Manual de instrucciones de Dell STUDIO XPSTM 8100

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Dell™ Studio XPS™ 8100:
Comprehensive Specifications
This document provides information that you may need when setting up,
updating drivers for, and upgrading your computer.
NOTE: Offerings may vary by region. For more information regarding the configuration
of your computer, click Start → Help and Support and select the option to view
information about your computer.
Processor
®
Type Intel Core™ i7-870
Intel Core i7-860
Intel Core i7-750
Intel Core i5-670
Intel Core i5-661
Intel Core i5-66

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Processor (continued) L3 cache Intel Core i5-670 upto 4 MB Intel Core i5-661 Intel Core i5-660 Intel Core i5-650 Intel Core i3-540 Intel Core i3-530 Intel Core i7-750 upto 6 MB Intel Core i7-870 upto 8 MB Intel Core i7-860 Memory Connectors four internally-accessible DDR3 DIMM sockets Capacities 1 GB, 2 GB, and 4 GB Memory type 1066-MHz or 1333-MHz DDR3 DIMM; non-ECC memory only Memory configurations possible 4 GB, 6 GB, 8 GB, 12 GB, and 16 GB (64-bit operating system) Computer Information Sy

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Drives and Devices Externally accessible • two 5.25-inch bays for SATA DVD+/-RW Super Multi Drive or Blu-ray Disc™ combo or Blu-ray Disc RW drive Internally accessible two 3.5-inch bays for SATA hard drives ® Wireless (optional) WiFi/Bluetooth wireless technology Expansion Bus PCI Express • Gen2 x1 slot bi-directional speed — 500 MB/s • Gen2 x16 slot bi-directional speed — 16 GB/s PCI 32-bit speed — 33 MHz SATA 2.0 1.5 Gbps and 3.0 Gbps USB 2.0 • high speed — 480 Mbps • full speed — 12

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Memory Card Reader Cards supported • CompactFlash (CF) card • Smart Media (SM) card •xD-Picture (xD) card • Memory Stick (MS) card • Memory Stick Duo card • Memory Stick PRO Duo card • Memory Stick PRO (MSPRO) card •Memory Stick PRO HG (MSPRO HG) card • SecureDigital (SD) card • SecureDigital Card (SDHC) 2.0 • MultiMedia Card (MMC) •MicroDrive (MD) Video ® Integrated Intel Graphics Media Accelerator HD Discrete PCI Express x16 card Audio Type Integrated 7.1 channel, High Definition audio

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System Board Connectors (continued) Chassis fan one 3-pin connector Front USB connector five 9-pin connectors Front audio connector one 9-pin connector for 2-channel stereo sound and microphone SATA four 7-pin connectors S/PDIF out one 5-pin connector External Connectors Network adapter RJ45 connector USB two top-panel, two front-panel, and four back-panel USB 2.0-compliant connectors Audio top panel — one headphone and one microphone connector back panel — six connectors for 7.1 support S/

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Expansion Slots (continued) Connector data width (maximum) 1 PCI Express lane PCI Express x16 Connectors one Connector size 164-pin connector Connector data width (maximum) 16 PCI Express lane Power DC Power Supply Wattage 350 W Maximum heat dissipation 1836 BTU/hr NOTE: Heat dissipation is calculated by using the power supply wattage rating. Input voltage 115/230 VAC Input frequency 50/60 Hz Rated output current 8 A/4 A Battery Coin-cell battery 3-V CR2032 lithium coin cell Physical Height 407.

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Computer Environment (continued) Maximum vibration (using a random-vibration spectrum that simulates user environment): Operating 0.25 GRMS Storage 2.2 GRMS Maximum shock (measured with hard drive in head-parked position and a 2-ms half-sine pulse): Operating Half-Sine Pulse: 40G for 2 ms with a change in velocity of 20 in/s (51 cm/s) Storage Half-Sine Pulse: 50G for 26 ms with a change in velocity of 320 in/s (813 cm/s) Altitude (maximum): Operating -15.2 to 3048 m (-50 to 10,000 ft) Storag

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