Intel 945PLの取扱説明書

デバイスIntel 945PLの取扱説明書

デバイス: Intel 945PL
カテゴリ: チョッパー
メーカー: Intel
サイズ: 0.7 MB
追加した日付: 3/3/2013
ページ数: 39
説明書を印刷

ダウンロード

使い方は?

私たちの目的は、皆様方にデバイスIntel 945PLの取扱説明書に含まれたコンテンツを可能な限り早く提供することです。オンラインプレビューを使用すると、Intel 945PLに関してあなたが抱えている問題に対する解決策の内容が素早く表示されます。

便宜上

説明書Intel 945PLをこちらのサイトで閲覧するのに不都合がある場合は、2つの解決策があります:

  • フルスクリーン表示 – 説明書を(お使いのコンピュータにダウンロードすることなく)便利に表示させるには、フルスクリーン表示モードをご使用ください。説明書Intel 945PLのフルスクリーン表示を起動するには、全画面表示ボタンを押してください。
  • コンピュータにダウンロード - Intel 945PLの説明書をお使いのコンピュータにダウンロードし、ご自身のコレクションに加えることもできます。デバイス上のスペースを無駄にしたくない場合は、いつでもManualsBaseサイトでダウンロードすることもできます。
Intel 945PL 取扱説明書 - Online PDF
Advertisement
« Page 1 of 39 »
Advertisement
印刷版

多くの人々は画面表示ではなく印刷された説明書を読むほうを好みます。説明書を印刷するオプションも提供されており、上記のリンクをクリックすることによりそれを利用できます - 説明書を印刷。説明書Intel 945PLを全部印刷する必要はなく、選択したページだけを印刷できます。紙を節約しましょう。

要旨

次のページにある説明書Intel 945PLの内容のプレビューは、以下にあります。次のページにある説明書の内容をすぐに表示したい場合は、こちらをご利用ください。

内容要旨
ページ1に含まれる内容の要旨








®
Intel 945G/945GZ/945GC/
945P/945PL Express Chipset
Family

Thermal and Mechanical Design Guidelines (TMDG)
®
- For the Intel 82945G/82945GZ/82945GC Graphics Memory
®
Controller Hub (GMCH) and Intel 82945P/82945PL Memory
Controller Hub (MCH)


February 2008

















Document Number: 307504-004

ページ2に含まれる内容の要旨

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELA

ページ3に含まれる内容の要旨

Contents 1 Introduction.....................................................................................................7 1.1 Terminology ..........................................................................................8 1.2 Reference Documents .............................................................................9 2 Product Specifications......................................................................................11 2.1 Package Description..............

ページ4に含まれる内容の要旨

Figures Figure 1. (G)MCH Non-Grid Array ......................................................................12 Figure 2. 0° Angle Attach Methodology (top view, not to scale)..............................16 Figure 3. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom view shown, not to scale)...........................................................................16 Figure 4. Airflow Temperature Measurement Locations .........................................

ページ5に含まれる内容の要旨

Revision History Revision Description Date Number -001 • Initial Release May 2005 ® -002 • Added Intel 82945PL specifications October 2005 ® -003 • Added Intel 82945GZ specifications December 2005 ® -004 • Added Intel 82945GC specifications February 2008 § Thermal and Mechanical Design Guidelines 5

ページ6に含まれる内容の要旨

6 Thermal and Mechanical Design Guidelines

ページ7に含まれる内容の要旨

Introduction 1 Introduction As the complexity of computer systems increases, so do power dissipation requirements. The additional power of next generation systems must be properly dissipated. Heat can be dissipated using improved system cooling, selective use of ducting, and/or active/passive heatsinks. The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within functional limits. The functional temperature limit is the

ページ8に含まれる内容の要旨

Introduction 1.1 Terminology Term Description BGA Ball Grid Array. A package type defined by a resin-fiber substrate where a die is mounted and bonded. The primary electrical interface is an array of solder balls attached to the substrate opposite the die and molding compound. FC-BGA Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a die is mounted using an underfill C4 (Controlled Collapse Chip Connection) attach style. The primary electrical interfa

ページ9に含まれる内容の要旨

Introduction 1.2 Reference Documents Document Comments ® Intel 945G/945GZ/945P/945PL Express Chipset Family http://developer.intel.com/des Datasheet ign/chipsets/datashts/307502. htm ® Intel I/O Controller Hub 7 (ICH7) Datasheet http://developer.intel.com//de sign/chipsets/datashts/30701 3.htm ® Intel I/O Controller Hub 7 (ICH7) Thermal Design Guidelines http://developer.intel.com//de sign/chipsets/designex/30701 5.htm ® ® Intel Pentium 4 Processor 670, 660, 650, 640, and 630 and htt

ページ10に含まれる内容の要旨

Introduction 10 Thermal and Mechanical Design Guidelines

ページ11に含まれる内容の要旨

Product Specifications 2 Product Specifications This chapter provides the package description and loading specifications. The chapter also provides component thermal specifications and thermal design power descriptions for the (G)MCH. 2.1 Package Description The (G)MCH is available in a 34 mm [1.34 in] x 34 mm [1.34 in] Flip Chip Ball Grid Array (FC-BGA) package with 1202 solder balls. The die size is currently 9.6 mm [0.378in] x 10.6 mm [0.417in]. A mechanical drawing of the pack

