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®
Intel 945G/945GZ/945GC/
945P/945PL Express Chipset
Family
Thermal and Mechanical Design Guidelines (TMDG)
®
- For the Intel 82945G/82945GZ/82945GC Graphics Memory
®
Controller Hub (GMCH) and Intel 82945P/82945PL Memory
Controller Hub (MCH)
February 2008
Document Number: 307504-004
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INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELA
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Contents 1 Introduction.....................................................................................................7 1.1 Terminology ..........................................................................................8 1.2 Reference Documents .............................................................................9 2 Product Specifications......................................................................................11 2.1 Package Description..............
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Figures Figure 1. (G)MCH Non-Grid Array ......................................................................12 Figure 2. 0° Angle Attach Methodology (top view, not to scale)..............................16 Figure 3. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom view shown, not to scale)...........................................................................16 Figure 4. Airflow Temperature Measurement Locations .........................................
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Revision History Revision Description Date Number -001 • Initial Release May 2005 ® -002 • Added Intel 82945PL specifications October 2005 ® -003 • Added Intel 82945GZ specifications December 2005 ® -004 • Added Intel 82945GC specifications February 2008 § Thermal and Mechanical Design Guidelines 5
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6 Thermal and Mechanical Design Guidelines
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Introduction 1 Introduction As the complexity of computer systems increases, so do power dissipation requirements. The additional power of next generation systems must be properly dissipated. Heat can be dissipated using improved system cooling, selective use of ducting, and/or active/passive heatsinks. The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within functional limits. The functional temperature limit is the
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Introduction 1.1 Terminology Term Description BGA Ball Grid Array. A package type defined by a resin-fiber substrate where a die is mounted and bonded. The primary electrical interface is an array of solder balls attached to the substrate opposite the die and molding compound. FC-BGA Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a die is mounted using an underfill C4 (Controlled Collapse Chip Connection) attach style. The primary electrical interfa
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Introduction 1.2 Reference Documents Document Comments ® Intel 945G/945GZ/945P/945PL Express Chipset Family http://developer.intel.com/des Datasheet ign/chipsets/datashts/307502. htm ® Intel I/O Controller Hub 7 (ICH7) Datasheet http://developer.intel.com//de sign/chipsets/datashts/30701 3.htm ® Intel I/O Controller Hub 7 (ICH7) Thermal Design Guidelines http://developer.intel.com//de sign/chipsets/designex/30701 5.htm ® ® Intel Pentium 4 Processor 670, 660, 650, 640, and 630 and htt
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Introduction 10 Thermal and Mechanical Design Guidelines
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Product Specifications 2 Product Specifications This chapter provides the package description and loading specifications. The chapter also provides component thermal specifications and thermal design power descriptions for the (G)MCH. 2.1 Package Description The (G)MCH is available in a 34 mm [1.34 in] x 34 mm [1.34 in] Flip Chip Ball Grid Array (FC-BGA) package with 1202 solder balls. The die size is currently 9.6 mm [0.378in] x 10.6 mm [0.417in]. A mechanical drawing of the pack
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Product Specifications Figure 1. (G)MCH Non-Grid Array 2.2 Package Loading Specifications Table 1 provides static load specifications for the chipset package. This mechanical maximum load limit should not be exceeded during heatsink assembly, shipping conditions, or standard use conditions. Also, any mechanical system or component testing should not exceed the maximum limit. The chipset package substrate should not be used as a mechanical reference or load-bearing surface for the
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Product Specifications 2.3 Thermal Specifications To ensure proper operation and reliability of the (G)MCH, the temperature must be at or below the maximum value specified in Table 2. System and component level thermal enhancements are required to dissipate the heat generated and maintain the (G)MCH within specifications. Chapter 3 provides the thermal metrology guidelines for case temperature measurements. The (G)MCH must also operate above the minimum case temperature specificat
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Product Specifications 2.4.1 Methodology 2.4.1.1 Pre-Silicon To determine TDP for pre-silicon products in development, it is necessary to make estimates based on analytical models. These models rely on extensive knowledge of the past chipset power dissipation behavior along with knowledge of planned architectural and process changes that may affect TDP. Knowledge of applications available today and their ability to stress various components of the chipset is also included in the mo
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Thermal Metrology 3 Thermal Metrology The system designer must measure temperatures to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques of measuring (G)MCH component case temperatures. 3.1 Case Temperature Measurements To ensure functionality and reliability, the (G)MCH is specified for proper operation when T is maintained at or below the maximum temperature listed in Table 2. The C surface temperature at the geome
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Thermal Metrology Figure 2. 0° Angle Attach Methodology (top view, not to scale) Figure 3. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom view shown, not to scale) 3.2 Airflow Characterization Figure 4 describes the recommended location for air temperature measurements measured relative to the component. For a more accurate measurement of the average approach air temperature, Intel recommends averaging temperatures recorded from two thermocouples space
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Thermal Metrology Figure 4. Airflow Temperature Measurement Locations Airflow velocity should be measured using industry standard air velocity sensors. Figure 4 Typical airflow sensor technology may include hot wire anemometers. provides guidance for airflow velocity measurement locations. These locations are for a typical JEDEC test setup and may not be compatible with chassis layouts due to the proximity of the processor to the (G)MCH. The user may have to adjust the locations
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Thermal Metrology 18 Thermal and Mechanical Design Guidelines
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Reference Thermal Solution 4 Reference Thermal Solution The reference component thermal solution for the (G)MCH for ATX platforms uses two ramp retainers, a wire preload clip, and four custom MB anchors. The Intel Balanced Technology Extended (BTX) reference design uses a Z-clip attach for the (G)MCH heatsink. This chapter provides detailed information on operating environment assumptions, heatsink manufacturing, and mechanical reliability requirements for the (G)MCH. 4.1 Operating
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Airflow Direction Airflow Direction Reference Thermal Solution Figure 5. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on an ATX Platform Airflow Direction Airflow Direction Airflow Direction Airflow Direction (G)MCH Heatsink Omi Directional Flow Processor Heatsink (Fan Not Shown) TOP VIEW Proc_HS_Orient_ATX Other methods exist for providing airflow to the (G)MCH heatsink, including the use of system fans and/or ducting, or the use of an attached fan (active he
