Bedienungsanleitung Asus P8H61-M LX3

Bedienungsanleitung für das Gerät Asus P8H61-M LX3

Gerät: Asus P8H61-M LX3
Kategorie: Computerausrüstung
Produzent: Asus
Größe: 1.94 MB
Datum des Hinzufügens: 6/27/2014
Seitenanzahl: 58
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Zusammenfassungen

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Inhaltszusammenfassungen
Inhaltszusammenfassung zur Seite Nr. 1

P8H61-M LX3
Motherboard

Inhaltszusammenfassung zur Seite Nr. 2

E7154 Second Edition (V2) January 2012 Copyright © 2012 ASUSTeK Computer Inc. All Rights Reserved. No part of this manual, including the products and software described in it, may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any means, except documentation kept by the purchaser for backup purposes, without the express written permission of ASUSTeK Computer Inc. (“ASUS”). Product warranty or service will not be extend

Inhaltszusammenfassung zur Seite Nr. 3

Contents Notices ......................................................................................................... vi Safety information ..................................................................................... vii About this guide ....................................................................................... viii P8H61-M LX3 specifications summary ..................................................... ix Chapter 1 Product introduction 1.1 Before you proceed ........

Inhaltszusammenfassung zur Seite Nr. 4

Contents Chapter 2 BIOS information 2.1 Managing and updating your BIOS ............................................ 2-1 2.1.1 ASUS Update utility ........................................................ 2-1 2.1.2 ASUS EZ Flash 2 ............................................................ 2-2 2.1.3 ASUS BIOS Updater ....................................................... 2-3 2.2 BIOS setup program .................................................................... 2-6 2.3 Main menu ...........

Inhaltszusammenfassung zur Seite Nr. 5

Contents 2.7.4 Option ROM Messages [Force BIOS] ........................... 2-23 2.7.5 Setup Mode [EZ Mode] ................................................. 2-23 2.7.6 Boot Option Priorities .................................................... 2-23 2.7.7 Boot Override ................................................................ 2-23 2.8 Tools menu ................................................................................. 2-24 2.8.1 ASUS EZ Flash Utility ..............................

Inhaltszusammenfassung zur Seite Nr. 6

Notices Federal Communications Commission Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: • This device may not cause harmful interference, and • This device must accept any interference received including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide r

Inhaltszusammenfassung zur Seite Nr. 7

REACH Complying with the REACH (Registration, Evaluation, Authorisation, and Restriction of Chemicals) regulatory framework, we published the chemical substances in our products at ASUS REACH website at http://csr.asus.com/english/REACH.htm. DO NOT throw the motherboard in municipal waste. This product has been designed to enable proper reuse of parts and recycling. This symbol of the crossed out wheeled bin indicates that the product (electrical and electronic equipment) should not be place

Inhaltszusammenfassung zur Seite Nr. 8

About this guide This user guide contains the information you need when installing and configuring the motherboard. How this guide is organized This guide contains the following parts: • Chapter 1: Product introduction This chapter describes the features of the motherboard and the new technology it supports. • Chapter 2: BIOS information This chapter tells how to change system settings through the BIOS Setup menus. Detailed descriptions of the BIOS parameters are also provided. Conventions

Inhaltszusammenfassung zur Seite Nr. 9

P8H61-M LX3 specifications summary ® CPU LGA1155 socket for Intel Second Generation processors Supports Intel 32nm Multi-Core CPU ® Supports Enhanced Intel SpeedStep Technology (EIST) ® * Refer to www.asus.com for Intel CPU support list. ® Chipset Intel H61 Express Chipset Memory 2 x DIMM, max. 16GB, DDR3 1333 / 1066 MHz, non-ECC, un-buffered memory Dual-channel memory architecture * The maximum 16GB memory capacity can be supported with 8GB or above DIMMs. ASUS will update the memory Q

Inhaltszusammenfassung zur Seite Nr. 10

P8H61-M LX3 specifications summary Internal connectors/ 3 x USB 2.0 connectors support additional 6 USB 2.0 ports switches/ buttons 4 x SATA 3.0 Gb/s connectors 1 x CPU fan connector 1 x 4-pin chassis fan connector 1 x Front panel audio connector 1 x System panel connector 1 x Speaker connector 1 x 24-pin ATX power connector 1 x 4-pin ATX 12V power connector BIOS features 32 Mb Flash ROM, UEFI BIOS, PnP, DMI v2.0, WfM 2.0, ACPI v2.0a, SM BIOS v2.6, Multi-language BIOS Manageability WO

Inhaltszusammenfassung zur Seite Nr. 11

Chapter 1 Product introduction ® Thank you for buying an ASUS P8H61-M LX3 motherboard! Before you start installing the motherboard, and hardware devices on it, check the items in your motherboard package. Refer to page x for the list of accessories. If any of the items is damaged or missing, contact your retailer. 1.1 Before you proceed Take note of the following precautions before you install motherboard components or change any motherboard settings. • Unplug the power cord from the wall so

