Inhaltszusammenfassung zur Seite Nr. 1
DSEB-D16
Series
DSEB-D16
DSEB-D16/SAS
Motherboard
Inhaltszusammenfassung zur Seite Nr. 2
E3521 First Edition V1 December 2007 Copyright © 2007 ASUSTeK COMPUTER INC. All Rights Reserved. No part of this manual, including the products and software described in it, may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any means, except documentation kept by the purchaser for backup purposes, without the express written permission of ASUSTeK COMPUTER INC. (“ASUS”). Product warranty or service will not be extended
Inhaltszusammenfassung zur Seite Nr. 3
Contents Notices ........................................................................................................ vii Safety information .................................................................................... viii About this guide ......................................................................................... ix Typography .................................................................................................. x DSEB-D16 Series specifications summary ....
Inhaltszusammenfassung zur Seite Nr. 4
Contents 2.5.4 PCI Express 2.0 x16 slots (x16 link) ............................. 2-29 2.5.5 PCI Express x8 slot (x8 link) ......................................... 2-29 2.5.6 PCI-X slot (for ZCR slot; DSEB-D16/SAS only) ............ 2-30 2.5.7 SODIMM socket ........................................................... 2-31 2.6 Jumpers ...................................................................................... 2-32 2.7 Connectors ........................................................
Inhaltszusammenfassung zur Seite Nr. 5
Contents 4.4 Advanced menu ......................................................................... 4-14 4.4.1 CPU Configuration ........................................................ 4-14 4.4.2 Chipset Configuration ................................................... 4-16 4.4.3 PCI/PnP Configuration .................................................. 4-20 4.4.4 USB Configuration ........................................................ 4-22 4.4.5 Peripheral Configuration ......................
Inhaltszusammenfassung zur Seite Nr. 6
Contents 5.3.4 Creating a RAID 5 set (Parity) ...................................... 5-35 5.3.5 Deleting a RAID set ...................................................... 5-36 5.3.6 Resetting disks to Non-RAID ........................................ 5-37 ® 5.3.7 Exiting the Intel Matrix Storage Manager .................... 5-37 5.4 Global Array Manager ................................................................ 5-38 5.5 LSI Logic MPT Setup Utility (DSEB-D16/SAS model only) ..... 5-39 5.5.1
Inhaltszusammenfassung zur Seite Nr. 7
Notices Federal Communications Commission Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: • This device may not cause harmful interference, and • This device must accept any interference received including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide r
Inhaltszusammenfassung zur Seite Nr. 8
Safety information Electrical safety • To prevent electrical shock hazard, disconnect the power cable from the electrical outlet before relocating the system. • When adding or removing devices to or from the system, ensure that the power cables for the devices are unplugged before the signal cables are connected. If possible, disconnect all power cables from the existing system before you add a device. • Before connecting or removing signal cables from the motherboard, ensure that all power
Inhaltszusammenfassung zur Seite Nr. 9
About this guide This user guide contains the information you need when installing and configuring the motherboard. How this guide is organized This user guide contains the following parts: • Chapter 1: Product introduction This chapter describes the features of the motherboard and the new technologies it supports. • Chapter 2: Hardware information This chapter lists the hardware setup procedures that you have to perform when installing system components. It includes description of the switch
Inhaltszusammenfassung zur Seite Nr. 10
Conventions used in this guide To make sure that you perform certain tasks properly, take note of the following symbols used throughout this manual. DANGER/WARNING: Information to prevent injury to yourself when trying to complete a task. CAUTION: Information to prevent damage to the components when trying to complete a task. IMPORTANT: Instructions that you MUST follow to complete a task. NOTE: Tips and additional information to help you complete a task. Typography Bold
