Z Microsystems Multi Processor Unit Z MPU user manual

Summary of the content on the page No. 1

Z Microsystems
ZZM MPPUU
ZMPU
ZZM MPPUU
FIELD FIELD--READ READY Y
FIELD FIELD FIELD---READ READ READY Y Y

Summary of the content on the page No. 2

System Overview System 1.0 Z MPU Z MPU Z MPU Z MPU Z MPU • Shared Chassis -- Shared Peripherals • Less space, less weight, less power, less cost The rugged Z MPU delivers four independent computers. Each computer is an Intel or Sun COTS computer encased in its own environmentally sealed hot swappable module. Each computer is a complete stand alone system with its own dedicated boot disk. 1.1 Sealed 1.1 Sealed • Hot swappable Sealed Computer Modules (SCM) and Disk modules • Mix & match platforms

Summary of the content on the page No. 3

Component Overview TranzPak 7 SCM 2.0 2.1 Hot swap TranzPak 7 Modules contain Hot swap SCM’s contain environmentally sealed COTS motherboards. Keep your environmentally sealed IDE or SCSI hard drives. configurations current with the latest Intel/Sun motherboards. Internal DC Power Input External I/O 2.2 Inside Look and Switched USB Connectors Transition Board Dedicated 28 VDC Power and ATX Interface Board PCI Card Heatsinks conduct thermal energy to module cover for dispersion Dedicated Disk (S

Summary of the content on the page No. 4

Shared Peripherals & System Administration 3.0 Peripheral Sharing • Shared Peripheral Clusters The Peripheral Device Layer organizes an array of the most popular USB devices (CDW, floppy, PCMCIA) and an external hub into four switchable clusters that can be individually and dynamically switched to any SCM. Peripheral Cluster 3.1 • Maximum Flexibility Each SCM has two independent internal USB busses that are assignable to any of the four peripheral clusters. Peripheral assignments can be made l

Summary of the content on the page No. 5

Z Microsystems - Multi Processor Unit System Architecture 6.0 F Future Proof T uture Proof Technolog echnology Inser y Insertion tion F F Future Proof T uture Proof T uture Proof Technolog echnolog echnology Inser y Inser y Insertion tion tion (SCM) Sealed TranzPak 7 computer removable module disk module stack External connector transition board DC Power In Peripheral clusters Quad modulated fan array provides front to back cooling Fan array Switched control peripheral board and power distributi

Summary of the content on the page No. 6

7.0 Schematics 7.1 Specifications 7.2 Options Motherboards Intel and Sun ATX form Shipping Humidity 5% to 95% Non condensing factor Non Op. Altitude -1,300 to 40,000 ft. Storage Options SCSI and/or IDE Operating Altitude -1,300 to 10,000 ft. Dimensions 10.5” H x 17.5" W x 22" D Operating Vibration Wheeled and tracked vehicles, fixed Net Weight 110 lbs. (depending on and rotary wing aircraft. device) Mil-Std-167 (in transit case) Z MPU 2X Power Shock Operating Mil-Std-810E, Method 516, 30g’s DC V