Résumé du contenu de la page N° 1
LGA1150 Socket
Application Guide
September 2013
Order No.: 328999-002
Résumé du contenu de la page N° 2
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHA
Résumé du contenu de la page N° 3
Contents—LGA1150 Socket Contents Revision History..................................................................................................................6 1.0 Introduction................................................................................................................. 7 1.1 Related Documents.................................................................................................7 1.2 Definition of Terms............................................................
Résumé du contenu de la page N° 4
LGA1150 Socket—Figures Figures 1 LGA1150 Pick and Place Cover.................................................................................... 9 2 LGA1150 Socket Land Pattern................................................................................... 10 3 Attachment to Motherboard...................................................................................... 11 4 Pick and Place Cover.............................................................................................
Résumé du contenu de la page N° 5
Tables—LGA1150 Socket Tables 1 Related Documents ...................................................................................................7 2 Terms and Descriptions..............................................................................................7 3 Socket Component Mass...........................................................................................24 4 1150-land Package and LGA1150 Socket Stackup Height.............................................. 24 5 Soc
Résumé du contenu de la page N° 6
LGA1150 Socket—Revision History Revision History Revision Number Description Revision Date 001 • Initial release June 2013 ® 002 • Added Desktop Intel Pentium processor family September 2013 LGA1150 Socket Application Guide September 2013 6 Order No.: 328999-002
Résumé du contenu de la page N° 7
Introduction—LGA1150 Socket 1.0 Introduction This document covers the LGA1150 socket for Desktop systems using the Desktop 4th ® ® ® Generation Intel Core™ processor family, Desktop Intel Pentium processor family, ® ® and for UP Server / Workstation systems using the Intel Xeon processor E3-1200 v3 product family. The information in this document include: • The thermal and mechanical specifications for the socket • The mechanical interface requirements to properly integrate the socket into a boa
Résumé du contenu de la page N° 8
LGA1150 Socket—Introduction Term Description FSC Fan Speed Control IHS Integrated Heat Spreader: a component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface. ILM Independent Loading Mechanism provides the force needed to seat the LGA1150 land package onto the socket contacts. MD Metal Defined pad is one where a pad is individually etched into the PCB with a minimum width trace exiting it.
Résumé du contenu de la page N° 9
LGA1150 Socket—LGA1150 Socket 2.0 LGA1150 Socket This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the processors. The socket provides I/O, power and ground contacts. The socket contains 1150 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard. The contacts are arranged in two opposing L-shaped patterns within the grid array. The grid array is 40 x 40 with 24 x 16 grid depopulation in the
Résumé du contenu de la page N° 10
LGA1150 Socket—LGA1150 Socket Figure 2. LGA1150 Socket Land Pattern 2.2 Attachment to Motherboard The socket is attached to the motherboard by 1150 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, and so on) to attach the socket. As indicated in Figure 1 on page 9, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process. LGA1150 Socket Application Guide September 2013 10 Order No.: 328999-002
Résumé du contenu de la page N° 11
LGA1150 Socket—LGA1150 Socket Figure 3. Attachment to Motherboard 2.3 Socket Components The socket has two main components, the socket body and Pick and Place (PnP) cover, and is delivered as a single integral assembly. Refer to Socket Mechanical Drawings for detailed drawings. Socket Body Housing The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable of withstanding 260 °C for 40 seconds, which is compatible with typical reflow/rework profiles. The socket coeff
Résumé du contenu de la page N° 12
LGA1150 Socket—LGA1150 Socket • Lead free SAC (SnAgCu) 305 solder alloy with a silver (Ag) content between 3% and 4% and a melting temperature of approximately 217 °C. The alloy is compatible with immersion silver (ImAg) and Organic Solderability Protectant (OSP) motherboard surface finishes and a SAC alloy solder paste. • Solder ball diameter 0.6 mm ± 0.02 mm, before attaching to the socket lead. The co-planarity (profile) and true position requirements are defined in Socket Mechanical Drawings
Résumé du contenu de la page N° 13
LGA1150 Socket—LGA1150 Socket Figure 4. Pick and Place Cover 2.4 Package Installation / Removal As indicated in Figure 5 on page 14, access is provided to facilitate manual installation and removal of the package. To assist in package orientation and alignment with the socket: • The package Pin 1 triangle and the socket Pin 1 chamfer provide visual reference for proper orientation. • The package substrate has orientation notches along two opposing edges of the package, offset from the centerlin
Résumé du contenu de la page N° 14
LGA1150 Socket—LGA1150 Socket Figure 5. Package Installation / Removal Features Socket Standoffs and Package Seating Plane Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Socket Mechanical Drawings. Similarly, a seating plane on the topside of the socket establishes the minimum package height. See Package / Socket Stackup Height on page 24 for the calculated IHS height above the motherboard. 2.5 Durability The socket must w
Résumé du contenu de la page N° 15
LGA1150 Socket—LGA1150 Socket 2.7 Component Insertion Forces Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/ Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force to insert the package into the socket. 2.8 Socket Size Socket information needed for motherboard design is given in Appendix C. This information should be used in conjunction with the referen
Résumé du contenu de la page N° 16
LGA1150 Socket—Independent Loading Mechanism (ILM) 3.0 Independent Loading Mechanism (ILM) The ILM has two critical functions – deliver the force to seat the processor onto the socket contacts and distribute the resulting compressive load evenly through the socket solder joints. The mechanical design of the ILM is integral to the overall functionality of the LGA1150 socket. Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly imp
Résumé du contenu de la page N° 17
Independent Loading Mechanism (ILM)—LGA1150 Socket The ILM assembly design ensures that, once assembled to the back plate, the only features touching the board are the shoulder screw and the insulated hinge frame assembly. The nominal gap of the load plate to the board is ~1 mm. When closed, the load plate applies two point loads onto the IHS at the “dimpled” features shown in Figure 6 on page 17. The reaction force from closing the load plate is transmitted to the hinge frame assembly and throu
Résumé du contenu de la page N° 18
LGA1150 Socket—Independent Loading Mechanism (ILM) • Desktop ILM back plate using marking “115XDBP” versus server ILM back plate using marking “115XSBP”. Note: When reworking a BGA component or the socket that the heatsink, battery, ILM and ILM back plate are removed prior to rework. The ILM back plate should also be removed when reworking through hole mounted components in a mini-wave or solder pot). The maximum temperature for the pre-applied insulator on the ILM is approximately 106 °C. Figur
Résumé du contenu de la page N° 19
Independent Loading Mechanism (ILM)—LGA1150 Socket Figure 8. Shoulder Screw 3.2 Assembly of Independent Loading Mechanism (ILM) to a Motherboard The ILM design allows a bottoms up assembly of the components to the board. See Figure 9 on page 20 for step by step assembly sequence. 1. Place the back plate in a fixture. The motherboard is aligned with the fixture. 2. Install the shoulder screw in the single hole near Pin 1 of the socket. Torque to a minimum and recommended 8 inch-pounds, but not
Résumé du contenu de la page N° 20
LGA1150 Socket—Independent Loading Mechanism (ILM) Figure 9. Independent Loading Mechanism (ILM) Assembly As indicated in Figure 10 on page 20, the shoulder screw, socket protrusion and ILM key features prevent 180 degree rotation of ILM cover assembly with respect to socket. The result is a specific Pin 1 orientation with respect to ILM lever. Figure 10. Pin1 and Independent Loading Mechanism (ILM) Lever LGA1150 Socket Application Guide September 2013 20 Order No.: 328999-002
