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System Board D2529
for TX300 S4
Technical Manual
Edition November 2007
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Comments… Suggestions… Corrections… The User Documentation Department would like to know your opinion of this manual. Your feedback helps us optimize our documentation to suit your individual needs. Feel free to send us your comments by e-mail to manuals@fujtsu-siemens.com. Certified documentation according to DIN EN ISO 9001:2000 To ensure a consistently high quality standard and user-friendliness, this documentation was created to meet the regulations of a quality management system which c
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Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Important notes . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1 Notes on safety . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 CE Certificate . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.3 Environmental Protection . . . . . . . . . . . . . . . . . . . 11 3 Feat
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1 Introduction This technical manual describes the system board D2529, which can be ® equipped with one or two Intel processors. You will find further information in the BIOS description. Further information about drivers is provided in the readme files on the hard disk, on the supplied “ServerStart“ or “Update“ CDs. Notational conventions The meanings of the symbols and fonts used in this manual are as follows: italics indicates commands, menu items, file and path names or software programs
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2 Important notes In this chapter you will find essential information regarding safety when working with your server. V CAUTION! With the system board installed you must open the system to access the system board. How to access the system board of your system is described in the appropriate service supplement. When handling the system board, refer to the specific notes on safety in the operating manual and/or service supplement for the respective server. 2.1 Notes on safety V CAUTION! ● The
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Notes on safety Important notes V ● Components can become very hot during operation. Ensure you do not touch components when making extensions to the system board. There is a danger of burns!. ● Transmission lines to peripheral devices must be adequately shielded. ● To the LAN wiring the requirements apply in accordance with the standards EN 50173 and EN 50174-1/2. As minimum requirement the use of a protected LAN line of category 5 for 10/100 MBps Ethernet, and/or of category 5e for Gigab
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Important notes Notes on safety Modules with electrostatic-sensitive components Systems and components that might be damaged by electrostatic discharge (ESD) are marked with the following label: Figure 1: ESD label When you handle components fitted with ESDs, you must observe the following points under all circumstances: ● You must always discharge yourself of static charges (e.g. by touching a grounded object) before working. ● The equipment and tools you use must be free of static charges.
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CE Certificate Important notes Notes about boards ● During installation/deinstallation of the system board, observe the specific instructions described in the service manual for the server. ● Remove the plug from the mains outlet so that system and system board are totally disconnected from the mains voltage. ● To prevent damage to the system board, the components and conductors on it, please take great care when you insert or remove boards. Take great care to ensure that extension boards ar
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Important notes Environmental Protection 2.3 Environmental Protection Environmentally friendly product design and development This product has been designed in accordance with standards for ”environmen- tally friendly product design and development“. This means that the designers have taken into account important criteria such as durability, selection of materials and coding, emissions, packaging, the ease with which the product can be dismantled and the extent to which it can be recycled. Th
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Environmental Protection Important notes Returning, recycling and disposal The device may not be disposed of with household rubbish. This appliance is labelled in accordance with European Directive 2002/96/EC concerning used electrical and electronic appliances (waste electrical and electronic equipment - WEEE). The guideline determines the framework for the return and recycling of used appliances as applicable throughout the EU. To return your used device, please use the return and collect