Inhaltszusammenfassung zur Seite Nr. 12

1.2 Motherboard overview Before you install the motherboard, study the configuration of your chassis to ensure that the motherboard fits into it. Ensure that you unplug the power cord before installing or removing the motherboard. Failure to do so can cause you physical injury and damage motherboard components. 1.2.1 Placement direction When installing the motherboard, ensure that you place it into the chassis in the correct orientation. The edge with external ports goes to the rear part of

Inhaltszusammenfassung zur Seite Nr. 13

LGA1155 CLRTC 1.2.3 Motherboard layout 1 2 3 1 4 17.3cm(6.8in) CPU_FAN KBMS ATX12V USB34 LAN_USB12 2 Lithium Cell CHA_FAN CMOS Power AUDIO PCIEX16 RTL P8H61-M LX3 8111E SATA3G_1 SATA3G_2 SATA3G_3 SATA3G_4 5 Super ® Intel I/O 6 H61 5 VIA PCIEX1_1 VT1708S 32Mb BIOS F_PANEL USB56 USB78 USB910 AAFP SPEAKER 10 9 8 7 6 1.2.4 Layout contents Connectors/Jumpers/Slots/LED Page Connectors/Jumpers/Slots/LED Page 1. CPU and chassis fan connectors 1-18 6. System panel connector (10-1 pin PANEL) 1-19 (4-pin

Inhaltszusammenfassung zur Seite Nr. 14

1.3 Central Processing Unit (CPU) ® The motherboard comes with a surface mount LGA1155 socket designed for the Intel Second Generation processors. Unplug all power cables before installing the CPU. • Upon purchase of the motherboard, ensure that the PnP cap is on the socket and the socket contacts are not bent. Contact your retailer immediately if the PnP cap is missing, or if you see any damage to the PnP cap/socket contacts/motherboard components. ASUS will shoulder the cost of repair only

Inhaltszusammenfassung zur Seite Nr. 15

3. Lift the load lever in the direction of the arrow until the load plate is completely lifted. Load plate 4. Remove the PnP cap from the CPU socket by lifting the tab only. PnP cap 5. Position the CPU over the socket, ensuring that the gold triangle is on the bottom-left corner of the socket, and CPU notches then fit the socket alignment keys into the CPU notches. The CPU fits in only one correct orientation. DO NOT force the CPU into the socket to prevent bending Gold the connector

Inhaltszusammenfassung zur Seite Nr. 16

6. Apply some Thermal Interface Material to the exposed area of the CPU that the heatsink will be in contact with, ensuring that it is spread in an even thin layer. Some heatsinks come with pre- applied thermal paste. If so, skip this step. The Thermal Interface Material is toxic and inedible. DO NOT eat it. If it gets into your eyes or touches your skin, wash it off immediately, and seek professional medical help. 7. Close the load plate (A), and then push B down the load lever (B), en

Inhaltszusammenfassung zur Seite Nr. 17

1.3.2 Installing the CPU heatsink and fan ® The Intel LGA1155 processor requires a specially designed heatsink and fan assembly to ensure optimum thermal condition and performance. ® • When you buy a boxed Intel processor, the package includes the CPU fan and ® heatsink assembly. If you buy a CPU separately, ensure that you use only Intel -certified multi-directional heatsink and fan. ® • Your Intel LGA1155 heatsink and fan assembly comes in a push-pin design and requires no tool to install.

Inhaltszusammenfassung zur Seite Nr. 18

3. Connect the CPU fan cable to the connector on the motherboard labeled CPU_FAN. CPU_FAN P8H61-M LX3 P8H61-M LX3 CPU fan connector Do not forget to connect the CPU fan connector! Hardware monitoring errors can occur if you fail to plug this connector. 1.3.3 Uninstalling the CPU heatsink and fan To uninstall the CPU heatsink and fan: 1. Disconnect the CPU fan cable from the connector on the motherboard. 2. Rotate each fastener counterclockwise. 3. Pull up two fasteners at a time in a diagonal

Inhaltszusammenfassung zur Seite Nr. 19

4. Carefully remove the heatsink and fan assembly from the motherboard. 5. Rotate each fastener clockwise to ensure correct orientation when reinstalling. 1.4 System memory 1.4.1 Overview The motherboard comes with two Double Data Rate 3 (DDR3) Dual Inline Memory Modules (DIMM) sockets. A DDR3 module has the same physical dimensions as a DDR2 DIMM but is notched differently to prevent installation on a DDR2 DIMM socket. DDR3 modules are developed for better performance with less power cons

Inhaltszusammenfassung zur Seite Nr. 20

1.4.2 Memory configurations You may install 1GB, 2GB, 4GB and 8GB unbuffered non-ECC DDR3 DIMMs into the DIMM sockets. • You may install varying memory sizes in Channel A and Channel B. The system maps the total size of the lower-sized channel for the dual-channel configuration. Any excess memory from the higher-sized channel is then mapped for single-channel operation. • Always install DIMMs with the same CAS latency. For optimum compatibility, we recommend that you obtain memory modules fr


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