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® TM
Intel Core 2 Duo Processor and
®
Intel Q35 Express Chipset
Development Kit
User’s Manual
October 2007
Order Number: 318476-001US
ページ2に含まれる内容の要旨
Legal Lines and Disclaimers INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS
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Contents—Intel Core 2 Duo Processor and Intel Q35 Express Chipset Contents 1.0 About This Manual.....................................................................................................6 1.1 Content Overview................................................................................................6 1.2 Text Conventions ................................................................................................6 1.3 Glossary of Terms and Acronyms..............................
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Contents 6 Dual Channel (Interleaved) Mode Configuration with 4x DIMMs.......................................17 7 Single Channel (Asymmetric) Mode Configuration with 1x DIMM .....................................17 8 Single Channel (Asymmetric) Mode Configuration with 3x DIMMs....................................18 9 Back-panel Connectors..............................................................................................18 10 LAN C
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Revision History—Intel Core 2 Duo Processor and Intel Q35 Express Chipset Revision History Date Revision Description October 2007 001 Initial release ® TM ® Intel Core 2 Duo Processor and Intel Q35 Express Chipset Development Kit October 2007 User’s Manual Order Number: 318476-001US 5
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—About This Manual 1.0 About This Manual ® This user’s manual describes the use of the Intel Q35 Express Chipset Development Kit. This manual has been written for OEMs, system evaluators, and embedded system developers. All jumpers, headers, LED functions, and their locations on the board, along with subsystem features and POST codes, are defined in this document. ® For the latest information about the Intel Q35 Express Chipset Developme
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About This Manual—Intel Core 2 Duo Processor and Intel Q35 Express Chipset is shown as 0FFH.) Decimal and binary numbers are represented by their customary notations (That is, 255 is a decimal number and 1111 1111 is a binary number). In some cases, the letter B is added for clarity. Units of Measure The following abbreviations are used to represent units of measure: GByte gigabytes KByte kilobytes MByte megabytes MHz megahertz W watts V volts Signal Names Signal names are shown in uppercase
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—About This Manual Table 1. Definition (Sheet 2 of 2) Term Description nd Advanced Digital Display Card – 2 Generation. This card provides digital display options for an Intel Graphics Controller that supports ADD2+ cards. It plugs into a x16 PCI Express* connector but uses the multiplexed SDVO interface. The card adds Video In ADD2 Card capabilities to platform. This Advanced Digital Display Card will not work with an Intel Graphics C
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About This Manual—Intel Core 2 Duo Processor and Intel Q35 Express Chipset Table 2. Intel Literature Centers Location Telephone Number U.S. and Canada 1-800-548-4725 U.S. (from overseas) 708-296-9333 Europe (U.K.) 44(0)1793-431155 Germany 44(0)1793-421333 France 44(0)1793-421777 Japan (fax only) 81(0)120-47-88-32 ® TM ® Intel Core 2 Duo Processor and Intel Q35 Express Chipset Development Kit October 2007 User’s Manual Order Number: 318476001US 9
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features 2.0 Development Kit Hardware Features This chapter describes the features of the Intel® Q35 Development Kit. These recommendations would largely apply to other designs incorporating Intel® Q35 chipset. This documentation should be used in conjunction with the datasheets, specification updates and platform design guides for the Intel® I/O Controller Hub 9 (ICH9) Family and the Intel® Q35 Express Chipset
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Development Kit Hardware Features—Intel Core 2 Duo Processor and Intel Q35 Express Chipset Figure 1. Board Features Reset button PCI Slot PCI Express x1 Slot Power Button SPI EEPROM (Secondary) Port 80 LED Display SPI EEPROM (Primary) PCI Express x16 Graphics Slot LGA775 Processor Socket Intel® I/O Controller Hub (ICH) SATA Port Intel® Q35 Memory Controller Hub (MCH) 2x2 Standard Power Supply 2x12 Standard Power Supply 2-DIMM per channel DDR2 2-DIMM per channel DDR2 667/800 (Channe