ページ12に含まれる内容の要旨

Product Specifications Figure 1. (G)MCH Non-Grid Array 2.2 Package Loading Specifications Table 1 provides static load specifications for the chipset package. This mechanical maximum load limit should not be exceeded during heatsink assembly, shipping conditions, or standard use conditions. Also, any mechanical system or component testing should not exceed the maximum limit. The chipset package substrate should not be used as a mechanical reference or load-bearing surface for the

ページ13に含まれる内容の要旨

Product Specifications 2.3 Thermal Specifications To ensure proper operation and reliability of the (G)MCH, the temperature must be at or below the maximum value specified in Table 2. System and component level thermal enhancements are required to dissipate the heat generated and maintain the (G)MCH within specifications. Chapter 3 provides the thermal metrology guidelines for case temperature measurements. The (G)MCH must also operate above the minimum case temperature specificat

ページ14に含まれる内容の要旨

Product Specifications 2.4.1 Methodology 2.4.1.1 Pre-Silicon To determine TDP for pre-silicon products in development, it is necessary to make estimates based on analytical models. These models rely on extensive knowledge of the past chipset power dissipation behavior along with knowledge of planned architectural and process changes that may affect TDP. Knowledge of applications available today and their ability to stress various components of the chipset is also included in the mo

ページ15に含まれる内容の要旨

Thermal Metrology 3 Thermal Metrology The system designer must measure temperatures to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques of measuring (G)MCH component case temperatures. 3.1 Case Temperature Measurements To ensure functionality and reliability, the (G)MCH is specified for proper operation when T is maintained at or below the maximum temperature listed in Table 2. The C surface temperature at the geome

ページ16に含まれる内容の要旨

Thermal Metrology Figure 2. 0° Angle Attach Methodology (top view, not to scale) Figure 3. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom view shown, not to scale) 3.2 Airflow Characterization Figure 4 describes the recommended location for air temperature measurements measured relative to the component. For a more accurate measurement of the average approach air temperature, Intel recommends averaging temperatures recorded from two thermocouples space

ページ17に含まれる内容の要旨

Thermal Metrology Figure 4. Airflow Temperature Measurement Locations Airflow velocity should be measured using industry standard air velocity sensors. Figure 4 Typical airflow sensor technology may include hot wire anemometers. provides guidance for airflow velocity measurement locations. These locations are for a typical JEDEC test setup and may not be compatible with chassis layouts due to the proximity of the processor to the (G)MCH. The user may have to adjust the locations

ページ18に含まれる内容の要旨

Thermal Metrology 18 Thermal and Mechanical Design Guidelines

ページ19に含まれる内容の要旨

Reference Thermal Solution 4 Reference Thermal Solution The reference component thermal solution for the (G)MCH for ATX platforms uses two ramp retainers, a wire preload clip, and four custom MB anchors. The Intel Balanced Technology Extended (BTX) reference design uses a Z-clip attach for the (G)MCH heatsink. This chapter provides detailed information on operating environment assumptions, heatsink manufacturing, and mechanical reliability requirements for the (G)MCH. 4.1 Operating

ページ20に含まれる内容の要旨

Airflow Direction Airflow Direction Reference Thermal Solution Figure 5. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on an ATX Platform Airflow Direction Airflow Direction Airflow Direction Airflow Direction (G)MCH Heatsink Omi Directional Flow Processor Heatsink (Fan Not Shown) TOP VIEW Proc_HS_Orient_ATX Other methods exist for providing airflow to the (G)MCH heatsink, including the use of system fans and/or ducting, or the use of an attached fan (active he


類似の説明書
# 取扱説明書 カテゴリ ダウンロード
1 Intel 945G 取扱説明書 チョッパー 1
2 Intel 945GC 取扱説明書 チョッパー 4
3 Intel 945P 取扱説明書 チョッパー 3
4 Intel 945GZ 取扱説明書 チョッパー 3
5 Philips SVGA COLOUR MONITOR 7CM5209 取扱説明書 チョッパー 0
6 Agri-Fab Chip-N-Vac 2468 取扱説明書 チョッパー 1
7 Philips SVGA COLOUR MONITOR 7CM5279 取扱説明書 チョッパー 2
8 Agri-Fab Chip-N-Vac 552493 取扱説明書 チョッパー 0
9 Agri-Fab Chip-N-Vac 502493 取扱説明書 チョッパー 1
10 Agri-Fab Chip-N-Vac 45-0253 取扱説明書 チョッパー 0
11 Ashly CLX-52 取扱説明書 チョッパー 16
12 Bolens 460 Series 取扱説明書 チョッパー 0
13 Ativa CS2171 取扱説明書 チョッパー 0
14 Ativa CS 2165 取扱説明書 チョッパー 0
15 Billy Goat TKD505SPT 取扱説明書 チョッパー 1