Bedienungsanleitung Renesas SH7050 Series

Bedienungsanleitung für das Gerät Renesas SH7050 Series

Gerät: Renesas SH7050 Series
Kategorie: Computerausrüstung
Produzent: Renesas
Größe: 0.37 MB
Datum des Hinzufügens: 7/24/2014
Seitenanzahl: 26
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Zusammenfassungen

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Inhaltszusammenfassungen
Inhaltszusammenfassung zur Seite Nr. 1

SH7058 Group BP-272
User System Interface Board
HS7058ECB61H User’s Manual
Renesas Microcomputer Development Environment System
TM
SuperH Family/SH7050 Series



Rev.3.00
2004.3.1

Inhaltszusammenfassung zur Seite Nr. 2

Cautions Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of

Inhaltszusammenfassung zur Seite Nr. 3

IMPORTANT INFORMATION READ FIRST • READ this user's manual before using this user system interface board. • KEEP the user's manual handy for future reference. Do not attempt to use the user system interface board until you fully understand its mechanism. User System Interface Board: Throughout this document, the term "user system interface board" shall be defined as the following product produced only by Renesas Technology Corp. excluding all subsidiary products. • User system inte

Inhaltszusammenfassung zur Seite Nr. 4

LIMITED WARRANTY Renesas warrants its user system interface boards to be manufactured in accordance with published specifications and free from defects in material and/or workmanship. Renesas will repair or replace any user system interface boards determined to be defective in material and/or workmanship. User system interface boards are wearing parts which Renesas will not repair or replace if damaged and/or worn through use. The foregoing shall constitute the sole re

Inhaltszusammenfassung zur Seite Nr. 5

State Law: Some states do not allow the exclusion or limitation of implied warranties or liability for incidental or consequential damages, so the above limitation or exclusion may not apply to you. This warranty gives you specific legal rights, and you may have other rights which may vary from state to state. The Warranty is Void in the Following Cases: Renesas shall have no liability or legal responsibility for any problems caused by misuse, abuse, misapplication, neglect,

Inhaltszusammenfassung zur Seite Nr. 6

SAFETY PAGE READ FIRST • READ this user's manual before using this user system interface board. • KEEP the user's manual handy for future reference. Do not attempt to use the user system interface board until you fully understand its mechanism. DEFINITION OF SIGNAL WORDS This is the safety alert symbol. It is used to alert you to potential personal injury hazards. Obey all safety messages that follow this symbol to avoid possible injury or death. DANGER DANGER indicates an immi

Inhaltszusammenfassung zur Seite Nr. 7

WARNING Observe the precautions listed below. Failure to do so will result in a FIRE HAZARD and will damage the user system and the emulator product or will result in PERSONAL INJURY. The USER PROGRAM will be LOST. 1. Do not repair or remodel the emulator product by yourself for electric shock prevention and quality assurance. 2. Always switch OFF the E6000H emulator and user system before connecting or disconnecting any CABLES or PARTS. 3. Always before

Inhaltszusammenfassung zur Seite Nr. 8

Preface The HS7058ECB61H is a user system interface board that connects a user system for the SH7058 BP-272 package to the SH7058 E6000H emulator (HS7058EPH60H). i

Inhaltszusammenfassung zur Seite Nr. 9

Contents Section 1 Configuration.....................................................................................1 Section 2 Connection Procedures ......................................................................3 2.1 Connecting User System Interface Board to User System ................................................3 2.1.1 Installing IC Socket..............................................................................................3 2.1.2 Fastening IC Socket Connector...

Inhaltszusammenfassung zur Seite Nr. 10

Section 1 Configuration Figure 1 and table 1 show the configuration and components of the user system interface board for the BP-272 package. Please make sure you have all of these components when unpacking. EV-chip board Spacer Screws (M2 x 8 mm) Board Pin 1 IC socket User system Figure 1 User System Interface Board for the SH7058 BP-272 Package 1

Inhaltszusammenfassung zur Seite Nr. 11

CAUTION Use a TQPACK256RD socket and CSPACK256Z202H01 (manufactured by Tokyo Eletech Corporation) for the BP-272 package IC socket and IC socket connector on the user system. Table 1 HS7058ECB61H Components No. Component Quantity Remarks 1 Board 1 2 IC socket 1 For the BP-272 package (installed on the user system): CSPACK256Z2021H01 3 Spacer 1 For installing a BP-272 packaged MCU 4 Cover 1 For installing a BP-272 packaged MCU 5 Screws (M2 x 8 mm) 4 For installing a BP-272 p