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features Figure 2. Intel® Q35 Express Chipset Development Kit block diagram 2.3 Development Kit Inventory Checklists This section describes major hardware items which should be available on this development kit. Table 3. Development Kit Hardware Items 1x 4-Layer Micro-BTX form factor (targeted dimensions: 10.5” x 10.4”) motherboard TM 1x Intel® Core 2 Duo E6400 Processors in the LGA775 Socket 2x 1 GBytes DDR2 800
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Development Kit Hardware Features—Intel Core 2 Duo Processor and Intel Q35 Express Chipset Table 4. Development Kit Board Specification 1 PCI Express x16, 2 PCIe x1, 1 PCI expansion slots 1394a • 1 front panel headers for support of 1 port • 1 back panel port Universal Serial Bus 2.0 • 2 front panel headers for support of 4 ports • 1 internal header for support of 2 ports • 6 back panel ports 6 SATA 3 Gb/sec ports (1 port used for eSATA) Table 5. Internal I/O headers 2x5 Front Panel I/O header 2
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features Table 6. Supported Intel Technologies (Sheet 2 of 2) Technology Features/support Reference Documentation • Helps improve system performance by optimizing use of available memory bandwidth and reducing latency of memory http://www.intel.com/products/chipsets/ Intel® Fast Memory Access access by monitoring all pending read/write q965_q963/demo/demo.html requests; allows safe and efficient overlapping of
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Development Kit Hardware Features—Intel Core 2 Duo Processor and Intel Q35 Express Chipset • Non-ECC DDR2 (667/800) • 512Mb, 1Gb and 2Gb technology • 4 DIMMs, 4GB maximum per channel, 8GB total memory • Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory c
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features Figure 4. Dual Channel (Interleaved) Mode Configuration with 2x DIMMs Figure 5 shows a dual channel configuration using 3 DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the capacity of the single DIMM in the DIMM 0 socket of Channel B. Figure 5. Dual Channel (Interleaved) Mode Configuration with 3x DIMMs Figure 6 shows a dual channel configuration using 4 DIMMs. In this
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Development Kit Hardware Features—Intel Core 2 Duo Processor and Intel Q35 Express Chipset Figure 6. Dual Channel (Interleaved) Mode Configuration with 4x DIMMs 2.5.2 Single Channel (Asymmetric) Mode Configurations Figure 7 shows a single channel configuration using 1x DIMM. In this example, only the DIMM 0 socket of Channel A is populated. Channel B is not populated. Figure 7. Single Channel (Asymmetric) Mode Configuration with 1x DIMM Figure 8 shows a single channel configuration using 3x DIM
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features Figure 8. Single Channel (Asymmetric) Mode Configuration with 3x DIMMs 2.6 Back-Panel Connectors Figure 9 shows back-panel connectors for the development kit. Figure 9. Back-panel Connectors Side Line-in Jack Speaker Out RJ-45 LAN Port 1394a Port Rear Line-out Speaker Jack Out S/PDIF IN USB Port Center/ Mic In Jack VGA Analog eSATA Port Sub (Total 6 S/PDIF OUT Display Woofer Ports) Speaker Out Jac
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Development Kit Hardware Features—Intel Core 2 Duo Processor and Intel Q35 Express Chipset Center/Subwoofer Speaker Out Jack (Orange) This audio jack is used to connect to center/subwoofer speakers in a 5.1 and 7.1- channel audio configuration. Rear Speaker Out (Black) This audio jack is used to connect to rear speakers in a 5.1 and 7.1-channel audio configuration. Side Speaker Out (Gray) This audio jack is used to connect to side speakers for 7.1-channel audio configuration only. 2.6.2 RJ-45
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features 2.7 Debug Features 2.7.1 Extended Debug Probe (XDP) The reference board provides a JTAG-compliant test access port (TAP) for attachment of an XDP connector. The XDP connector and associated circuitry enable the use of the ITP for the particular processor to interrupt the boot sequence and view processor status. The XDP connector is located on the backside of the board at location J2BC. Refer to Figure
