ページ1に含まれる内容の要旨
INTEGRATED CIRCUITS
DATA SHEET
TDA1516BQ
24 W BTL or 2 x 12 watt stereo car
radio power amplifier
July 1994
Product specification
File under Integrated Circuits, IC01
ページ2に含まれる内容の要旨
Philips Semiconductors Product specification 24 W BTL or 2 x 12 watt stereo car radio TDA1516BQ power amplifier GENERAL DESCRIPTION The TDA 1516BQ is an integrated class-B output amplifier in a 13-lead single-in-line (SlL) plastic power package. The device is primarily developed for car radio applications. FEATURES • Requires very few external components • Thermally protected • Flexibility in use - stereo as well as mono BTL • Reverse polarity safe • High output power (without bootstrap) • Capabil
ページ3に含まれる内容の要旨
Philips Semiconductors Product specification 24 W BTL or 2 x 12 watt stereo car radio TDA1516BQ power amplifier PACKAGE OUTLINE 13-lead SIL-bent-to-DIL; plastic power (SOT141); SOT141-6; 1996 July 24. Fig.1 Block diagram. July 1994 3
ページ4に含まれる内容の要旨
Philips Semiconductors Product specification 24 W BTL or 2 x 12 watt stereo car radio TDA1516BQ power amplifier PINNING 1 - INV1 non-inverting input 1 8 BS2 bootstrap 2 2 INV inverting input 9 OUT2 output 2 3 GND1 ground (signal) 10 V supply voltage P 4V reference voltage 11 M/SS mute/stand-by switch ref 5 OUT1 output 1 12 RR supply voltage ripple rejection 6 BS1 bootstrap 1 13 - INV2 non-inverting input 2 7 GND2 ground (substrate) FUNCTIONAL DESCRIPTION The TDA1516BQ contains two identical amplif
ページ5に含まれる内容の要旨
Philips Semiconductors Product specification 24 W BTL or 2 x 12 watt stereo car radio TDA1516BQ power amplifier Fig.2 Power derating curve. July 1994 5
ページ6に含まれる内容の要旨
Philips Semiconductors Product specification 24 W BTL or 2 x 12 watt stereo car radio TDA1516BQ power amplifier D.C. CHARACTERISTICS (note 1) V = 14,4 V; T = 25 °C; unless otherwise specified P amb PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply Supply voltage range note 2 V 6,0 14,4 18,0 V P Quiescent current I - 40 80 mA P D.C. output voltage at approximately V /2 note 3 V - 6,8 - V P O D.C. output offset voltage |ΔV | -- 100 mV 5-9 Mute/stand-by switch Switch-on voltage level V 8,5 -- V
ページ7に含まれる内容の要旨
Philips Semiconductors Product specification 24 W BTL or 2 x 12 watt stereo car radio TDA1516BQ power amplifier A.C. CHARACTERISTICS V = 14,4 V; R = 4 Ω; f = 1 kHz; T = 25 °C; unless otherwise specified P L amb PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT note 1 Stereo application Output power note 4; THD = 0,5% P 45 - W o THD = 10% P 5,5 6,0 - W o notes 4 and 5; THD = 10% P 67 - W o Output power at note 4; R = 2 Ω THD = 0,5% P 7.5 8,5 - W L o THD = 10% P 10 11 - W o notes 4 and 5; THD = 10% P
ページ8に含まれる内容の要旨
Philips Semiconductors Product specification 24 W BTL or 2 x 12 watt stereo car radio TDA1516BQ power amplifier PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT BTL application note 10 Output power THD = 0,5% P 15,5 17,0 - W o THD = 10% P 20 22 - W o note 5; THD = 10% P 21 24 - W o Output power at V P = 13,2 V THD = 0,5% P - 13,5 - W o THD = 10% P - 17 - W o note 5; THD = 10% P - 19 - W o Power bandwidth THD = 0,5% P = 15 W B - 20 to - Hz o w 15 000 Low frequency roll-off note 6; - 3 dB f - 25 - H
ページ9に含まれる内容の要旨
Philips Semiconductors Product specification 24 W BTL or 2 x 12 watt stereo car radio TDA1516BQ power amplifier APPLICATION INFORMATION Fig.3 Stereo application circuit diagram. Fig.4 BTL application circuit diagram (without bootstrapping). July 1994 9
ページ10に含まれる内容の要旨
Philips Semiconductors Product specification 24 W BTL or 2 x 12 watt stereo car radio TDA1516BQ power amplifier PACKAGE OUTLINE DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6 non-concave D h x D E h view B: mounting base side d A 2 B j E A L 3 L Q c 113 e m e w M v M Z 1 2 b p e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) (1) (1) (1) UNIT A A b cDdeD E e e E j LL m Q v w x Z 2 p h 1 2 h 3 17.0 4.6 0.75 0.48 24.0 20.0 12.2 3.4 12.4 2.4 2.1 2.00 6 m
ページ11に含まれる内容の要旨
Philips Semiconductors Product specification 24 W BTL or 2 x 12 watt stereo car radio TDA1516BQ power amplifier SOLDERING The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the Introduction specified maximum storage temperature (T ). If the stg max printed-circuit board has been pre-heated, forced cooling There is no soldering method that is ideal for all IC may be necessary immediately after soldering to keep the packages. Wave soldering is