Inhaltszusammenfassung zur Seite Nr. 12

Section 2 Connection Procedures 2.1 Connecting User System Interface Board to User System WARNING Always switch OFF the user system and the emulator product before the USER SYSTEM INTERFACE CABLE is connected to or removed from any part. Before connecting, make sure that pin 1 on both sides are correctly aligned. Failure to do so will result in a FIRE HAZARD and will damage the user system and the emulator product or will result in PERSONAL INJURY. The USER PROGRAM w

Inhaltszusammenfassung zur Seite Nr. 13

(4) Notes on soldering the IC socket a) The IC socket is larger than the actual IC package; therefore, refer to figure 4 for the installation of other components. b) Do not install components that occupy large volume close to the IC socket. Such components will prevent the convective flow of heat during reflow. c) Since the IC socket has a greater volume than the IC package, it is recommended that the temperature profile under the conditions used in installation be measured by attaching a

Inhaltszusammenfassung zur Seite Nr. 14

CAUTION 1. Never dip the IC socket in flux or use wash to clean the IC socket. This is because flux may remain inside the IC socket due to the IC socket’s structure. When using the IC socket with other DIP products, never clean the other DIP products with flux because the flux may enter the connector through the guide pins of the IC socket. 2. When an IC socket with guide pins is soldered to the user system, about 1.3 mm of the guide pins will stick out (when the

Inhaltszusammenfassung zur Seite Nr. 15

2.1.2 Fastening IC Socket Connector CAUTION 1. Check the location of pin 1 before inserting. 2. Use a provided screwdriver. 3. Stop tightening when the force required to turn the screw becomes significantly greater than that needed when first tightening. If a screw is tightened too much, the screw head may break or an IC socket contact error may be caused by a crack in the IC socket solder. 4. If the emulator does not operate correctly, cracks might have occurred in

Inhaltszusammenfassung zur Seite Nr. 16

2.2 Exchanging the Spacer of the EV-Chip Board While the user system interface board is connected to the user system, force must not applied to the user system. Exchange the spacer (2.6MP x 10 mm) of the EV-chip board with another spacer (2.6MP x 25 mm) provided for the user system interface board. EV-chip board Spacer (2.6MP x 25 mm) Figure 3 Exchanging the Spacer 7

Inhaltszusammenfassung zur Seite Nr. 17

2.3 Connecting User System Interface Board to EV-Chip Board WARNING Observe the precautions listed below. Failure to do so will result in a FIRE HAZARD and will damage the user system and the emulator product or will result in PERSONAL INJURY. The USER PROGRAM will be LOST. 1. Always switch OFF the user system and the emulator product before the USER SYSTEM INTERFACE BOARD is connected to or removed from any part. Before connecting, make sure that pin 1 on bot

Inhaltszusammenfassung zur Seite Nr. 18

EV-chip board Connector No. EV-Chip Board Board Connector No. Connector No. UCN1 UCN1 UCN2 UCN2 Board Figure 4 Connecting User System Interface Board to EV-Chip Board 9

Inhaltszusammenfassung zur Seite Nr. 19

2.4 Recommended Dimensions for User System Mount Pad (Footprint) Figure 5 shows the recommended dimensions for the mount pad (footprint) for the user system with an IC socket for an BP-272 package (CSPACK256Z2021H01: manufactured by Tokyo Eletech Corporation). Note that the dimensions in figure 6 are somewhat different from those of the actual chip's mount pad. 23.0 ± 0.03 21.3 1.0 x 19 = 19.0 1.0 4-Ø1.3 Unit: mm Through hole Ø0.5 Figure 5 Recommended Dimensions for Mount Pad 10

Inhaltszusammenfassung zur Seite Nr. 20

2.5 Dimensions for EV-Chip Board and User System Interface Board The dimensions for the EV-chip board and the user system interface board are shown in figure 6. 120.0 8.0 5.0 Spacer EV-chip board 100.0 84.0 16.0 8.0 50.0 65.0 70.0 Top view Unit: mm Tolerance: ±0.5 mm Figure 6 Dimensions for EV-Chip Board and User System Interface Board 11 69.0 34.5 5.0 5.0 84.5 100.0


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