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HP BladeSystem c3000 Enclosure technologies
technology brief
Abstract.............................................................................................................................................. 2
Overview of HP BladeSystem c3000 Enclosure ....................................................................................... 2
HP Thermal Logic technologies .............................................................................................................. 4
Activ
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Abstract The HP BladeSystem c3000 Enclosure is the next generation in an evolution of the entire rack- mounted infrastructure. The c3000 Enclosure is designed for remote sites, small and medium-sized businesses, and data centers with special power and cooling constraints. This technology brief provides an overview of the HP BladeSystem c3000 Enclosure, including a comparison with the enterprise-class HP BladeSystem c7000 Enclosure, Thermal Logic power and cooling technologies, and interco
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Table 1. Comparison of components supported by HP BladeSystem c-Class Enclosures Enclosure c3000 c7000 Height 6U 10U Blade orientation Horizontal Vertical Blades supported 8 HH , 4 FH, 6HH/1FH 16 HH, 8 FH Interconnect bays 4 8 Power supplies 6 at up to 1200 watts each 6 at 2250 watts each Active Cool fans 6 10 Enclosure KVM support Yes No CD/DVD support Enclosure-based available External OA support Single (now) Single or dual Dual (future) Midplane speed Tested up to 1
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Figure 2. HP BladeSystem c3000 Enclosure – rear view HP Thermal Logic technologies HP BladeSystem c-Class products have been designed with a variety of HP Thermal Logic technologies ―a set of technologies integrated across server blades, enclosures, and interconnect modules ―all of which combined provide significant power and cooling benefits in comparison to traditional rack and tower based servers. HP BladeSystem products reduce overall demand for power and cooling by as much as
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Active Cool fans Quite often, dense, full-featured, small form-factor servers use very small fans designed to provide localized cooling in the specific areas needed by the server blade. Because such fans generate fairly low airflow (in cubic feet per minute, or CFM) at medium backpressure, a single server often requires multiple fans to ensure adequate cooling. Therefore, installing many server blades together in an enclosure, with each server blade containing several fans, can result in
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HP PARSEC architecture HP Parallel Redundant Scalable Enclosure Cooling (PARSEC) architecture is a hybrid model for cooling that combines the best of local and centralized cooling in a single system to ensure optimum airflow and cooling for all servers. Density, once a barrier to cooling, is turned into an advantage with HP Thermal Logic technologies like HP PARSEC architecture and HP Active Cool fans. With these innovations, server blades get more cooling airflow where it is needed most
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Figure 5. The c3000 Enclosure fan bay and device bay population guidelines Thermal Logic for the server blade and enclosure The server blade design uses precise ducting throughout the server blade to manage airflow and temperature based on the unique thermal requirements of all the critical components. The airflow is tightly ducted to ensure that no air bypasses the server blade and to obtain the most thermal work from the least amount of air. This concept allows much more flexibi
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Figure 6. Processor heat sink using fully ducted design (left) and a traditional heat sink in a 1U rack-mount server (right) Instant Thermal Monitoring provides a real-time view of heat, power, and cooling data. The Onboard Administrator retrieves thermal information from all server blades, storage blades, and interconnect modules in the enclosure to ensure an optimal balance between cooling, acoustic levels, and power consumption. The Thermal Logic feature of the Onboard Administra
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Figure 7. HP BladeSystem c3000 Enclosure supports up to six power supplies The new, high efficiency HP c3000 power supplies provide greater than 90 percent efficiency in AC to DC conversion. These power supplies use the ProLiant universal form factor so they can also be used in other ProLiant servers. Each AC power supply ships with a standard power distribution unit (PDU) power cord (C13 to C14 ). By purchasing proper wall outlet cords, users can connect the power supplies to stand
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Values obtained from the BladeSystem Power Sizer tool are based on worst case loads and are intended for facility planning purposes only. Actual power consumption will vary with application type, application utilization, and ambient temperature. The BladeSystem Power Sizer is available at the following URL: http://www.hp.com/go/bladesystem/powercalculator. Pooled power All the power in the enclosure is provided as a single pool that any server blade can access. This provides maximum flex
