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ThinkCentr e
User Guide
Machine T ypes: 0104, 0154, 7539, and 7548
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ThinkCentr e User Guide Machine T ypes: 0104, 0154, 7539, and 7548
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Not e: Befor e using this information and the pr oduct it suppor ts, be sur e t o r ead and understand the ThinkCentr e Safety and W arr anty Guide and Appendix A “Notices” on page 71 . First Edition (November 2010) © Copyright L enovo 2010. LENO V O pr oducts, data, comput er softwar e, and ser vices have been developed e x clusively at privat e e xpense and ar e sold t o governmental entities as commer cial it ems as defined by 48 C.F .R. 2.101with limit ed and r estrict ed rights t o use, r e
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Contents Impor tant safety information . . . . . . v Cr eating and using r ecover y media . . . . . . 49 Cr eating r ecover y media . . . . . . . . . 49 Chapt er 1. P r oduct over view . . . . . . 1 Using r ecover y media . . . . . . . . . . 50 F eatur es . . . . . . . . . . . . . . . . . . 1 P er forming backup and r ecover y oper ations . . . 50 Specifications . . . . . . . . . . . . . . . . 3 P er forming a backup oper ation . . . . . . 50 Softwar e over view . . . . . . . . . . . . . . 4 P e
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Information r esour ces . . . . . . . . . . . . 67 C alling for ser vice . . . . . . . . . . . . 69 Online Books folder . . . . . . . . . . . 67 Using other ser vices . . . . . . . . . . 70 L enovo ThinkV antage T ools . . . . . . . . 67 P ur chasing additional ser vices . . . . . . 70 L enovo W elcome . . . . . . . . . . . . 68 Appendix A. Notices . . . . . . . . . 71 Access Help . . . . . . . . . . . . . . 68 T elevision output notice . . . . . . . . . . . 72 Safety and warr anty . . . . . . .
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Impor tant safety information C A UTION: Befor e using this manual, be sur e t o r ead and understand all the r elat ed safety information for this pr oduct. Refer t o the ThinkCentr e Safety and W arr anty Guide that you r eceived with this pr oduct for the lat est safety information. Reading and understanding this safety information r educes the risk of personal injur y and or damage t o your pr oduct. If you no longer have a copy of the ThinkCentr e Safety and W arr anty Guide , you can obtai
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vi ThinkCentr e User Guide
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Chapt er 1. P r oduct over view This chapt er pr ovides information about the comput er featur es, specifications, softwar e pr ogr ams pr ovided by L enovo, and locations of connect ors, components, par ts on the syst em boar d, and int ernal drives. This chapt er contains the following t opics: • “F eatur es” on page 1 : This section pr ovides information about the comput er featur es. • “Specifications” on page 3 : This section lists the physical specifications for your comput er . • “Softwar
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• Headphone connect or and micr ophone connect or on the fr ont panel • Audio line-in connect or , audio line-out connect or , and micr ophone connect or on the r ear panel • Int ernal speak er (available in some models) Connectivity 10/100/1000 Mbps int egr at ed E thernet contr oller Syst em management featur es • Ability t o st or e the power -on self-t est (POS T) har dwar e t est r esults • Advanced Configur ation and P ower Int er face (A CPI) • Aut omatic power -on star tup • Deskt op Man
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P ower supply • 240-watt aut o-sensing power supply Security featur es • A power -on passwor d and an administr at or passwor d t o det er unauthoriz ed use of your comput er • Computr ace • Cover pr esence switch (also called intrusion switch) (available in some models) • Enabling or disabling SA T A devices • Enabling or disabling the serial por t • Enabling or disabling USB connect ors • K eyboar d with fingerprint r eader (shipped with some models) • S tar tup sequence contr ol • S tar tup w
