ページ1に含まれる内容の要旨
General Information DDR3 SDRAM
DDR3 SDRAM Product Guide
October 2009
Memory Division
October 2009
ページ2に含まれる内容の要旨
General Information DDR3 SDRAM 1. DDR3 SDRAM Component Ordering Information 1 2 3 4 5 6 7 8 9 10 11 K 4 B X X X X X X X - X X X X Speed SAMSUNG Memory DRAM Temp & Power DRAM Type Package Type Density Revision Interface (VDD, VDDQ) Bit Organization # of Internal Banks 7. Interface ( VDD, VDDQ) 1. SAMSUNG Memory : K 6 : SSTL (1.5V, 1.5V) 2. DRAM : 4 8. Revision M : 1st Gen. 3. DRAM Type
ページ3に含まれる内容の要旨
General Information DDR3 SDRAM 2. DDR3 SDRAM Component Product Guide Package & Power, Density Banks Part Number Org. VDD Voltage PKG Avail. Note Temp. (-C/-L) & Speed K4B1G0446D HC(L)F7/F8/H9 256M x 4 78 + 4 ball FBGA K4B1G0846D HC(L)F7/F8/H9 128M x 8 1Gb D-die 8Banks 1.5V Now 96 + 4 ball K4B1G1646D HC(L)F7/F8/H9 64M x 16 FBGA K4B1G0446E HC(L)F7/F8/H9/K0 256M x 4 78 ball FBGA K4B1G0846E HC(L)F7/F8/H9/K0 128M x 8 1.5V 96 ball 1Gb E-die 8Banks K4B1G1646E HC(L)F7/F8/H9/K0 64M x 16 Now FBGA K4B
ページ4に含まれる内容の要旨
General Information DDR3 SDRAM 3. DDR3 SDRAM Module Ordering Information 1 2 3 4 5 6 7 8 9 10 11 12 M X X X B X X X X X X X - X X X Memory Module DIMM Type Data bits Speed DRAM Component Type Temp & Power Depth PCB Revision # of Banks in Comp. & Interface Package Component Revision Bit Organization 1. Memory Module : M 8. Component Revision M : 1st Gen. A
ページ5に含まれる内容の要旨
General Information DDR3 SDRAM 4. DDR3 SDRAM Module Product Guide 4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product) 240Pin DDR3 Unbuffered DIMM Comp. Internal Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. Note Version Banks 78 + 4 ball M378B2873DZ1 CF8/H9 128M x 8 * 8 pcs 1Gb D-die FBGA 128Mx 64 1GB A(1Rx8) 81 30mm Now M378B2873EH1 CF8/H9/K0 128M x 8 * 8 pcs 1Gb E-die 78 ball FBGA M378B2873FHS CF8/H9 128M x 8 * 8 pcs 1Gb F-die 78 + 4 ball M391B2873DZ1 CF8/H9 128M x 8 *
ページ6に含まれる内容の要旨
General Information DDR3 SDRAM 4.3 204Pin DDR3 SoDIMM (1.5V Product) 204Pin DDR3 SODIMM Comp. Internal Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. Note Version Banks 96 + 4 ball M471B2874DZ1 CF8/H9 A(2Rx16) 64M x 16 * 8 pcs 1Gb D-die 8 2 FBGA 78 ball M471B2873EH1 CF8/H9 B(1Rx8) 128M x 8 * 8 pcs 1Gb E-die 8 1 FBGA 128Mx 64 1GB 30mm Now M471B2874EH1 CF8/H9 A(2Rx16) 64M x 16 * 8 pcs 1Gb E-die 8 2 96 ball 78 ball M471B2873FHS CF8/H9 B(1Rx8) 64M x 16 * 8 pcs 1Gb F-die
ページ7に含まれる内容の要旨
General Information DDR3 SDRAM 4.5 240Pin DDR3 Registered DIMM (1.5V Product) 240Pin DDR3 Registered DIMM Comp. Internal Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. Note Version Banks 78 + 4 ball M393B2873DZ1 CF8/H9 128M x 8 * 9 pcs 1Gb D-die FBGA 128Mx 72 1GB A(1Rx8) 81 30mm Now M393B2873EH1 CF8/H9 128M x 8 * 9 pcs 1Gb E-die 78 ball FBGA M393B2873FH0 CF8/H9 128M x 8 * 9 pcs 1Gb F-die 78 + 4 ball M393B5673DZ1 CF8/H9 128M x 8 * 18 pcs 1Gb D-die 2 FBGA B(2Rx8) M393B
ページ8に含まれる内容の要旨
