Summary of the content on the page No. 1
MDR-IF4000
SERVICE MANUAL US Model
Canadian Model
Ver. 1.1 2005. 02
AEP Model
E Model
• The MDR-IF4000 is the cordless stereo
headphones that comprises the MDR-
DS4000.
• MDR-DS4000 consists of the following models respectively.
Cordless stereo headphone MDR-IF4000
Digital surround processor DP-IF4000
SPECIFICATIONS
General
Modulation System
DQPSK-IM
Secondary carrier wave frequency
3.75 MHz
Playback frequency range
10 – 22,000 Hz
Power requirements
Rechargeable nickel-metal hydride
batteri
Summary of the content on the page No. 2
MDR-IF4000 Notes on chip component replacement TABLE OF CONTENTS • Never reuse a disconnected chip component. Specifications ............................................................................ 1 • Notice that the minus side of a tantalum capacitor may be damaged by heat. 1. GENERAL ................................................................... 3 Unleaded solder Boards requiring use of unleaded solder are printed with the lead 2. DISASSEMBLY free mark (LF) indicating the solder cont
Summary of the content on the page No. 3
MDR-IF4000 SECTION 1 This section is extracted from instruction manual. GENERAL LOCATING THE CONTROLS 1 Ear pad (left) 5 Self-adjusting band 2 Battery case button 3 Battery case 6 VOL (Volume) control 7 Ear pad (right) 8 POWER indicator
Summary of the content on the page No. 4
MDR-IF4000 SECTION 2 DISASSEMBLY • This set can be disassembled in the order shown below. 2-1. DISASSEMBLY FLOW SET 2-2. FRONT PLATE (R) ASSY 2-6. FRONT PLATE (L) ASSY (Page 4) (Page 6) 2-3. RX BOARD 2-7. BATT BOARD (Page 5) (Page 7) 2-4. HANGER (R) 2-8. HANGER (L) (Page 5) (Page 7) 2-9. WIRING ON THE 2-5. WIRING ON THE LEFT SIDE RIGHT SIDE (Page 8) (Page 6) 2-10.HANGER LID (L) (Page 8) 2-11.WIRING ON THE SW BOARD (Page 9) 2-12.HOW TO HANG THE TENSDION SPRING (Page 9) Note: Follow the disasse
Summary of the content on the page No. 5
MDR-IF4000 2-3. RX BAORD 1 Removal the solder at 9 places. Note for installation : Solder the leads at the places shown below with attention to their colors. housing (R) assy BLK WHT 2 to BATT board and driver (L-CH) natural 3 RX board cushion (B) GRN RED to PD2 board to driver (R-CH) GRN to BATT board natural RED and driver (L-CH) natural 2-4. HANGER (R) 1 two screws (P2.6 x 6) hanger lid (R) Pay attention to the leads when as
Summary of the content on the page No. 6
MDR-IF4000 2-5. WIRING ON THE RIGHT SIDE RD1 board (R-CH front) RD2 board (R-CH rear) 2-6. FRONT PLATE (L) ASSY 4 Removal the solder at 2 places. Note for installation : Solder the leads at the places shown below with attention to their colors. driver (R-CH) side housing (L) assy Connect a green lead to the marked one of the driver terminals. GRN natural natural 2 two screws RED (P 2.6x6) GRN from RX board 1 ear pad (L) 5 f
Summary of the content on the page No. 7
MDR-IF4000 2-7. BATT BOARD 1 Removal the solder at 4 places. Note for installation : Solder the leads at the places shown below with attention to their colors. housing (L) assy natural GRN RED to RX board 4 BATT board RED to RX board to SW board natural RED 3 GRN to driver (L-CH) 2 two screws (P 2.6x6) 2-8. HANGER (L) 1 two screws (P2.6 x 6) hanger lid (L) Pay attention to the leads when assembling. projection 2 5 hanger (L)