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Dimensions W idth: 99 mm (3.9 inches) Height: 335 mm (13.19 inches) Depth: 382 mm (15.04 inches) W eight Maximum configur ation as shipped: 6.6 kg (14.55 lbs) Envir onment • Air t emper atur e: Oper ating: 10°C t o 35°C (50°F t o 95°F) Non-oper ating: -40°C t o 60°C (-40°F t o 140°F) Non-oper ating: -10°C t o 60°C (14°F t o 140°F) (without package) • Humidity: Oper ating: 20% t o 80% (non-condensing) Non-oper ating: 20% t o 90% (non-condensing) • Altitude: Oper ating: -50 t o 10 000 ft (-15.2 t
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L enovo ThinkV antage T ools ® The L enovo ThinkV antage T ools pr ogr am guides you t o a host of information sour ces and pr ovides easy access t o various t ools t o help you work mor e easily and secur ely . F or mor e information, see “L enovo ThinkV antage T ools” on page 67 . L enovo W elcome The L enovo W elcome pr ogr am intr oduces some innovative built-in featur es of L enovo t o you and guides you thr ough some impor tant setup tasks t o help you mak e the most of your comput er . P
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L enovo ThinkV antage T oolbo x The L enovo ThinkV antage T oolbo x pr ogr am helps you maintain your comput er , impr ove computing security, diagnose comput er pr oblems, get familiar with the innovative t echnologies pr ovided by L enovo, and get mor e information about your comput er . F or mor e information, see “L enovo ThinkV antage T oolbo x” on page 64. Adobe Reader The Adobe Reader pr ogr am is a t ool used t o view , print, and sear ch PDF documents. See “Online Books folder ” on page
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1 Optical drive eject/close butt on 5 USB connect or 2 P ower switch 6 Micr ophone connect or 3 Har d disk drive activity indicat or 7 Headphone connect or 4 P ower indicat or 8 USB connect or L ocating connect ors and par ts on the r ear of your comput er Figur e 2 “Rear connect or and par t locations” on page 7 shows the locations of the connect ors and par ts on the r ear of your comput er . Some connect ors on the r ear of your comput er ar e color -coded t o help you det ermine wher e t o c
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Connect or Description Audio line-in connect or Used t o r eceive audio signals fr om an e xt ernal audio device, such as a st er eo syst em. When you attach an e xt ernal audio device, a cable is connect ed between the audio line-out connect or of the device and the audio line-in connect or of the comput er . Audio line-out connect or Used t o send audio signals fr om the comput er t o e xt ernal devices, such as power ed st er eo speak ers (speak ers with built-in amplifiers), headphones, mult
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Figur e 3. Component locations 1 Heat sink and fan assembly 6 F r ont be z el 2 P ower supply assembly 7 F r ont fan assembly 3 Memor y modules (2) 8 Har d disk drive 4 Optical drive (available in some models) 9 PCI car d (available in some models) 5 F r ont USB and audio assembly 10 Heat sink fan duct L ocating par ts on the syst em boar d Figur e 4 “S yst em boar d par t locations” on page 10 shows the locations of the par ts on the syst em boar d. Chapt er 1 . P r oduct over view 9
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Figur e 4. S yst em boar d par t locations 1 4-pin power connect or 11 Clear Complementar y Metal Oxide Semiconduct or (CMOS) /Recover y jumper 2 Micr opr ocessor 12 Cover pr esence switch connect or (also called intrusion switch connect or) 3 Micr opr ocessor fan connect or 13 Int ernal speak er connect or 4 Memor y slots (4) 14 F r ont audio connect or 5 Serial (COM 2) connect or 15 PCI car d slots (2) 6 24-pin power connect or 16 PCI Expr ess x1 car d slot 7 P ower fan connect or 17 Batt er y
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Figur e 5 “Drive bay locations” on page 11 shows the locations of the drive bays in your comput er . Figur e 5. Drive bay locations 1 Bay 1 - Optical drive bay (with an optical drive installed in some models) 2 Bay 2 - Slim car d r eader drive bay 3 Bay 3 - SA T A har d disk drive bay Chapt er 1 . P r oduct over view 11
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12 ThinkCentr e User Guide
