Résumé du contenu de la page N° 18
FIGURE (2/4) Fig. No. Title Page 6-10 8-Bit Timer Mode Control Register Setting for External Event Counter Operation ............. 93 6-11 External Event Counter Operation Timings (with Rising Edge Specification) .................... 93 6-12 8-Bit Timer Mode Control Register Settings for Square-Wave Output Operation .............. 94 6-13 8-Bit Timer Mode Control Register Settings for PWM Output Operation ........................... 96 6-14 PWM Output Operation Timing (Active high setting) .....
Résumé du contenu de la page N° 19
FIGURE (3/4) Fig. No. Title Page 11-6 Baud Rate Generator Control Register Format (2/2) ......................................................... 145 11-7 Asynchronous Serial Interface Transmit/Receive Data Format .......................................... 157 11-8 Asynchronous Serial Interface Transmission Completion Interrupt Request Timing .......... 159 11-9 Asynchronous Serial Interface Reception Completion Interrupt Request Timing ............... 160 11-10 Receive Error Timing ............
Résumé du contenu de la page N° 20
FIGURE (4/4) Fig. No. Title Page 15-6 PROM Read Timing ........................................................................................................... 213 A-1 Development Tool Configuration ........................................................................................ 232 A-2 EV-9200G-44 Drawing (For Reference Only) ..................................................................... 241 A-3 EV-9200G-44 Footprint (For Reference Only) .......................................
Résumé du contenu de la page N° 1
μPD78083 SUBSERIES
8-BIT SINGLE-CHIP MICROCONTROLLER
μPD78081 μPD78081(A)
μPD78082 μPD78082(A)
μPD78P083 μPD78P083(A)
μPD78P081(A2)
Document No. U12176EJ2V0UM00 (2nd edition)
(O. D. No. IEU-886)
Date Published May 1997 N
Printed in Japan
1992 1994
©
Résumé du contenu de la page N° 2
NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build stati
Résumé du contenu de la page N° 3
FIP, IEBus, and QTOP are trademarks of NEC Corporation. MS-DOS and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. IBM DOS, PC/AT and PC DOS are trademarks of International Business Machines Corporation. HP9000 Series 300, HP9000 Series 700, and HP-UX are trademarks of Hewlett-Packard Company. SPARCstation is a trademark of SPARC International, Inc. Sun OS is a trademark of Sun Microsystems, Inc. Ethernet is a trademark
Résumé du contenu de la page N° 4
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. The information in this document is subject to change without notice. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrig
Résumé du contenu de la page N° 5
Regional Information Some information contained in this document may vary from country to country. Before using any NEC product in your application, please contact the NEC office in your country to obtain a list of authorized representatives and distributors. They will verify: • Device availability • Ordering information • Product release schedule • Availability of related technical literature • Development environment specifications (for example, specifications for third-party tools and compo
Résumé du contenu de la page N° 6
Major Revision in This Edition Page Description Throughout The following products have been already developed μPD78081CU-×××, 78081GB-×××-3B4, 78082CU-×××, 78082GB-×××-3B4, 78P083CU, 78P083DU, 78P083GB-3B4 The following products have been added μPD78081GB-×××-3BS-MTX, 78082GB-×××-3BS-MTX, 78P083GB-3BS-MTX, 78081GB(A)-×××-3B4, 78082GB(A)-×××-3B4, 78P083CU(A), 78P083GB(A)-3B4, 78P083GB(A)-3BS-MTX, 78081GB(A2)-×××-3B4 Changes supply voltage to VDD = 1.8 to 5.5V. p. 9 1.6 78K/0 Series Development h
Résumé du contenu de la page N° 7
PREFACE Readers This manual has been prepared for user engineers who want to understand the functions of the μPD78083 subseries and design and develop its application systems and programs. Caution In the μPD78083 Subseries, the μPD78P083DU is not designed to maintain the reliability required for use in customers’ mass-produced equipment. Please use this device only for experimentation or for evaluation of functions. Purpose This manual is intended for users to understand the functions described
Résumé du contenu de la page N° 8
To know application examples of the functions provided in the μPD78083 Subseries: → Refer to Application Note separately provided. Legend Data representation weight : High digits on the left and low digits on the right Active low representations : ××× (line over the pin and signal names) Note : Description of note in the text. Caution : Information requiring particular attention Remarks : Additional explanatory material Numeral representations : Binary ... ×××× or ××××B Decimal ... ×××× Hexadeci