Summary of the content on the page No. 8
MDR-IF4000 2-9. WIRING ON THE LEFT SIDE RD2 board (L-CH front) RD1 board (L-CH rear) 2-10. HANGER LID (L) 1 screw (P2.6 x 6) 2 screw (P2.6 x 6) 3 head band hanger lid (L) 8
Summary of the content on the page No. 9
MDR-IF4000 2-11. WIRING ON THE SW BOARD SW board head band cushion (B) 2-12. HOW TO HANG THE TENSION SPRING Note for installation : Insert the end of the suspender assy under the S701 on SW board. hanger lid (L) suspender assy SW board tension spring suspender assy housing (L) assy S701 9
Summary of the content on the page No. 10
MDR-IF4000 SECTION 3 DIAGRAMS NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. For printed wiring boards. For schematic diagrams. Note: Note: • All capacitors are in µF unless otherwise noted. (p: pF) • X : parts extracted from the component side. • Y : parts extracted from the conductor side. 50 WV or less are not indicated except for electrolytics and tantalums. • f : internal component. 1 • : Pattern from the side which enables seeing. • All resistors are in Ω and / W or less unless ot
Summary of the content on the page No. 11
MDR-IF4000 3-2. BLOCK DIAGRAM IC101 IC201 IR RECEIVER/DSP D/A CONVERTER IC302 HEADPHONE RV201 D401-408 AMP IC001 SCKI VOL APX 31 16 IR FRONTEND 5 RECEIVER SP002 SPEAKER 9 4 VOUTL AMP DAOUT/ (L CH) SID/ ROUT 8 IN OUT ADIN 60 2 DATA Q302 5 I/V GCA/ 16 10 A/D BCK/RCLK MUTE BPF 54 3 BCK LRCK/RCS 59 1 LRCK 5 SP001 SPEAKER VOUTR 8 4 PD (R CH) 8 4 Q301 RAM MUTE IC301 HEADPHONE Q101 AMP MUTE 61 DTVALID DRIVE XRST 13 1 VOUT VDD 2 +2.5V CONTROL IC102 RESET S701 S701 IC501 AUTO +1.5V ON/OFF REGULATOR IC601
Summary of the content on the page No. 12
1 8 4 5 C119 C125 C126 C120 C113 C110 C107 C112 C101 C203 C303 C312 C501 C509 D502 MDR-IF4000 3-3. PRINTED WIRING BOARD – RECEIVER SECTION – : Uses unleaded solder. 1 2 3 4 5 6 7 8 9 10 ( ) ( ) RX BOARD SIDE A RX BOARD SIDE B +B SIG PD2 BOARD A SIG +B ( ) R-CH REAR SECTION SIG 3 1 1-864-939- 11 4 5 (11) 12 1 32 17 33 16 SIG +B PD1 BOARD +B B (R-CH FRONT SECTION) 13 24 1 48 49 64 1-864-938- 11 ( ) (11) GRN BATT BOARD A (Page 13) SIG (NAT) +B E PD1 BOARD +B 1 16 ( ) L-CH REAR SECTION C ( ) R
Summary of the content on the page No. 13
C510 C603 C511 C508 C516 C513 C605 MDR-IF4000 3-4. PRINTED WIRING BOARD – POWER SECTION – : Uses unleaded solder. 2 3 4 5 6 7 1 BATT BOARD A S601 S602 ( ) ( ) BATT DET BATT DET 3 B BAT101 RECHARGEABLE BATTERY 1 BP–HP550 1.2V 550mAh. 2PCS RX BOARD C Suffix-11 ( ) A Page 12 RX BOARD Suffix-12 ( ) Page 25 SW BOARD E S701 ( ) AUTO ON/OFF D E 3 1 11 1-864-937- (11) 4 5 • Semiconductor Location Ref. No. Location D501 B-3 D601 E-4 IC502 D-3 IC503 B-3 E 4 3 IC601 E-3 5 1 Q601 D-4 Q602 D-4 1-864-935
Summary of the content on the page No. 14
( MDR-IF4000 3-5. SCHEMATIC DIAGRAM – RECEIVER SECTION – MDR-IF4000 14 14 IC502 Q601 XC6219B252MR 2SB1690K C602 L501 D501 +2.5V REG +B SWITCH L502 2.2 RB161M-20FTR S701 R602 (AUTO ON/OFF) IC503 R601 100k XC6371A281PR 10k R503 +2.8V DC/DC C603 C503 10k CONVERTOR 0.01 100 C510 C505 R603 10V 4.7 C507 0.1 1k 10 C508 S601 D601 10V 0.1 TP601 BATT DET RB501V-40TE-17 C504 Q602 C506 TP505 C516 100 C511 2SC2412K-T 10 1 C514 10V 4.7 +B SWITCH 10V C513 47 S602 NIMH1 CHARGE C605 0.1 6.3V BATT DET NI-MH C604
