Manual de instrucciones de Toshiba TLP848

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TLP848
TOSHIBA Photointerrupter Infrared LED + Phototransistor
TLP848


○ Camera Module for Mobile Phone
○ Digital Still Camera and Video Camera

○ Personal Equipment and Small-sized OA Equipment

The TLP848 is a surface-mount photointerrupter which is composed of a
GaAs infrared LED and a Si phototransistor.
It is an ultra compact package. Moreover it has a wider gap width than
1mm gap width of industry-standard and has a high resolution.

• Ultra compact package : 2.8×1.9×2.

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TLP848 Optical and Electrical Characteristics (Ta = 25°C) Characteristics Symbol Test conditions Min Typ. Max Unit Forward voltage V I = 10 mA 1.10 1.23 1.40 V F F Reverse current I V = 5 V ⎯ ⎯ 10 μA R R Peak emission wavelength λ I = 10 mA ⎯ 940 ⎯ nm P F Dark current I (I ) V = 12 V, I = 0 ⎯ ⎯ 0.05 μA D CEO CE F Peak sensitivity wavelength λ ⎯ ⎯ 820 ⎯ nm P V = 2 V TLP848 3 ⎯ 24 % CE Current transfer ratio I /I C F I = 5 mA TLP848 (R) 4 ⎯ 20 % F Collector-emitter saturation V I = 10

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TLP848 Package Dimensions: TOSHIBA 11-3B1 Unit: mm Tolerance : ±0.1mm unless otherwise specified ( ): Reference value Gate position Center of sensor Weight: 0.017 g (typ.) Pin Connection 1: Cathode 2 3 2: Anode 3: Collector 1 4 4: Emitter 3 2007-10-01

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TLP848 Handling and Mounting Precautions • Care must be taken in relation to the environment in which the device is to be installed. Oil or chemicals may cause the package to melt or crack. • The device should be mounted on an unwarped surface. • Do not apply stress to the resin at high temperature. • The resin part is easily scratched, so avoid friction with hard materials. • When installing the assembly board in equipment, ensure that this product does not come into contact with other

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TLP848 Mounting Methods 1. The example of temperature profile (reflow soldering) 10 s max (*) 250°C max (*) 230°C 4°C/s max (*) 180°C 160°C 30∼50 s 60∼120 s 4°C/s max (*) Time (s) → (*)The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the condition (i.e. the condition more than MAX values) as an evaluation. Please perform reflow soldering under the above conditions. • The first reflow proce

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TLP848 Packing Specification 1. Tape dimensions Unit: mm 4.0±0.1 +0.1 φ1.5 −0 2.0±0.05 0.3±0.05 B' B' A A' B 2.7±0.1 B φ1.1±0.1 4.0±0.1 2.1±0.1 max 5° max 5° A A' Device direction 6 2007-10-01 (2.75) 3.5±0.05 1.75±0.1 8.0±0.2 3.1±0.1 max 5° max 5°

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TLP848 2. Reel dimensions Unit: mm +0 φ180 −4 11.4 ± 1 9 ± 0.3 φ21 ± 0.8 φ13 ± 0.5 2 ± 0.5 3. Leader and trailer sections of tape 160 mm or more 100 mm or more (Note 2) (Note 1) Leading part: 400 mm or more Note1: Empty trailer section Note2: Empty leader section 7 2007-10-01 φ60

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TLP848 4. Packing format (1) Packing quantity Reel 1,500 pcs Carton 7,500 pcs (2) Packing form Each reel is sealed in an aluminum bag that contains a desiccant with a humidity indicator. 8 2007-10-01

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TLP848 P – Ta I – Ta C F 35 80 30 60 25 20 40 15 10 20 5 0 0 0 2040 6080 100 0 2040 6080 100 Ambient temperature Ta (°C) Ambient temperature Ta (°C) I – V (typ.) I / I – I F F C F F 100 100 Ta = 25°C V = 2V CE V = 0.4V CE Sample 2 10 10 Sample 1 Ta = 75°C 50 25 0 −25 1 1 0.9 1 1.1 1.2 1.3 1.4 1.5 1 10 100 Forward voltage V (V) Forward current I (mA) F F I – I C F I – V (typ.) C CE

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TLP848 I (I ) – Ta (typ.) Relative I – Ta (typ.) D CEO C 1.2 100 V = 12V CE 1 10 0.8 1 0.6 0.1 V = 2V CE I = 20mA F 0.4 I = 10mA F 0.01 I = 5mA F 0.2 -40 -20 0 20 40 60 80 100 0.001 Ambient temperature Ta (°C) 0.0001 0.00001 0 20 40 60 80 100 120 V – Ta (typ.) CE (sat) 0.20 Ambient temperature Ta (°C) I = 0.15mA C I = 10mA F 0.16 0.12 0.08 0.04 0.00 -40 -20 0 20 40 60 80 100 Ambient tempe

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TLP848 Detection position Detection position characteristics (2) (typ.) characteristics (1) (typ.) 1.2 1.2 I = 5mA I = 5mA F F V = 2V V = 2V CE CE 1 1 Ta = 25°C Ta = 25°C − + 0 0.8 0.8 Shutter d 0.6 0.6 d Shutter 0.4 0.4 Detection position Detection position +0.6 d = 0 ± 0.2mm d = 0.75 mm 0.2 0.2 -0.5 0 0 -2 -1 0 1 2 3 4 -1.2 -0.8 -0.4 0 0.4 0.8 1.2 Distance d (mm) Distance d (mm) Relative Positioning

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TLP848 RESTRICTIONS ON PRODUCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a