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Connecting with no power redundancy configured If no power redundancy is configured, the total power available is defined as the power available from all power supplies installed (six power supplies installed = up to 7200W). Any power supply or AC line failure may cause the system to power off. The Onboard Administrator manages power allocation rules of various components and can limit overall power capacity for the enclosure. More information on power management is available in the tec
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server power consumption, checks it against the power cap goal, and, if necessary, adjusts server performance to maintain an average power consumption that is less than or equal to the power cap goal. This functionality is available on all Intel-based ProLiant server blades. Using the Insight Power Manager (IPM) v1.10 plug-in to Systems Insight Manager v5.1, customers can set power caps on groups of supported servers. The IPM software statically allocates the group power cap among the ser
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Figure 10. Traces on the signal midplane can transmit many different types of signals, depending on which interconnect fabrics are used. The right-hand side of the diagram represents how the signals can be “overlaid” onto the same traces. Each device bay signal connector has a 100-pin connector with 64 high-speed signal pins hard-wired from the device bay connector to the interconnect bays. This results in 16 lanes (64 ÷ 4) to each interconnect bay. This provides at least two lanes
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Figure 11. HP BladeSystem c3000 interconnect bay numbering For interconnect bay mapping purposes, it does not matter in which device bay a server blade is installed. The mezzanine connectors always connect to the same interconnect bays. Because the connections between the device bays and the interconnect bays are hard-wired through the signal midplane, the server mezzanine cards must be matched to the appropriate type of interconnect module. For example, a Fibre Channel mezzanine c
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interconnect. Depending on the configuration requirements, additional mezzanine cards and interconnects can be populated in: • Mezzanine 1 and Interconnect Bay 2 • Mezzanine 2 and Interconnect Bays 3 and 4 • Mezzanine 3 and Interconnect Bays 3 and 4 The full-height server blade has four embedded NICs and can accept up to three additional mezzanine cards. Each embedded NIC and optional mezzanine port is mapped through the signal midplane to specific ports on interconnect bays. A full-hei
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Figure 13 lists the available configurations for half-height devices installed in device bay N (1–8). Figure 13. Port mapping for HP BladeSystem c3000 half-height server blades to interconnect bays Port mapping differs slightly between full-height and half-height server blades due to the support for additional mezzanine cards on the full-height version. HP has simplified the process of mapping mezzanine ports to switch ports by providing intelligent management tools through the Onboa
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Full details about Virtual Connect technology are available in the technology brief entitled “HP Virtual Connect technology implementation for the HP BladeSystem c-Class” on the HP technology website at www.hp.com/servers/technology. Enclosure-based DVD ROM The HP BladeSystem c3000 Enclosure has an optional CD/DVD ROM drive that installs in the front of the enclosure. The Insight Display and Onboard Administrator allow system administrators to connect and disconnect the media device to o
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The Onboard Administrator aggregates up to eight iLO 2 ports in a c3000 Enclosure, simplifying cable management and providing a graphical interface to launch individual server iLO management interfaces. The rear of each module has an LED (blue unit identification) that can be enabled locally or remotely and can be used to identify the enclosure from the back of the rack. The c3000 Enclosure currently supports one Onboard Administrator module. Enclosure devices continue to operate norma
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• Cooling—The Onboard Administrator makes sure there is sufficient cooling capacity for the server blade or interconnect module by retrieving thermal information from all of the server blades, power supplies, Active Cool fans, and interconnect modules in the enclosure. • Location—The Onboard Administrator checks the locations of server blades, Active Cool fans, and power supplies to determine if they are placed to receive proper cooling and to support the chosen power configuration. If
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More information about the Insight Display is available in the technology brief entitled “Managing the HP BladeSystem c-Class” at this URL: http://h18004.www1.hp.com/products/servers/technology/whitepapers/proliant-servers.html. Web GUI The web GUI uses event-driven, push technology. No screen refresh is necessary to view failures or events. If an event occurs, it is pushed to the web GUI and updated immediately. The GUI provides seamless integration with HP OpenView, Insight Control Da
