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User’s Guide
TPS40003 Based 5–A Converter in
Less Than One Square Inch
User’s Guide
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EVM IMPORTANT NOTICE Texas Instruments (TI) provides the enclosed product(s) under the following conditions: This evaluation kit being sold by TI is intended for use for ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY and is not considered by TI to be fit for commercial use. As such, the goods being provided may not be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety measures typically found in the end product
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DYNAMIC WARNINGS AND RESTRICTIONS It is important to operate this EVM within the input voltage range of 0 V to 5.5 V. Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questions concerning the input range, please contact a TI field representative prior to connecting the input power. Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM. Please consult
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SLUU130A – September 2002 – Revised February 2003 TPS40003-Based 5-A Converter in Less Than One Square Inch Mark Dennis Systems Power Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Schematic . . . . . . . . .
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SLUU130A – September 2002 – Revised February 2003 3 Schematic Figure 1. Application Diagram for the TPS40002/3 TPS40003-Based 5-A Converter in Less Than One Square Inch 5 +
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SLUU130A – September 2002 – Revised February 2003 4 Design Procedure 4.1 TPS4000X Family Device Selection The TPS4000X family of devices offers four selections to encompass the frequency and output current mode choices. The TPS40003 is selected for the following reasons. First, the internal oscillator components set a fixed switching frequency of 600 kHz. This allows minimally sized filter components in this compact design. The other choice related to the TPS4000X family involves the selection o
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SLUU130A – September 2002 – Revised February 2003 4.4 Output Capacitor Selection Selection of the output capacitor is based on many application variables, including function, cost, size, and availability. The minimum allowable output capacitance is determined by the amount of inductor ripple current and the allowable output ripple in equation (3). I RIPPLE 1.25 A (3) C 22F OUT(min) 8 f V 8 600 kHz 12 mV RIPPLE In this design, C is 22 µ F with V = 12 mV to allow for some margin. Howeve
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SLUU130A – September 2002 – Revised February 2003 4.7 Compensation Design The TPS40003 uses voltage mode control in conjunction with a high frequency error amplifier. For the fastest transient response, the loop crossover frequency is set at 1/10 f , or 60 kHz. The power circuit L-C double pole S corner frequency f is situated at 24 kHz, and the output capacitor ESR zero is far higher at approximately 1MHz. C The feedback compensation network is implemented to provide two zeroes and three poles.
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SLUU130A – September 2002 – Revised February 2003 Figure 2 shows the plots for the closed loop gain and phase with V = 3.3 V and I = 4.4 A. At the crossover IN OUT frequency of 60 kHz the phase margin is approximately 51 degrees. GAIN AND PHASE MARGIN vs FREQUENCY 40 150 30 Phase 100 20 50 10 0 0 –10 –50 Gain –20 –100 I = 4.4 A –30 LOAD V = 3.3 V I –40 –150 100 1000 10000 100000 1000000 Frequency – Hz Figure 2. 4.8 Snubber Component Selection The switch node where Q1 and L1 come together is ve
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SLUU130A – September 2002 – Revised February 2003 5 PowerPAD Packaging The TPS4000X family is available in the DGQ version of TI’s PowerPAD thermally enhanced package. In the PowerPAD, a thermally conductive epoxy is utilized to attach the integrated circuit die to the leadframe die pad, which is exposed on the bottom of the completed package. The leadframe die pad can be soldered to the PCB using standard solder flow techniques when maximum heat dissipation is required. However, depending on
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SLUU130A – September 2002 – Revised February 2003 6 Test Results/Performance Data The test setup is shown in figure 4 DC Power Supply Input wires 18 gauge or larger short as feasible C DVM1 IN + CIN = 470 µ F or larger, 6.3 V or higher, low ESR AIEA or OSCON capacitor. (–) (+) Place within 2 inches of J1. J1 TP2 TP1 VIN GND TP3 SCOPE TP5 SLUP182 GND VOUT J2 DVM2 TP6 TP4 (+) (–) Output wires 18 gauge or larger short as feasible LOAD (+) (–) Resistive load: 0.5 Ω , ≥ 5 W Active Load: set for 2.
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SLUU130A – September 2002 – Revised February 2003 Typical efficiency curves are shown in Figure 5 for an input of 3.3 V. EFFICIENCY vs OUTPUT CURRENT 100 95 90 85 80 75 70 65 60 55 50 01 2 3 4 5 6 I – Output Current – A OUT Figure 5. Figure 6 shows the switch node during typical operation at full load. Note that there is very minimal body diode conduction in the bottom MOSFET. This is a result of using the predictive delay control implementation. This technique is able to dynamically change the
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SLUU130A – September 2002 – Revised February 2003 Circuit operation with an output short circuit is shown in Figure 7. After each restart into a short circuit the pulses terminate for a period of approximately 6 ms. This causes the input power to collapse to minuscule levels, and the circuit is protected. SHORT CIRCUIT OPERATION 2 V/div t – Time – 1 ms/div Figure 7. Figure 8 shows the output voltage ripple which is approximately half the 24-mV limit. OUTPUT VOLTAGE RIPPLE 10 mV/div t – Time – 5
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SLUU130A – September 2002 – Revised February 2003 Figure 9 shows the startup waveforms with an input voltage of 3.3 V and a load of 0.3 Ω . Note that the output is held low until V (pin 4) goes above 0.12 V, and then the output comes up smoothly under closed loop SS softstart control. STARTUP WAVEFORM 1 V/div 500 mV/div 500 mV/div t – Time – 200 µ s/div Figure 9. Figure 10 shows the transient response for a fast load step from 1 A to 2 A. TRANSIENT RESPONSE 50 mV/div t – Time – 20 µ s/div Figur
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SLUU130A – September 2002 – Revised February 2003 7 PCB Layout Figures 11 through13 show the top copper layer, the bottom copper layer, and top assembly layer, of SLUP182. Figure 12 Figure 13 TPS40003-Based 5-A Converter in Less Than One Square Inch 15
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SLUU130A – September 2002 – Revised February 2003 8 List of Material Table 1 lists the components used in this design. With minor component tweaks this design could be modified to meet a wide range of applications. Reference Qty Description Manufacturer Part Number Capacitor C1, C2, C5, C6 4 Ceramic, 22 µ F, 6.3 V, X5R, 20%, 1210 Panasonic ECJ–4YB0J226M C10 1 Ceramic, 0.001 µ F, 10 V, X5R, 10%, 805 Panasonic ECJ–2YB1A105K C11 1 Ceramic, 0.0047 µ F, 50 V, X7R, 10% Vishay VJ0603Y472KXAAT C12 1 Cer
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