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Quad-Core Intel Xeon Processor
5400 Series
Thermal/Mechanical Design Guidelines
November 2007
Reference Number: 318611 Revision: 001
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Contents 1Introduction ..............................................................................................................9 1.1 Objective ...........................................................................................................9 1.2 Scope ................................................................................................................9 1.3 References .......................................................................................................
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D Safety Requirements................................................................................................89 E Quality and Reliability Requirements .......................................................................91 E.1 Intel Verification Criteria for the Reference Designs ................................................91 E.1.1 Reference Heatsink Thermal Verification ....................................................91 E.1.2 Environmental Reliability Testing .................
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B-5 CEK Spring (Sheet 1 of 3) .................................................................................. 62 B-6 CEK Spring (Sheet 2 of 3) .................................................................................. 63 B-7 CEK Spring (Sheet 3 of 3) .................................................................................. 64 B-8 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 1 of 6)..............................................
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Tables 1-1 Reference Documents.......................................................................................... 9 1-2 Terms and Descriptions ......................................................................................10 2-1 Processor Mechanical Parameters Table ................................................................13 2-2 Input and Output Conditions for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Management Features .......................................
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Revision History Reference Revision Description Date Number Number 318611 001 Initial release of the document. November 2007 § Quad-Core Intel® Xeon® Processor 5400 Series TMDG 7
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8 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
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Introduction 1 Introduction 1.1 Objective The purpose of this guide is to describe the reference thermal solution and design parameters required for the Quad-Core Intel® Xeon® Processor 5400 Series. It is also the intent of this document to comprehend and demonstrate the processor cooling solution features and requirements. Furthermore, this document provides an understanding of the processor thermal characteristics, and discusses guidelines for meeting the thermal requirements imposed over
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Introduction Table 1-1. Reference Documents (Sheet 2 of 2) Document Comment Clovertown_Harpertown_Wolfdale-DP Processor Enabled Components Available electronically CEK Thermal Models (in Flotherm* and Icepak*) Clovertown_Harpertown_Wolfdale-DP Processor Package Thermal Available electronically Models (in Flotherm and Icepak) RS - Wolfdale Processor Family BIOS Writers Guide (BWG) See Note following table. Thin Electronics Bay Specification (A Server System Infrastructure (SSI) www.ssiforum.com S
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Introduction Table 1-2. Terms and Descriptions (Sheet 2 of 2) T A processor unique value for use in fan speed control mechanisms. T is a CONTROL CONTROL temperature specification based on a temperature reading from the processor’s Digital Thermal Sensor. T can be described as a trigger point for fan speed control CONTROL implementation. T = -T . CONTROL OFFSET T An offset value from the TCC activation temperature value programmed into each OFFSET processor during manufacturing and can be obt
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Introduction 12 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
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Thermal/Mechanical Reference Design 2 Thermal/Mechanical Reference Design This chapter describes the thermal/mechanical reference design for Quad-Core Intel® Xeon® Processor 5400 Series. Both Quad-Core Intel® Xeon® Processor X5400 Series and Quad-Core Intel® Xeon® Processor E5400 Series are targeted for the full range of form factors (2U, 2U+ and 1U). The Quad-Core Intel® Xeon® Processor X5482 sku is an ultra performance version of the Quad-Core Intel® Xeon® Processor 5400 Series with 150W
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Thermal/Mechanical Reference Design 2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package The Quad-Core Intel® Xeon® Processor 5400 Series is packaged using the flip-chip land grid array (FC-LGA) package technology. Please refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for detailed mechanical specifications. The Quad-Core Intel® Xeon® Processor 5400 Series mechanical drawing shown in Figure 2-1, Figure 2-2, and Figure 2-3 provide the mechanical information for the
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Thermal/Mechanical Reference Design Figure 2-1. Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (1 of 3) Note: Guidelines on potential IHS flatness variation with socket load plate actuation and installation of the cooling solution are available in the processor Thermal/Mechanical Design Guidelines. Quad-Core Intel® Xeon® Processor 5400 Series TMDG 15
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Thermal/Mechanical Reference Design Figure 2-2. Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (2 of 3) 16 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
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Thermal/Mechanical Reference Design Figure 2-3. Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (3 of 3) Note: The optional dimple packing marking highlighted by Detail F from the above drawing may only be found on initial processors. Quad-Core Intel® Xeon® Processor 5400 Series TMDG 17
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Thermal/Mechanical Reference Design The package includes an integrated heat spreader (IHS). The IHS transfers the non- uniform heat from the die to the top of the IHS, out of which the heat flux is more uniform and spreads over a larger surface area (not the entire IHS area). This allows more efficient heat transfer out of the package to an attached cooling device. The IHS is designed to be the interface for contacting a heatsink. Details can be found in the Quad-Core Intel® Xeon® Processor
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Thermal/Mechanical Reference Design A potential mechanical solution for heavy heatsinks is the direct attachment of the heatsink to the chassis pan. In this case, the strength of the chassis pan can be utilized rather than solely relying on the baseboard strength. In addition to the general guidelines given above, contact with the baseboard surfaces should be minimized during installation in order to avoid any damage to the baseboard. The Intel reference design for Quad-Core Intel® Xeon® Pr
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Thermal/Mechanical Reference Design processor operating frequency (via the bus multiplier) and input voltage (via the VID signals). Please refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for further details on TM and TM2. PROCHOT# is designed to assert at or a few degrees higher than maximum T (as CASE specified by the thermal profile) when dissipating TDP power, and can not be interpreted as an indication of processor case temperature. This temperature delta accounts fo