Summary of the content on the page No. 15
MDR-IF4000 • IC BLOCK DIAGRAMS IC101 CXD4017R 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 MST 1 XSM 2 SMCK 3 4 VDDE VSS 5 ADVRH 6 7 ADAVS 48 TEST4 A/D ADAVD 8 47 TEST3 CONVERTER 9 ADVRL ERROR OUTPUT 46 TEST2 DEMODULATOR ADVIN 10 CORRECTOR I/F 45 TEST1 44 TEST0 VDDE 11 VSS 12 43 OSCO XRST 13 CLOCK 42 VSS 14 DIFM0 GENERATOR 41 VDDE DIFM1 15 40 OSCI DTSEL 16 BUFFER RAM 39 VSS 38 SCMODE 37 SCLK 36 XSCEN CONTROLLER CLOCK 35 SWDT SELECTOR PLL 34 SRDT 33 CSOD 17 18 19 20 21 22 23 24 25 26 27 28 29
Summary of the content on the page No. 16
MDR-IF4000 IC001 CXA3668N-T4 24 23 22 21 20 19 18 17 16 15 14 13 COMP BIAS COMP FWR 0 S/D LPF HPF CONV 180 fc = 4.5MHz/ 6MHz fc = 3MHz I/V AMP GCA OUTPUT_AMP PREAMP 0 COMP FWR 180 CONT GNDMOS 1 2 3 4 5 6 7 8 9 10 11 12 IC301, 302 NJM2113V-TE2 CD 1 VOUT2 8 + VREF 2 7 GND – +VIN 6 3 V+ + –VIN 4 – 5 VOUT1 16 A GCIREF1 AGCCAP1 GNDMOS AGCIREF3 SIS VCC2 VCCI AGCIREF2 IN AGCCAP2 GNDI GND2 A GCIN DET GNDS VCCO GNDR OUT GNDR GNDO VOUT15 DIVCODE VREGIN VCCS
Summary of the content on the page No. 17
MDR-IF4000 SECTION 4 EXPLODED VIEWS NOTE: • -XX, -X mean standardized parts, so they may • The mechanical parts with no reference number in the exploded views are not supplied. have some differences from the original one. • Accessories are given in the last of this parts • Items marked “*” are not stocked since they are seldom required for routine service. Some list. delay should be anticipated when ordering these items. 4-1. HOUSING (L) ASSY SECTION not supplied 15 (SW board) 16 12 B 5 6 13 13
Summary of the content on the page No. 18
MDR-IF4000 4-2. HOUSING (R) ASSY SECTION 60 not supplied (PD2 board) 64 61 58 54 62 not supplied 62 not supplied (PD1 board) 63 59 63 54 not supplied 53 57 SP001 not supplied 52 56 51 64 54 Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 51 3-246-154-13 PAD (R), EAR 60 3-246-137-01 BAND, HEAD 52 X-2024-575-1 PLATE (R) SUB ASSY, FRONT 61 X-3383-905-2 CUSHION ASSY, HEAD 53 A-1083-890-A RX BOARD, COMPLETE 62 4-966-791-01 STOPPER (UPPER) 54 3-253-143-01 SCREW (B2.6), (+)
Summary of the content on the page No. 19
MDR-IF4000 BATT PD1 PD2 RX SECTION 5 ELECTRICAL PARTS LIST NOTE: When indicating parts by reference • RESISTORS • Due to standardization, replacements in the number, please include the board. All resistors are in ohms. parts list may be different from the parts METAL: metal-film resistor specified in the diagrams or the components METAL OXIDE: Metal Oxide-film resistor used on the set. F: nonflammable • -XX, -X mean standardized parts, so they • COILS may have some difference from the original u
Summary of the content on the page No. 20
MDR-IF4000 RX Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks C005 1-124-779-00 ELECT CHIP 10uF 20% 16V C312 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C313 1-104-851-11 TANTAL. CHIP 10uF 20% 10V C006 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C314 1-104-912-11 TANTAL. CHIP 3.3uF 20% 16V C007 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C315 1-137-934-91 TANTAL. CHIP 47uF 20% 10V C008 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C009 1-124-778-00 ELECT CHIP 22uF 20% 6.3V C316 1-107-82
