Summary of the content on the page No. 1
DI SASSEMBLY PROCEDURE
Chapter
3
Disassembly Procedure
Please follow the information provided in this section to perform the complete
disassembly procedure of the notebook. Be sure to use proper tools
described before.
SUS M6000 Series Notebook consists of various modules. This chapter describes the
procedures for the complete notebook disassembly. In addition, in between procedures,
the detailed disassembly procedure of individual modules will be provided for your
A
service needs.
Summary of the content on the page No. 2
DI SASSEMBLY PROCEDURE Battery Module BATTERY The illustration below shows how to remove the battery module. 1. Press latch to open the battery module, then lift battery module away from the system. HDD Module HDD MODULE The illustrations below show how to remove the HDD module from the notebook. Removing HDD Module HDD MODULE Remove 2 screws(M2*6L(K)), then remove the HDD cover and pull the hard disk module toward REMOVAL the direction of the arrow and lift it up and tak
Summary of the content on the page No. 3
DI SASSEMBLY PROCEDURE M2*3L Optical Drive Module OPTI CAL Press latch here then pull it out. DRIVE REMOVAL Keyboard Module KEYBOARD The illustration of below shows how to remove the keyboard DI SASSEMBLY Removing Keyboard Cover K/B COVE R 1. Remove 2 screws (M2.5*6L(K)) on the bottom case. REMOVAL M2.5*6L 3 - 3
Summary of the content on the page No. 4
DI SASSEMBLY PROCEDURE 2. Unlock 3 keyboard latches then pull out the keyboard forward and lay the keyboard on the front side . 3. Remove 2 screws on the keyboard cover , then use tweezers to disconnect the keyboard two covers and lift it up. M2*3L 4. Loosen the switch board cable and take the keyboard cover away , then remove the switch cable 5. Remove 7 screws and take the switch board away. 3 - 4
Summary of the content on the page No. 5
DI SASSEMBLY PROCEDURE M2*3L CPU Module CPU MODULE The illustrations below show how to remove the CPU module from the notebook. REMOVAL Removing CPU CPU 1. Take the Fan bracket away then remove 4 screws (M2*6L(K)). REMOVAL M2*6L 2. Remove Thermal module and open the CPU Socket’s latch to loosen the CPU.(The use the CPU vacuum hand pump to “suck up” the CPU and lift the CPU away.) 3 - 5
Summary of the content on the page No. 6
DI SASSEMBLY PROCEDURE First Memory Module FI RST The first memory module is under keyboard. Open the two latches to pop up memory module at MEMORY 45 degrees angle then pull it out . MODULE REMOVAL Mini PCI Module WIRELES S This slot usually has Wireless LAN module when leaving the factory, this slot is for LAN MODULE optional system upgrade. Removing Wireless LAN Module WIRELES S 1. Remove 1 screw(M2*3L(K)), then take the mini-PCI cover off. LAN REMOVAL M2*3L 2.
