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Thermal Design Guide for
Socket F (1207) Processors
Publication # 32800 Revision: 3.00
Issue Date: August 2006
Advanced Micro Devices
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© 2005 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. The informa- tion contained herein may be of a preliminary or advance nature and is subject to chang
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32800 Rev. 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Contents Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Chapter 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 1.1 Summary of Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Chap
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Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 August 2006 5.3.4 Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 5.3.5 Fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 5.3.6 Thermal Interface Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Appendix A Keep-Out Drawings for Platforms Using the PIB
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32800 Rev. 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors List of Figures Figure 1. The 1207-Pin Socket. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Figure 2. Motherboard Component Height Restrictions for Platforms Using the AMD PIB Thermal Solution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Figure 3. Exploded View of Thermal Solution AMD PIB Platforms based on S
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Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 August 2006 Figure 26. Socket F (1207) 2U-4P Socket Outline and Socket Window. . . . . . . . . . . . . . . . . . . . .56 Figure 27. Socket F (1207) 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F (1207) 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58 Figure 29. Socket F (1207) 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . .
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32800 Rev. 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors List of Tables Table 1. Mechanical and Thermal Specifications for Socket F (1207) Processors. . . . . . . . . . . .13 Table 2. Thermal Solution Design Requirements for Platforms Using Socket F (1207) PIB processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Table 3. Components for the Processor Thermal Reference Design for the AMD PIB Thermal So
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Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 August 2006 8 List of Tables
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32800 Rev. 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Revision History Date Revision Description July 2006 3.00 Initial Public release. Revision History 9
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Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 August 2006 10 Revision History
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32800 Rev. 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Chapter 1 Introduction This document specifies performance requirements for the design of thermal and mechanical solutions for socket F (1207) processors, utilizing AMD 64-bit technology. Detailed drawings, descriptions, and design targets are provided to help manufacturers, vendors, and engineers meet the requirements for the socket F (1207) processors. 1.1 Summary of Requirements To allow optimal reliability of
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Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 August 2006 12 Introduction Chapter 1
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32800 Rev. 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Chapter 2 Processor Thermal Solutions This chapter describes the thermal solutions for systems based on socket F (1207) processors. 2.1 Processor Specifications The objective of thermal solutions is to maintain the processor temperature within specified limits. Thermal performance, physical mounting, acoustic noise, mass, reliability, and cost must be considered during the design of a thermal solution. Table 1 list
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Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 August 2006 2.2 Socket Description Figure 1 shows a three-dimensional view of the 1207-pin socket used with socket F (1207) processors. This socket is based on LGA (land-grid array) technology. The LGA socket has 35 pads x 35 pads on a 1.1 mm pitch, with a 3.52 mm wide de-populated BGA (ball grid array) zone in the center, plus a 0.66 mm offset between the two BGA arrays. A small solder-ball makes the electrical and mechanic
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32800 Rev. 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Chapter 3 Thermal Design of Platforms Using the AMD Processor-In-a-Box (PIB) Thermal Solution This chapter describes the motherboard component height restrictions, thermal-solution design requirements, sample heat sinks, and attachment methods for platforms using the AMD Processor-In- a-Box (PIB) thermal solution for socket F (1207) processors. 3.1 Motherboard Component Height Restrictions The mounting solution f
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Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 August 2006 Depending on the system features and layout, more space around the socket may be available for the thermal solution than is shown in Figure 2 on page 15. This space permits heat sink designs with better thermal performance. Appendix A on page 37 shows a complete, detailed set of keep-out drawings for the AMD PIB thermal solution for socket F (1207). 3.2 Thermal Solution Design Requirements Table 2 provides the de
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32800 Rev. 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Table 3 lists the parts used in the thermal reference design for the AMD PIB thermal solution for socket F (1207) processors. Table 3. Components for the Processor Thermal Reference Design for the AMD PIB Thermal Solution Part Description Material Quantity Heat sink Copper with aluminum fins 1 Heatpipe Sintered-powder copper 2 Fan Plastic 1 Spring clip SK7 heat treated spring steel 1 Retention frame Lexan, 20% glas
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Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 August 2006 Figure 3. Exploded View of Thermal Solution AMD PIB Platforms based on Socket F (1207) Processors 3.3.1 Backplate Assembly The backplate is mounted on the backside of the motherboard and enhances local stiffness to support shock and vibration loads acting on the heat sink. The backplate assembly prevents excessive motherboard warpage in the area near the processor. Without a backplate, excessive warpage could c
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32800 Rev. 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Note: Do not cut entirely through the center rib. Doing so will compromise the stiffness of the backplate. The plate uses two PennEngineering (PEM) standoffs that serve multiple purposes. The PEM standoffs serve as attachment points for the retention frame screws. They also align the backplate properly to the motherboard. Features in the retention frame slide over the standoffs and allow the installation of the
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Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.02 August 2006 20 Thermal Design of Platforms Using the AMD Processor-In-a- Chapter 3 Box (PIB) Thermal Solution