Résumé du contenu de la page N° 9
Related Documents The related documents indicated in this publication may include preliminary versions. However, preliminary versions are not marked as such. Related documents for μPD78054 subseries Document No. Document name Japanese English μPD78083 Subseries User’s Manual U12176J This Manual μPD78081, 78082 Data Sheet U11415J U11415E μPD78P083 Data Sheet U11006J U11006E μPD78081(A), 78082(A), 78081(A2) Data Sheet In preparation To be prepared μPD78P083(A) Data Sheet U12175J U12175E μPD78083
Résumé du contenu de la page N° 10
Development Tool Documents (User’s Manuals) Document No. Document name Japanese English RA78K Series Assembler Package Operation EEU-809 EEU-1399 Language EEU-815 EEU-1404 RA78K Series Structured Assembler Preprocessor EEU-817 EEU-1402 RA78K0 Assembler Package Structured assembly language U11789J U11789E Assembly language U11801J U11801E Operation U11802J U11802E CC78K Series C Compiler Operation EEU-656 EEU-1280 Language EEU-655 EEU-1284 CC78K/0 C Compiler Operation U11517J U11517E Language U11
Résumé du contenu de la page N° 11
Documents for Embedded Software (User’s Manual) Document No. Document name Japanese English 78K/0 Series Real-Time OS Basics U11537J — Installation U11536J — Technicals U11538J — OS for 78K/0 Series MX78K0 Basics EEU-5010 — Fuzzy Knowledge Data Creation Tool EEU-829 EEU-1438 78K/0, 78K/II, 87AD Series Fuzzy Inference Development Support System—Translator EEU-862 EEU-1444 78K/0 Series Fuzzy Inference Development Support System—Fuzzy Inference Module EEU-858 EEU-1441 78K/0 Series Fuzzy Inference D
Résumé du contenu de la page N° 12
CONTENTS CHAPTER 1 OUTLINE..................................................................................................................... 1 1.1 Features ............................................................................................................................. 1 1.2 Applications ...................................................................................................................... 2 1.3 Ordering Information ..................................................
Résumé du contenu de la page N° 13
3.2.3 Special Function Register (SFR) ......................................................................................... 37 3.3 Instruction Address Addressing ..................................................................................... 40 3.3.1 Relative Addressing ............................................................................................................. 40 3.3.2 Immediate addressing ...............................................................................
Résumé du contenu de la page N° 14
6.4 8-Bit Timer/Event Counters 5 and 6 Operations ............................................................ 90 6.4.1 Interval timer operations ...................................................................................................... 90 6.4.2 External event counter operation ......................................................................................... 93 6.4.3 Square-wave output ...........................................................................................
Résumé du contenu de la page N° 15
12.4 Interrupt Servicing Operations ........................................................................................ 181 12.4.1 Non-maskable interrupt request acknowledge operation .................................................... 181 12.4.2 Maskable interrupt request acknowledge operation ............................................................ 184 12.4.3 Software interrupt request acknowledge operation ............................................................. 187 12.4.4 Mult
Résumé du contenu de la page N° 16
A.5 System-Upgrade Method from Other In-Circuit Emulators to 78K/0 Series In-Circuit Emulator............................................................................................................ 240 APPENDIX B EMBEDDED SOFTWARE .......................................................................................... 243 B.1 Real-time OS...................................................................................................................... 244 B.2 Fuzzy Inference Development
Résumé du contenu de la page N° 17
FIGURE (1/4) Fig. No. Title Page 2-1 Pin Input/Output Circuit of List ............................................................................................ 23 3-1 Memory Map (μPD78081) .................................................................................................. 25 3-2 Memory Map (μPD78082) .................................................................................................. 26 3-3 Memory Map (μPD78P083) ...................................................
