HP (Hewlett-Packard) HP ProLiant BL460c G8 670657-S01 Blade670657-S01の取扱説明書

デバイスHP (Hewlett-Packard) HP ProLiant BL460c G8 670657-S01 Blade670657-S01の取扱説明書

デバイス: HP (Hewlett-Packard) HP ProLiant BL460c G8 670657-S01 Blade670657-S01
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追加した日付: 7/18/2013
ページ数: 83
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内容要旨
ページ18に含まれる内容の要旨

Interconnect bay numbering and device mapping • HP BladeSystem c7000 Enclosur e To support network connections for specific signals, install an interconnect module in the bay corresponding to the FlexibleLOM or mezzanine signa ls. Server blade signal Interconnect bay Interconnect bay label s 1 and 2 FlexibleLOM 3 and 4 Mezzanine 1 5 and 6 Mezzanine 2 7 and 8 For detailed port mapping information, see the HP BladeSystem enclosure installation poster or the HP BladeS

ページ19に含まれる内容の要旨

• HP BladeSystem c3000 Enclosure and Tower Enclos ure Server blade signal Interconnect Interconnect Notes bay number bay labe l 1 — FlexibleLOM 2 Four port cards connect to bay 2 . Mezzanine 1 3 and 4 Mezzanine 2 • Four port card s • Ports 1 and 3 connect to bay 3. • Ports 2 and 4 connect to bay 4. Connecting to the network To connect the HP BladeSystem to a network, each enclosure must be configured with network interconnect devices to manage signals between the s

ページ20に含まれる内容の要旨

Two types of interconnect modules are available for HP BladeSyst-eCl m ascs enclosures: Pass-Thru modules and switch modules. For more information about interconnect module options, see the HP w ebsite (http://www.hp.com/go/bladesystem/interconnects). IMPORTANT: To con nect to a network with a P-aTshsru module, always connect the Pas -Thsru module to a network device that supports Gigabit or 10 Gb speed, depending on the corresponding Pass-Thru model. Installing a server blade

ページ1に含まれる内容の要旨

HP ProLiant BL460c Gen8 Server Blade
User Guide
Abstract
This document is for the person who installs, administers, and troubleshoots servers and storage systems. HP assumes you are qualified in the
servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.



Part Number: 656396-002
August 2012
Edition: 2

ページ2に含まれる内容の要旨

© Copyright 2012 Hewlet-Ptackard Development Company, L.P . The information contained herein is subject to change without notice. The only nwtia esrr faor HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an ad w diatirorn aa nlty. HP shall not be liable for technical or editorial er o rorrs omissions contained herein. Microsoft® and Windows® are U.S. registered trademarks of Mi

ページ3に含まれる内容の要旨

Contents Component identification ............................................................................................................... 6 Front panel component s............................................................................................................................. 6 Front panel LEDs and butto n...................................................................................................................... s 6 Drive LED definition s......................

ページ4に含まれる内容の要旨

Installing the Trusted Platform Module boa ..................................................................................... rd 39 Retaining the recovery key/password .............................................................................................. 40 Enabling the Trusted Platform Module ............................................................................................... 41 Cabling ..................................................................................

ページ5に含まれる内容の要旨

Modifications .......................................................................................................................................... 60 Cables ................................................................................................................................................... 60 Canadian notice (Avis Canadien .............................................................................................................. ) 60 European Union regulatory notic e.

ページ6に含まれる内容の要旨

Component identification Front panel component s Item Description Hard drive bay 1 1 Server blade release butto n 2 Server blade release lever 3 Hard drive bay 2 4 HP cCl - ass Blade SUV connector* (behind the serial label pull 5 tab) Serial label pull ta b 6 *The SUV connector and the HP-C class Blade SUV Cable are used for some server blade configuration and diagnostic procedures. Front panel LEDs and butto ns Item Description Status Health status LED Solid G

ページ7に含まれる内容の要旨

Item Description Status Off = Normal (System is in stand by) System power LED Solid Green = System is powered o n. 2 Flashing Green = System is waiting to power on; Power On/Standby button is pressed. Solid Amber = System is in standby; Power On/Standby Button service is initialized. Off and the Health Status LED bar is off = The system has no power. Off and the Health Status LED bar is flashing green = The Power On/Standby Button service is being initialize. d UID LED Solid Blue = Ide