Summary of the content on the page No. 7
DI SASSEMBLY PROCEDURE LCD Module LCD The illustrations below show how to remove and disassemble the LCD module. The MODULE module contains LCD panel, Inverter board, LCD Hinge bracket, Hinge cover, LCD front cover, LCD back cover Removing LCD Module LCD REM O VAL 1. Disconnect LCD coaxial cable and Inverter cable , then detach the left hinge cover and the right hinge cover. 2. Remove 2 screws (M2.5*6L(K)) at bottom case. M2.5*6L M2.5*6LL 3. Remove 2 pads
Summary of the content on the page No. 8
DI SASSEMBLY PROCEDURE 4. Remove 2 screws(M2.5*6L(K)) at top side, then lift the LCD module away from the system. M2.5*6L Disassembling LCD Module LCD 1. Remove 4 rubber pads and 4 screws(M2.5*6L(K)) from LCD module. DI SASSEMBLY M2.5*6L 2. Prying the inside edges of the top front bezel, then separate it from LCD back cover and take LCD front bezel away. 3. Remove 1tape and the other tape here. 3 - 8
Summary of the content on the page No. 9
DI SASSEMBLY PROCEDURE 4. Disconnect the speaker cable and LCD cable then take Inverter board off. 5. Remove 8 screws (M2*3L(K) x 4 ,(M2*6L(K) x2 ,(M2.5*4L(K) x 2) and 2 fixed slices off , then take the LCD Bracket away. M2.5*4L 6. Remove 7 tapes 、2 screws and 2 screws(M2*3L(K)) on the other side. 3 - 9
Summary of the content on the page No. 10
DI SASSEMBLY PROCEDURE M2*3L 7. Detach the right & left antenna and its cable. 8. Reomve the speaker cable, then remove 1screw(M2*3L(K)) and 1 screw on the other TOP CASE side.Then take two speaker s away MODULE M2*3L speaker 9. Detach the LCD hooker and spring then take it away. 3 - 10
Summary of the content on the page No. 11
DI SASSEMBLY PROCEDURE 10. Remove 1 screw (M2.5*4L(K)) and 1 screw on the other side, then take right and lift hinge off. M2.5*4L M2.5*4L 11. Remove 2 tapes and dissconnect coaxial cable then take it away. 12. Finally, Remove 4 screws(M2*3L(K)) on the right LCD bracket , and 4 screws on the ilft side to disassemble LCD brackets. 3 - 11
Summary of the content on the page No. 12
DI SASSEMBLY PROCEDURE M2*3L M2*3L Top Case Module The illustrations below show how to disassemble and remove the top case module of the notebook. Removing Top Case Module TOP CASE 1. Remove 5 screw pads and 5 screws(M2*3L*(K)) on top side. MODULE REMOVE M2*3L 2. Remove 7 screws (M2*6L(K)) on top case and 16 screws (M2*3L(K)+M2*6L(K)) on bottom case. M2*6L M2*3L 3 - 12
Summary of the content on the page No. 13
DI SASSEMBLY PROCEDURE M2*6L M2*3L M2*6L Removing touch pad 3. Loosen the touch pad FPC cable then separate the top case module from the bottom case module. 4. Disconnect touch pad FPC cable and remove 5 screws(M2*3L(K)) then take touch pad backet off and take touch pad away. M2*3L Motherboard module MOTHERBOARD The illustrations below show how to disassemble and remove the Motherboard module MODULE Removing Motherboard Module MDC MODULE 1. Remove the
Summary of the content on the page No. 14
DI SASSEMBLY PROCEDURE M2*6L 2. Take the VGA heat sink module away and remove 2 tapes then disconnect modem cable. MOTHERBOARD REMOVAL 3. Loosen the audio FPC and FAN cable. 4. Remove 1 screw(M2*6L(K)) then take the optical drive FPC away. 3 - 14
Summary of the content on the page No. 15
DI SASSEMBLY PROCEDURE M2*6L 5. Take the optical drive FPC away and remove 6 screws(M2*6L(K)). M2*6L 6. Remove the audio FPC and pull out the card reader dummy & PCMCIA dummy. Finally, pull out the motherboard from the bottom case carefully. 3 - 15
Summary of the content on the page No. 16
DI SASSEMBLY PROCEDURE Bottom Case Module BOTTOM The illustrations below show how to disassemble and remove the bottom case CASE module of the notebook. MODULE 1. Remove 2 screws(M2*3L(K)) then take the modem board away. M2*3L 2. Remove 1 screw tape then loosen the speaker cable. 3. Remove 1 screw (M2*3L(K)) then take the LED board away. 3 - 16
Summary of the content on the page No. 17
DI SASSEMBLY PROCEDURE M2*3L 4. Remove 1 screw (M2*6L(K)) then remove the MIC out the hole and pull out the audio board upward then take it away. M2*6L 5. Remove 1 tape then take the MIC away. 6. Use tweezers to lift modem cable up then take it away 3 - 17
Summary of the content on the page No. 18
DI SASSEMBLY PROCEDURE 7. Remove 1 screw (M2*6L(K)) and 1 screw on the other side and then take 2 speakers away. M2*6L M2*6L 8. Finally, Remove 2 screws (M2.5*4L(K)) then take the FAN module away. M2.5*4L 3 - 18