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3 Features 3.1 Overview Processors ® – 1 or 2 dual or quad core Intel Xeon™ processors ® – 2 processor sockets LGA771 for dual core Intel Xeon™ processors – 1x6, 2x6, 2x4 or 4 MB Second-Level-Cache (on-die unified, 64 byte cache- line size) – 32 KB L1 Cache (on-die, data per core) – 32 KB L1 Cache (on-die, instruction per core) – 2 x 266 MHz or 333 MHz data bus (equals FSB 1066 or 1333: quadruple data rate (or quad pumping) delivers 4 bits of data per clock cycle) – 2 VRM 11.0 onboard (EVRD)
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Overview Features – ADM7462 thermal system management controller Internal connectors – 1 floppy disk connector (26 pin) – 1 USB connector –3 Serial ATA – Power connector 24 pin (12V, -12V, 5V, 3.3V and 5V auxiliary) – Dual 12V power connector – Single 12V power connector – PC98 connector – Front panel – dual USB type C (for USB 2.0 port on front side) – 2 USB for streamer – 4 fan direct connectors – 1 connector for 2 CPU fans – Intrusion connector – 2 slots for memory riser cards – 1 SMB connect
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Features Overview BIOS features – Phoenix System-BIOS V 4.06 – SMBIOS 2.4 (DMI) – MultiProcessor Specification 1.4 – Server Hardware Design Guide –WfM – ACPI support – USB keyboard/mouse – boot possible from: – floppy disk drive (USB, Standard) – hard disk (SATA, SAS) – CD/DVD (SATA) – LAN (PXE, iSCSI) – console redirection support – OEM logo – CPU, memory disable – spare memory support Environmental protection 3V-Battery in holder for recycling Form factor – 290 x 460 mm – ACPI 2.0, OnNow, PCI
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Overview Features The TPM is activated via the BIOS system (for more information, refer to the Fujitsu Siemens Computers BIOS manual). V CAUTION! – When using the TPM, note the program descriptions provided by the third party manufacturers. – You must also create a backup of the TPM content. To do this, follow the third party manufacturer's instructions. Without this backup, if the TPM or the system board is faulty you will not be able to access your data. – If a failure occurs, please info
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Features Main memory 3.2 Main memory The system board supports up to 64 Gbyte main memory. Two slots for riser cards with 8 FBD slots each are available . Each memory bank can be populated with two 512 Mbyte, 1 Gbyte, 2 Gbyte or 4 Gbyte FBD PC2-4200F or FDB PC2-5300F fully buffered DIMM memory modules. ECC with memory scrubbing and with the Single Device Data Correction (SDDC) function is supported. I You will find the descriptions how to install memory modules in the Options Guide of your
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Main memory Features Module population DIMM 4D DIMM 4C DIMM 3D DIMM 4B DIMM 3C DIMM 4A DIMM 2D DIMM 3B DIMM 2C DIMM 3A DIMM 1D DIMM 2B DIMM 1C DIMM 2A DIMM C/D DIMM 1B DIMM 1A DIMM A/B Figure 3: Layout of the memory modules – The memory banks have to be populated sequentially top down in pairs of FBD PC2-4200F oder FBD PC2-5300 Fully Buffered DIMM memory modules. – Each pair consists of identical memory modules. There are three modes of operation for the main memory: – Non-mirrored mode – Mir
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Features Main memory Non-mirrored mode Using one riser card the module population is as follows: 1A + 1B (minimum configuration) - 2A + 2B - 3A + 3B - 4A + 4B Using two riser cards the population can be alternating (higher performance) or consecutive. Riser card A/B Riser card C/D Alternating 1A + 1B - - population (minimum configuration) Upgrade 1 - - 1C + 1D Upgrade 2 2A + 2B - - Upgrade 3 - - 2C +2D Upgrade 4 3A + 3B - - Upgrade 5 - - 3C + 3D Upgrade 6 4A + 4B Upgrade 7 4C + 4D Consecutive p
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PCI(e) slots Features Sparing mode Only one riser card is required for the sparing mode. The last populated bank will be in hotspare mode. 1A + 1B, 2A +2B minimum configuration, bank 2 in hotspare mode 1A + 1B, 2A +2B, 3A +3B upgrade 1, bank 3 in hotspare mode 1A + 1B, 2A +2B, 3A +3B, 4A + 4B upgrade 2, bank 4 in hotspare mode 3.3 PCI(e) slots Slot 7 PCI Express 7 Slot 6 PCI Express 6 Slot 5 PCI Express 5 Slot 4 PCI X 4 3 Slot 3 PCI Express 2 Slot 2 PCI Express 1 Slot 1 PCI Express Figure 4: M