ページ8に含まれる内容の要旨

System board component s Item Description HP cCl - ass Blade SUV Cable connect or 1 System battery 2 Processor socket 2 3 Processor 2 DIMM slots ( 8) 4 Processor 1 DIMM slots ( 8) 5 SAS controller connector 6 Processor socket 1 (populated ) 7 Accelerator cache connecto r 8 Mezzanine connector 1 (Type A mezzanine only) 9 Mezzanine connector 2 (Type A or Type B mezzanine) 10 Enclosure connector 11 MicroSD card slot 12 FlexibleLOM connectors (2) 13 Internal USB co

ページ9に含まれる内容の要旨

Position Default Function Off Off = Powe-ron password is enabled. S5 On = Powe-ron password is disabled. Off Off = No function S6 On = ROM reads system configuration as invalid. — Reserved S7 — Reserved S8 — Reserved S9 — Reserved S10 — Reserved S11 — Reserved S12 To access redundant ROM, set S1, S5, and S6 to on. When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all system configuration settings from both CMOS and

ページ10に含まれる内容の要旨

DIMM tool location The DIMM tool is used to open and close an empty DIMM slot. HP cC - lass Blade SUV Cable Item Connector Description Server blade For connecting to the SUV connector on the 1 server blade front panel Video For connecting a video monitor 2 USB For connecting up to two USB devic es 3 Serial For trained personnel to connect a null modem 4 serial cable and perform advanced diagnostic procedures Component identification 10

ページ11に含まれる内容の要旨

Operations Power up the server blade The Onboard Administrator initiates an automatic pow -uepr sequence when the server blade is installed. If the default setting is changed, use one of the following methods to power up the serve r blade: • Use a virtual power button selection through iL O. • Press and release the Power On/Standby butto n. When the server blade goes from the standby mode to the full power mode, the system power LED changes from amber to solid green. The healtta h s tus LE

ページ12に含まれる内容の要旨

o poweroff server [bay number] force This form of the command forces the server blade to enter standby mode ou w t pitrhoperly exiting applications and the OS. If an application stops responding, this method forces a shu tdown. • Use the Onboard Administrator GUI to initiate a shutdo wn: a. Select the Enclosure Information tab. b. In the Device Bays item, select the Ov erall checkbox. c. From the Virtual Power menu, initiate a shutdown of applications and th e OS: — For a controlled shutdo

ページ13に含まれる内容の要旨

Remove the access panel To remove the component: 1. Power down the server blad (eon page 11). 2. Remove the server blade (on page 12). 3. Press the access panel release butto n. 4. Slide the access panel towards the rear of the server blade, and then lift to remove th e panel. Install the access panel 1. Place the access panel on top of the server bl ade. 2. Slide the access panel forward until it clicks into p lace. Remove the frontpane l/hard drive cage assembl y 1. Power down the s

ページ14に含まれる内容の要旨

2. Remove the server blade (on page 12). 3. Remove the access panel (on page 13). 4. Disconnect the capacitor pack cabling, if connect(" edF BWC capacitor pack cablin" o g n page 42 ). 5. Remove one or more DIMM baffle s. o DIMM baffle (left side) o DIMM baffle (right side) Operations 14

ページ15に含まれる内容の要旨

Remove the SAS controller 1. Power down the server blad (eon page 11). 2. Remove the server blade (on page 12). 3. Remove the access panel (on page 13). 4. Disconnect the capacitor pack cabling, if connect(" edF BWC capacitor pack cablin" o g n page 42 ). CAUTION: Always remove the SAS controller before removing the drive c age. CAUTION: Always be sure that both captive screws are disengaged before removing the SAS controller. Failure to disengage the screws may result in d

ページ16に含まれる内容の要旨

5. Close the SAS controller handle and then install the SAS controller. To properly seat the SAS controller, press firmly in the areas indicated on the SAS contro ller. Operations 16

ページ17に含まれる内容の要旨

Setup Overview Installation of a server blade requires the following st eps: 1. Install and configure an HP BladeSystem -Clcass enclosure. 2. Install any server blade option s. 3. Install interconnect modules in the enclosu re. 4. Connect the interconnect modules t the o network. 5. Install a server blade . 6. Complete the server blade configuratio n. Installing an HP BladeSystem c -Class enclosure Before performing any server bladsp e-ecific procedures, install an H BPladeSystem c-Clas


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