General Information DDR3 SDRAM 4.6 240Pin DDR3 Registered DIMM (1.35V Product) 240Pin DDR3 Registered DIMM Comp. Internal Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. Note Version Banks M393B2873EH1 YF8/H9 128M x 8 * 9 pcs 1Gb E-die 78 ball 128Mx 72 1GB A(1Rx8) 81 30mm Now FBGA M393B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die M393B5673EH1 YF8/H9 128M x 8 * 18 pcs 1Gb E-die B(2Rx8) 82 M393B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die 78 ball 256Mx 72 2GB M393B5670EH1 YF
ページ9に含まれる内容の要旨
General Information DDR3 SDRAM 4.7 240Pin DDR3 VLP Registered DIMM (1.5V Product) 240Pin DDR3 VLP Registered DIMM Comp. Internal Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. Note Version Banks 78 + 4 ball M392B2873DZ1 CF8/H9 128M x 8 * 9 pcs 1Gb D-die FBGA 128Mx 72 1GB K(1Rx8) 81 18.75mm Now M392B2873EH1 CF8/H9 128M x 8 * 9 pcs 1Gb E-die 78 ball FBGA M392B2873FH0 CF8/H9 128M x 8 * 9 pcs 1Gb F-die 78 + 4 ball M392B5673DZ1 CF8/H9 128M x 8 * 18 pcs 1Gb D-die FBGA L(2R
ページ10に含まれる内容の要旨
General Information DDR3 SDRAM 4.8 240Pin DDR3 VLP Registered DIMM (1.35V Product) 240Pin DDR3 VLP Registered DIMM Comp. Internal Org. Density Part Number Speed Raw Card Composition Rank PKG Height Avail. Note Version Banks M392B2873EH1 YF8/H9 128M x 8 * 9 pcs 1Gb E-die 78 ball 128Mx 72 1GB K(1Rx8) 81 18.75mm Now FBGA M392B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die M392B5673EH1 YF8/H9 128M x 8 * 18 pcs 1Gb E-die L(2Rx8) 82 M392B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die 78 ball 256Mx 72 2GB M392
ページ11に含まれる内容の要旨
General Information DDR3 SDRAM 5. RDIMM RCD Information 5.1 RCD Identification in JEDEC Description in Module Label 5.2 Label Example 4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P0 0920 M393B5170EH1-CH9 Made in Korea 5.3 RCD Information - Example Voltage Vendor Revision Module P/N JEDEC Description On Label Inphi GS04 B2 M393B5170EH1-CH9 4GB 2Rx4 PC3-10600R-09-10-E1-P0 1.5V IDT LV DDR3 B0 M393B5170EH1-CH9 4GB 2Rx4 PC3-10600R-09-10-E1-D2 Inphi LV GS02 C0 M393B5170EH1-YF8 4GB 2Rx4 PC3L-8500R-07-1
ページ12に含まれる内容の要旨
General Information DDR3 SDRAM 78 + 4Ball FBGA for 1Gb D-die (x4/x8) 9.00 ± 0.10 A 0.80 x 10 = 8.00 #A1 INDEX MARK (Datum A) 0.80 1.60 4.00 #A1 9.00 ± 0.10 B 1110 9 87654 321 A B C (Datum B) D E F G H J K L M N 0.35 ± 0.05 (0.95) 82 - ∅0.45 Solder ball MOLDING AREA (Post Reflow ∅0.05 ± 0.05) 1.10 ± 0.10 (1.90) 0.2 M AB Bottom Top : Support Ball 96 + 4Ball FBGA for 1Gb D-die (x16) 9.00 ± 0.10 A 0.80 x 10 = 8.00 #A1 INDEX MARK 0.80 1.60 4.00 9.00 ± 0.10 #A1 B 1110 9 87654 321 A (Datum
ページ13に含まれる内容の要旨
General Information DDR3 SDRAM 78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8) 7.50 ± 0.10 A 0.80 x 8 = 6.40 #A1 INDEX MARK (Datum A) 0.80 1.60 3.20 #A1 7.50 ± 0.10 B 9 876 54321 A B C (Datum B) D E F G H J K L M N 0.35 ± 0.05 (0.95) 78 - ∅0.45 Solder ball MOLDING AREA (Post Reflow ∅0.05 ± 0.05) 1.10 ± 0.10 (1.90) 0.2 M AB Bottom Top 96Ball FBGA for 1Gb E-die (x16) 7.50 ± 0.10 A 0.80 x 8 = 6.40 #A1 INDEX MARK 0.80 1.60 3.20 7.50 ± 0.10 #A1 B 9 876 54321 A (D
ページ14に含まれる内容の要旨
