Résumé du contenu de la page N° 1
® ®
Intel Xeon Processor E3-1200
Product Family and LGA 1155 Socket
Thermal/Mechanical Specifications and Design Guidelines
April 2011
Document Number: 324973-001
Résumé du contenu de la page N° 2
Notice: This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information. Legal Lines and Disclaimers NFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODU
Résumé du contenu de la page N° 3
Contents 1Introduction ..............................................................................................................9 1.1 References ....................................................................................................... 10 1.2 Definition of Terms............................................................................................ 10 2 Package Mechanical & Storage Specifications.......................................................... 13 2.1 Package Mecha
Résumé du contenu de la page N° 4
® ® 6.1.4 Intel Xeon Processor E3-1220L (20W) Thermal Profile..............................47 ® ® 6.1.5 Intel Xeon Processor E3-1200 (95W) with Integrated Graphics Thermal Profile..........................................................................48 6.1.6 Processor Specification for Operation Where Digital Thermal Sensor Exceeds TCONTROL......................................................................49 6.1.7 Thermal Metrology.......................................................
Résumé du contenu de la page N° 5
11 Thermal Solution Quality and Reliability Requirements............................................ 89 11.1 Reference Heatsink Thermal Verification............................................................... 89 11.2 Mechanical Environmental Testing ....................................................................... 89 11.2.1 Recommended Test Sequence.................................................................. 90 11.2.2 Post-Test Pass Criteria .......................................
Résumé du contenu de la page N° 6
10-1 Mechanical Representation of the Solution.............................................................83 10-2 Physical Space Requirements for the Solution (side view)........................................84 10-3 Physical Space Requirements for the Solution (top view).........................................85 10-4 Fan Power Cable Connector Description ...............................................................86 10-5 Baseboard Power Header Placement Relative to Processor Socket.......
Résumé du contenu de la page N° 7
Tables 1-1 Reference Documents ........................................................................................ 10 1-2 Terms and Descriptions...................................................................................... 10 2-1 Processor Loading Specifications ......................................................................... 15 2-2 Package Handling Guidelines............................................................................... 15 2-3 Processor Materials..........
Résumé du contenu de la page N° 8
Revision History Document Number Description Date 324973-001 • Initial release of the document. April 2011 § 8 Thermal/Mechanical Specifications and Design Guideline
Résumé du contenu de la page N° 9
Introduction 1 Introduction This document is intended to provide guidelines for design of thermal and mechanical solution. Meanwhile thermal and mechanical specifications for the processor and associated socket are included. The components described in this document include: ® • The thermal and mechanical specifications for the following Intel server/ workstation processors: ® ® —Intel Xeon processor E3-1200 product family • The LGA1155 socket and the Independent Loading Mechanism (ILM) and b
Résumé du contenu de la page N° 10
Introduction 1.1 References Material and concepts available in the following documents may be beneficial when reading this document. Table 1-1. Reference Documents Document Location Notes Intel® Xeon® Processor E3-1200 Family Data Sheet Volume One http:// www.intel.com/ Assets/PDF/ datasheet/ 324970.pdf Intel® Xeon® Processor E3-1200 Family Datasheet Volume Two http:// www.intel.com/ Assets/PDF/ datasheet/ 324971.pdf Intel® Xeon® Processor E3-1200 Family Specification Update http:// www.intel.c
Résumé du contenu de la page N° 11
Introduction Table 1-2. Terms and Descriptions (Sheet 2 of 2) Term Description T _ The maximum case temperature as specified in a component specification. CASE MAX TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits. T Tcontrol is a static value that is below the TCC activation temperature and used as a trigger point
Résumé du contenu de la page N° 12
Introduction 12 Thermal/Mechanical Specifications and Design Guidelines
Résumé du contenu de la page N° 13
Package Mechanical & Storage Specifications 2 Package Mechanical & Storage Specifications 2.1 Package Mechanical Specifications The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with the motherboard via the LGA1155 socket. The package consists of a processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor thermal solutions, such as a heatsink. Fi
Résumé du contenu de la page N° 14
Package Mechanical & Storage Specifications 2.1.1 Package Mechanical Drawing Figure 2-2 shows the basic package layout and dimensions. The detailed package mechanical drawings are in Appendix D. The drawings include dimensions necessary to design a thermal solution for the processor. These dimensions include: 1. Package reference with tolerances (total height, length, width, and so on) 2. IHS parallelism and tilt 3. Land dimensions 4. Top-side and back-side component keep-out dimensions 5. Ref
Résumé du contenu de la page N° 15
Package Mechanical & Storage Specifications 2.1.3 Package Loading Specifications Table 2-1 provides dynamic and static load specifications for the processor package. These mechanical maximum load limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Also, any mechanical system or component testing should not exceed the maximum limits. The processor package substrate should not be used as a mechanical reference or load-bearing surface for the
Résumé du contenu de la page N° 16
Package Mechanical & Storage Specifications 2.1.7 Processor Materials Table 2-3 lists some of the package components and associated materials. Table 2-3. Processor Materials Component Material Integrated Heat Spreader (IHS) Nickel Plated Copper Substrate Fiber Reinforced Resin Substrate Lands Gold Plated Copper 2.1.8 Processor Markings Figure 2-3 shows the topside markings on the processor. This diagram is to aid in the identification of the processor. Figure 2-3. Processor Top-Side Markings
Résumé du contenu de la page N° 17
Package Mechanical & Storage Specifications 2.1.9 Processor Land Coordinates Figure 2-4 shows the bottom view of the processor package. . Figure 2-4. Processor Package Lands Coordinates AY AW AV AU AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U P R T N M K K J H G F E D C B A 33 35 37 39 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 34 36 38 40 2 4 6 8 10 1214 1618 20 22 24 26283032 Thermal/Mechanical Specifications and Design Guidelines 17
Résumé du contenu de la page N° 18
Package Mechanical & Storage Specifications 2.2 Processor Storage Specifications Table 2-4 includes a list of the specifications for device storage in terms of maximum and minimum temperatures and relative humidity. These conditions should not be exceeded in storage or transportation. . Table 2-4. Storage Conditions Parameter Description MinMaxNotes T The non-operating device storage temperature. ABSOLUTE STORAGE Damage (latent or otherwise) may occur when -55 °C 125 °C 1, 2, 3 subjected to f
Résumé du contenu de la page N° 19
LGA1155 Socket 3 LGA1155 Socket This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the processors. The socket provides I/O, power and ground contacts. The socket contains 1155 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard. The contacts are arranged in two opposing L-shaped patterns within the grid array. The grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the
Résumé du contenu de la page N° 20
LGA1155 Socket Figure 3-2. LGA1155 Socket Contact Numbering (Top View of Socket) 40 39 38 37 36 35 34 33 32 31 30 29 28 30 27 29 26 28 25 27 24 26 23 25 22 24 21 23 20 22 19 21 18 20 17 19 16 18 15 17 14 16 13 15 12 14 11 13 12 11 10 9 8 7 6 5 4 3 2 1 A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY 3.1 Board Layout The land pattern for the LGA1155 socket is 36 mils X 36 mils (X by Y) within each of the two L-shaped sections. Note that there is