Inhaltszusammenfassung zur Seite Nr. 11
DSEB-D16 Series specifications summary Model Name DSEB-D16/SAS DSEB-D16 Processor / System Bus 2 * Socket LGA771 ® ® Dual-Core Intel Xeon Processor 5000/5100/5200 ® ® Quad-Core Intel Xeon Processor 5300/5400 Sequence FSB 1066/1333/1600MHz EM64T 2x2M, 4M, 6M, 8M & 12M L2 cache ® Core Logic Intel 5400 Memory Controller Hub (MCH) ® Intel 6321ESB I/O Controller Hub (ICH) Form Factor SSI EEB 3.61, 12” x 13” Smart Fan II. MemCool Support ASUS Features Smart Fan Rack Ready (Rack and Pedestal dual
Inhaltszusammenfassung zur Seite Nr. 12
DSEB-D16 Series specifications summary Storage SAS Controller LSI 1068 PCI-X 8-port SAS controller: ® LSI Integrated RAID 0, 1, 1E support ® Optional LSI ZCR -- (Zero-Channel-RAID) PCI-X card: (For upgrade to support hardware RAID 0, 1, 10, 5, 50) ® ® Networking LAN Intel 6321+ Intel 82563EB Dual Port GbE ® Intel 82573 GbE * 2 Graphic VGA XGI Z9s PCI Display Controller 32MB Onboard I/O Floppy Connector 1 1 Connectors PSU Connector 24-pin ATX power connector + 8-pin ATX 12V power co
Inhaltszusammenfassung zur Seite Nr. 13
This chapter describes the motherboard features and the new technologies it supports. Product 1 introduction
Inhaltszusammenfassung zur Seite Nr. 14
Chapter summary 1 1.1 Welcome! ...................................................................................... 1-1 1.2 Package contents ......................................................................... 1-1 1.3 Serial number label ...................................................................... 1-2 1.4 Special features ............................................................................ 1-2 ASUS DSEB-D16 Series
Inhaltszusammenfassung zur Seite Nr. 15
1.1 Welcome! ® Thank you for buying an ASUS DSEB-D16 series motherboard! The motherboard delivers a host of new features and latest technologies, making it another standout in the long line of ASUS quality motherboards! Before you start installing the motherboard, and hardware devices on it, check the items in your package with the list below. 1.2 Package contents Check your motherboard package for the following items. Retail Pack Bulk Pack DSEB-D16/ DSEB-D16/ DSEB-D16 DSEB-D16 SAS SAS SATA si
Inhaltszusammenfassung zur Seite Nr. 16
1.3 Serial number label Before requesting support from the ASUS Technical Support team, you must take note of the motherboard's serial number containing 12 characters xxM0Axxxxxxx shown as the figure below. With the correct serial number of the product, ASUS Technical Support team members can then offer a quicker and satisfying solution to your problems. DSEB-D16 Made in China 合格 xxM0Axxxxxxx 1.4 Special features 1.4.1 Product highlights Latest processor technology The motherboard comes
Inhaltszusammenfassung zur Seite Nr. 17
FB-DIMM memory support This motherboard supports fully buffered DIMMs (FB-DIMMs), the latest memory solution that extends memory capacity and provide high-speed, high-density system memory peformance. FB-DIMMs use Advanced Memory Buffer (AMB) chips that transmit signals between the memory modules and controllers with improved signal integrity and reduced errors. PCIe 2.0 This motherboard supports the latest PCIe 2.0 device for twice the current speed and bandwidth. This enhances system pe
Inhaltszusammenfassung zur Seite Nr. 18
USB 2.0 technology The motherboard implements the Universal Serial Bus (USB) 2.0 specification, dramatically increasing the connection speed from the 12 Mbps bandwidth on USB 1.1 to a fast 480 Mbps on USB 2.0. USB 2.0 is backward compatible with USB 1.1. Temperature, fan, and voltage monitoring The CPU temperature is monitored by the W83793G chip to prevent overheating and damage. The system fan rotations per minute (RPM) is monitored for timely failure detection. The chip monitors the vol
Inhaltszusammenfassung zur Seite Nr. 19
This chapter lists the hardware setup procedures that you have to perform when installing system components. It includes description of the jumpers and connectors on the motherboard. Hardware 2 information
Inhaltszusammenfassung zur Seite Nr. 20
Chapter summary 2 2.1 Before you proceed ..................................................................... 2-1 2.2 Motherboard overview ................................................................. 2-3 2.3 Central Processing Unit (CPU) ................................................. 2-11 2.4 System memory ......................................................................... 2-16 2.5 Expansion slots .......................................................................... 2-28 2.6
