PCB_MT_MOD C1 ADT 4-1WT U3 1 3 4 CLK+ R10 CLK+ (Sh 2) 49.9 THS4503 .1uF C C R4 NC +VCC 5 2 49.9 C2 8 5 C26 + 1 6 CLK- VCM CLK- (Sh 2) VOUT- .1uF 2 20pF VOCM C40 R23 VOUT+ .1uF 1 4 - 49.9 -VCC -VCC -VCC U4 2 6 R24 3 VREF VREF (Sh 2) R16 R15 R27 0 THS4601 499 499 24.9 +VCC R18 49.9 (2-1) R11 2 AIN+ SJP3 AIN+ (Sh 2) B B 24.9 J11 (2-1) SMA_PCB_MT_MOD T2 ADT 1-1WT 1 1 6 R2 36.5 R13 R9 5 2 200 49.9 R3 36.5 (Note 1) (Note 1
Summary of the content on the page No. 19
1 2 3 4 5 6 D D 3.3V_DVDD J14 RED VREF (Sh 1) VREF C25 1 39 C C .1uF DVDD D3 2 38 AVSS D2 3 37 J17 VBG D1 BLACK 4 36 VSS D0 U1A CLK+ 5 35 (Sh 1) CLK+ +ENC DMID CLK- 6 ADS5424 34 (Sh 1) CLK- -ENC DVSS 7 33 LVSS DVDD 8 32 LVDD OVR 9 31 CVDD DNC 10 30 CVSS AVDD AIN+ 11 29 (Sh 1) AIN+ +AIN ADVSS AIN- 12 28 (Sh 1) AIN- -AIN ADVDD 13 27 AVSS PBKG B B 5V_AVDD C3 C4 .1uF .1uF U1B ADS5424 61 86 PPAD PPAD 62 85 PPAD PPAD 63 84 PPAD PPAD 64 83 PPAD PPAD 65 82 PPAD PPAD 66 81 PPAD PPAD 67 80 PPAD PPAD 68 79
Summary of the content on the page No. 20
1 2 3 4 5 6 D D DRVDD C16 C17 C18 C19 C20 C21 C22 C23 C15 + .1uF .1uF .1uF .1uF 470pF 470pF 470pF 470pF 10uF U2 SN74AVC16244DGG 25 24 3 OE 4 OE R1 DRY 26 23 (SH 1) DRY 4A4 4Y4 220 27 22 4A3 4Y3 28 21 GND GND R7 DRVDD 29 20 0 R5 4A2 4Y2 1 16 CLK D13 1 16 30 19 2 15 D13 4A1 4Y1 D12 2 15 3 14 J9 D12 31 18 D11 3 14 VCC VCC 4 13 C C D11 39 40 D10 4 13 32 17 5 12 OVR/ D10 3A4 3Y4 37 38 D9 5 12 6 11 D9 33 16 35 36 D8 6 11 3A3 3Y3 7 10 D8 33 34 D7 7 10 34 15 8 9 D7 GND GND 31 32 D6 8 9 D6 35 14 29 30 3A