General Information DDR3 SDRAM 78Ball FBGA for 2Gb B-die (x4/x8) 9.00 ± 0.10 A #A1 INDEX MARK (Datum A) 0.80 1.60 3.20 #A1 9.00 ± 0.10 B 9 8 765432 1 A B C (Datum B) D E F G H J K L M N 0.35 ± 0.05 (0.95) 78 - ∅0.45 Solder ball MOLDING AREA (Post Reflow ∅0.50 ± 0.05) 1.10 ± 0.10 (1.90) 0.2 M AB TOP VIEW BOTTOM VIEW 96Ball FBGA for 2Gb B-die (x16) 9.00 ± 0.10 A #A1 INDEX MARK 0.80 1.60 3.20 9.00 ± 0.10 #A1 B 9 87654 321 A (Datum A) B C D (Datum B) E F G H J K L M N P R T 0.35 ± 0.05 (
ページ15に含まれる内容の要旨
General Information DDR3 SDRAM 78Ball DDP for 1Gb D-die (x4) 10.50 ± 0.10 A 0.80 x 8 = 6.40 #A1 INDEX MARK (Datum A) 0.80 1.60 4.00 #A1 10.50 ± 0.10 B 9 876543 21 A B C (Datum B) D E F G H J K L M N 0.35 ± 0.05 82 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) 1.40 ± 0.10 0.2 M AB Bottom Top 78Ball DDP for 1Gb E-die (x4/x8) 9.00 ± 0.10 A 0.80 x 8 = 6.40 #A1 INDEX MARK (Datum A) 0.80 1.60 3.20 #A1 9.00 ± 0.10 B 9 876543 21 A B C (Datum B) D E F G H J K L M N 0.35 ± 0.05 78 - ∅0.45 Sold
ページ16に含まれる内容の要旨
General Information DDR3 SDRAM 78Ball DDP for 2Gb B-die (x4/x8) 10.00 ± 0.10 A 0.80 x 8 = 6.40 #A1 INDEX MARK (Datum A) 0.80 1.60 3.20 #A1 10.00 ± 0.10 B 9 876543 21 A B C (Datum B) D E F G H J K L M N 0.35 ± 0.05 78 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) 1.40 ± 0.10 0.2 M AB Bottom Top October 2009 0.80 0.80 4.80 0.80 x 12 = 9.60 11.50 ± 0.10 11.50 ± 0.10 0.10MAX
ページ17に含まれる内容の要旨
General Information DDR3 SDRAM x64/x72 240pin DDR3 SDRAM Unbuffered DIMM Units : Millimeters 133.35 ± 0.15 128.95 N/A (for x64) SPD ECC (for x72) (2) 2.50 54.675 A B Max 4.0 47.00 71.00 N/A (for x64) ECC (for x72) 1.270 ± 0.10 5.00 2x 2.10 ± 0.15 0.80 ± 0.05 3.80 0.2 ± 0.15 1.50±0.10 1.00 2.50 Detail A Detail B October 2009 9.50 2.50 ± 0.20 2.30 (4X)3.00 ± 0.1 17.30 30.00 ± 0.15
ページ18に含まれる内容の要旨
General Information DDR3 SDRAM x64 204pin DDR3 SDRAM Unbuffered SODIMM Units : Millimeters 0.10 M C AB 67.60 63.60 Max 3.8 1.00 ± 0.10 24.80 A B 39.00 21.00 2X 1.80 0.10 M C AB (OPTIONAL HOLES) 2X 4.00 ± 0.10 0.10 M C AB 0.60 0.45 ± 0.03 1.65 4.00 ± 0.10 2.55 0.25 MAX 1.00 ± 0.10 Detail A Detail B October 2009 20.00 SPD 6 30.00 ± 0.15
ページ19に含まれる内容の要旨
General Information DDR3 SDRAM x72 240pin DDR3 SDRAM Registered DIMM Units : Millimeters 133.35 ± 0.15 C 128.95 Max 4.0 10.9 9.76 18.92 32.40 18.93 9.74 2.50 1.0 max 54.675 AB 1.27 ± 0.10 47.00 71.00 5.00 0.80 ± 0.05 3.80 0.2 ± 0.15 10.9 0.4 2.50 1.00 1.50±0.10 Detail A Detail B Detail C 2x 2.10 ± 0.15 Address, Command and Control lines October 2009 R 0.50 9.50 Register Register 2.50 ± 0.20 2.30 (2X)3.00 17.30 30.00 ± 0.15
ページ20に含まれる内容の要旨
R0.1 . R0 2 General Information DDR3 SDRAM Registered DIMM Heat Spreader Design 1. FRONT PART Outside 133.15 ± 0.2 0.65 ± 0.2 130.45 ± 0.15 9.26 29.77 11.9 31.4 0.15 1.3 1 127 ± 0.12 1.3 Inside Green Line : TIM Attatch Line Reg. pedestal line 80.78 119.29 128.5 2. BACK PART Outside Inside Green Line : TIM Attatch Line October 2009 4.65± 0.12 2.6 ± 0.2 2 0.4 2 ± 0.1 7.45 23.6 ± 0.15 25.6 ± 0.15 2 1+0/ -0.3 25.6 ± 0.15
