Manual de instrucciones de Philips TDA1020

Resumen del contenido incluido en la página 1

INTEGRATED CIRCUITS
DATA SHEET
TDA1020
12 W car radio power amplifier
November 1982
Product specification
File under Integrated Circuits, IC01

Resumen del contenido incluido en la página 2

Philips Semiconductors Product specification 12 W car radio power amplifier TDA1020 The TDA1020 is a monolithic integrated 12 W audio amplifier in a 9-lead single in-line (SIL) plastic package. The device is primarily developed as a car radio amplifier. At a supply voltage of V = 14,4 V, an output power of 7 W can be delivered P into a 4 Ω load and 12 W into 2 Ω. To avoid interferences and car ignition signals coming from the supply lines into the IC, frequency limiting is used beyond the audio sp

Resumen del contenido incluido en la página 3

Philips Semiconductors Product specification 12 W car radio power amplifier TDA1020 Fig.1 Internal block diagram; the heavy lines indicate the signal paths. PINNING 1. Negative supply (substrate) 2. Output power stage 3. Positive supply (V ) P 4. Bootstrap 5. Ripple rejection filter 6. Input power stage 7. Output preamplifier 8. Input preamplifier 9. Negative supply November 1982 3 Preliminary Specification

Resumen del contenido incluido en la página 4

Philips Semiconductors Product specification 12 W car radio power amplifier TDA1020 RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage; operating (pin 3) V max. 18 V P Supply voltage; non-operating V max. 28 V P Supply voltage; load dump V max. 45 V P Non-repetitive peak output current I max. 6 A OSM Total power dissipation see derating curves Fig.2 Storage temperature range T - 55 to + 150 °C stg Crystal temperature T max. 150 °C c Short-circuit durati

Resumen del contenido incluido en la página 5

Philips Semiconductors Product specification 12 W car radio power amplifier TDA1020 HEATSINK DESIGN EXAMPLE The derating of 8 K/W of the encapsulation requires the following external heatsink (for sine-wave drive): 10 W in 2 Ω at V = 14,4 V P maximum sine-wave dissipation: 5,2 W T = 60 °C maximum amb 150 – 60 R = R ++ R R== --------------------- - 17,3 K/W th j-a th j-tab th tab-h th h-a 52 , Since R + R = 8 K/W, R = 17,3 - 8 ≈ 9 K/W. th j-tab th tab-h th h-a D.C. CHARACTERISTICS Supply voltage ra

Resumen del contenido incluido en la página 6

Philips Semiconductors Product specification 12 W car radio power amplifier TDA1020 Input impedance typ. 40 kΩ preamplifier |Z | i 28 to 52 kΩ typ. 40 kΩ power amplifier |Z | i 28 to 52 kΩ Output impedance typ. 2,0 kΩ preamplifier |Z | o 1,4 to 2,6 kΩ power amplifier |Z | typ. 50 mΩ o Output voltage (r.m.s. value) at d = 1% tot >1V preamplifier (note 2) V o(rms) typ. 1,5 V Frequency response B 50 Hz to 25 kHz Noise output voltage (r.m.s. value; note 3) typ. 0,3 mV R = 0 Ω V S n(rms) < 0,5 mV typ.

Resumen del contenido incluido en la página 7

Philips Semiconductors Product specification 12 W car radio power amplifier TDA1020 (1) With R = 2 Ω, preferred value of C8 = 2200 μF. L Fig.3 Test circuit. November 1982 7 Preliminary Specification

Resumen del contenido incluido en la página 8

Philips Semiconductors Product specification 12 W car radio power amplifier TDA1020 PACKAGE OUTLINE SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1 D D 1 q P P A 2 1 A 3 q 2 q 1 A A 4 E pin 1 index c L 19 b Z e Q b w M 2 b 1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) (1) A 2 Z (1) (1) UNIT A Abc b b D D E eL P P Q q q q w A 3 4 1 2 1 1 1 2 max. max. 18.5 8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48 3.9 2.75 3.4 1.75 15.1 4.4 5.9 2.54 mm 3.7 0.25 1.0

Resumen del contenido incluido en la página 9

Philips Semiconductors Product specification 12 W car radio power amplifier TDA1020 SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief