Inhaltszusammenfassung zur Seite Nr. 1
Inhaltszusammenfassung zur Seite Nr. 2
For other language versions please visit our website.
Inhaltszusammenfassung zur Seite Nr. 3
English Edition Please read before installation. Visit our website and watch the TNN500AF installation video first to make your installation easier. www.zalman.co.kr www.zalmanusa.com
Inhaltszusammenfassung zur Seite Nr. 4
Welcome Congratulations on your purchase of ZALMAN Tech’s TNN 500AF. With TNN500AF, you are now in the world of silent computing. TNN 500AF is the ultimate answer to every computer user’s dream of creating a silent computing environment with total system stability. Contents 1. Safety Notices 3 2. Features 4 3. Patents 11 4. Components 12 5. Optional Components 15 6. Specifications 15 7. Operational Notes 19 8. Installation Guide 20 9. Trademarks and Copyright Notice 47 TNN 500AF
Inhaltszusammenfassung zur Seite Nr. 5
1) Keep this unit away from heat sources and direct sunlight. 2) This unit should be placed on a flat, level, and solid surface. 3) Always shut down the operating system and switch the AC OFF before disassembling. 4) Keep this unit in an upright position when the AC power is ON. 5) Do not place or spill liquids on this unit. 6) Avoid inserting any objects into the system while it is ON. 7) Lower the caster stops to immobilize the unit before using the system. 8) If this unit is to be trans
Inhaltszusammenfassung zur Seite Nr. 6
TNN 500AF is the world s first truly noiseless high-end computer case, developed with heatpipe technology, HSC(Heat Source Contact) power technology, High Capacity Extrusion technique, and FMS (Flexible Mounting Structure) design technology by ZALMAN Tech Co., Ltd. The TNN 500AF package contains a high performance aluminum computer case with an absolutely noiseless cooling solution for the CPU, VGA Card, Power Supply, and Northbridge free of fans, making it ideal for storage servers, wor
Inhaltszusammenfassung zur Seite Nr. 7
Heat Transfer via Heatpipes Virtually ever-lasting heatpipes transfer heat away from the CPU, VGA chipset, and Northbridge chipset preventing system crashes due to over heating. - CPU Heatpipes Heat from the CPU is transferred to the heatsink plate through 6 heatpipes each 6 millimeters in diameter. The six heatpipes can transfer up to 150W of heat from the CPU - sufficient for the hottest CPUs on the market. The CPU Block Base is made of pure copper to ensure the highest cooling performance.
Inhaltszusammenfassung zur Seite Nr. 8
High-Efficiency, Fanless Power Supply The power supply uses high-efficiency FET components and Heat Source Contact (HSC) technology, eliminating the need for a fan, and has a 10% higher power conversion efficiency (80%) rating than conventional power supplies. Heat from the power supply is transferred directly to the high-capacity heatsink plates, where it is dissipated by natural convection, making the power supply free of noise and vibration. - High-capacity active PFC inductors, separate sw
Inhaltszusammenfassung zur Seite Nr. 9
4) Ease of Use A latch is installed to prevent component theft. The Remote Control enables the user to conveniently experience multimedia content and control the PC. Various I/O ports are provided (Audio, USB, IEEE-1394, 1394B) Heatpipe HDD Cooler dissipates heat from the hard disk and reduces vibration transferred to the case. Four casters (wheels) withstand up to four metric tons of weight in total, and have skid prevention / height adjustment features built in. The case is structure
Inhaltszusammenfassung zur Seite Nr. 10
Test Results AMD AMD64 Athlon64 System Thermal Test (Room Temperature : 25 Fan rpm at Full Load Power Consumption Test TNN 500AF
Inhaltszusammenfassung zur Seite Nr. 11
Configuration of Systems for Testing Testing Equipment and Programs CPU Loading Program CPU Burm (47, High) Measurement Instrument Personal Daq/56 (Iotech, Inc.) KIKUSUI PCR 1000L Temperature Measurement Program DaqView (Iotech, Inc.) TNN 500AF
Inhaltszusammenfassung zur Seite Nr. 12
Intel P4 Prescott System Thermal Test (Room Temperature : 25 Power Consumption Test TNN 500AF
Inhaltszusammenfassung zur Seite Nr. 13
Configuration of Systems for Testing Testing Equipment and Programs CPU Loading Program Maximum Power Program for the Prescott Processor Rev. 1.2 Measurement Instrument Personal Daq/56 (Iotech, Inc.) KIKUSUI PCR 1000L Temperature Measurement Program DaqView (Iotech, Inc.) Caution 1) If the CPU has a higher Thermal Design Power (TDP) rating than an Intel Prescott or an AMD Athlon64 3500+, the Heatpipe Northbridge Cooler and a Rear-mount Thermal Blocks (ZM-RTB1) MUST be installed to cool
Inhaltszusammenfassung zur Seite Nr. 14
TNN 500AF
Inhaltszusammenfassung zur Seite Nr. 15
1) Heatpipe CPU Cooler Parts [One(1) Bag] 1) Components for Intel Pentium 4 (Socket 478) One (1) Socket 478 CPU Clip Two (2) Socket 478 Finger Bolts (M3X52) Four(4) PH M4X22 bolts Two (2) Socket 478 Clip Supports 2) Components for Intel Pentium 4 (Socket 775) One(1) Socket 775 Clip Support Two (2) Socket 775 Finger Bolts (M3X49) One(1) Socket 754 Back Plate Four (4) PH M3X22 Bolts 3) Components for AMD Amd64 (Socket 478) Two Socket 754 Finger Bolts (#6-32X40) Two (2) Socket 754 AMD Nipple
Inhaltszusammenfassung zur Seite Nr. 16
7) ODD/FDD Bolts 8) Motherboard Bolts [One(1) Bag] [One(1) Bag] Twelve (12) PH M3X10 Bolts Ten (10) PWH M3X5 Bolts 9) Thermal Grease 10) ATA 133 Cable [One(1) Bag] 2.5 ml One (1) ATA 133 Cable 11) Power Cord [One(1) Bag] 12) Latch Key [One(1) Bag] One (1) Power Cord Two (2) Latch Keys 13) Remote Control Set One(1) Remote Control One(1) One(1) iMON & Multi-Median Two(2) AAA Batteries Installation CD User’s Guide 14) Motherboard Power Cable [One(1) Bag] One(1) Motherboard Powe
Inhaltszusammenfassung zur Seite Nr. 17
Heatpipe HDD Cooler (ZM-2HC2) 1) Model : TNN 500AF 2) Dimensions : 400(L) x 286(W) x 597(H) mm 3) Weight : 26Kg 4) Compatible CPUs : All Intel Pentium 4 CPUs and AMD AMD64 CPUs Supported NOTE : When the Thermal Design Power rating of the CPU is 100W or higher, a quiet 120mm case fan MUST be installed and operated at 1000~1200rpm, and Rear-mount Thermal Blocks (ZM-RTB1) must be installed on the backside of the motherboard. Refer to page 22. 1) CPUs that require a quiet case fan and Rea
Inhaltszusammenfassung zur Seite Nr. 18
2) CPUs with Thermal Design Power ratings under 100W. (As of Oct. 30, 2004) (All CPUs that are slower than those mentioned above have Thermal Design Power ratings under 100W. ) 3. Refer to the following website for more information regarding CPU compatibility. (www.zalman.co.kr/product/TNN500AF.html) 5) Compatible VGA Cards All AGP / PCI Express VGA cards that have heatsink mounting holes (As of Oct. 30, 2004) Notes 1. NVIDIA PCX Series VGA Cards are
Inhaltszusammenfassung zur Seite Nr. 19
6) Thermal Transfer Capacity CPU Heatpipe (ZMC-6HB) : 150W VGA Card Heatpipe (ZMV-3HA) : 75W Northbridge Heatpipe (ZMN-1HB) : 20W 7) Power Supply Output Capacity : 400W 8) Power Supply Electrical Specifications (Model : TNN400APF - V2) List of compatible motherboards, HDDs, and ODDs for building a TNN 500AF system is available at the following website (www.zalman.co.kr/product/TNN500AF.html). TNN 500AF
Inhaltszusammenfassung zur Seite Nr. 20
9) Output Power Cable TNN 500AF
