Inhaltszusammenfassung zur Seite Nr. 1
GSM T ELEPHONE
SGH-i750
CONTENTS
GSM TELEPH ON E
1. Sp ecifica t ion
2. Circ uit Desc r iption
3. Expl oded Views a n d Parts L ist
4. Electri cal Parts List
5. Block D iagrams
6. PCB D ia gra m s
7. Flow Ch art o f T rou b leshootin g
8. Disassembly and
Assembly in struction s
Inhaltszusammenfassung zur Seite Nr. 2
1. Specification 1-1. GSM General Specification GSM900 EGSM 900 DCS1800 PCS1900 Phase 1 Phase 2 Phase 1 Freq. Band[MHz] 890~915 880~915 1710~1785 1850~1910 Uplink/Downlink 935~960 925~960 1805~1880 1930~1990 0~124 & ARFCN range 1~124 512~885 512~810 975~1023 Tx/Rx spacing 45MHz 45MHz 95MHz 80MHz Mod. Bit rate 270.833kbps 270.833kbps 270.833kbps 270.833kbps /Bit Period 3.692us 3.692us 3.692us 3.692us Time Slot Period 576.9us 576.9us 576.9us 576.9us / Frame Period 4.615ms 4.615ms 4.615ms 4.615ms M
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S p ec if ic at i o n 1-2. GSM TX power class TX Power TX Power TX Power GSM900 DCS1800 PCS1900 control level control level control level 5 33±3 dBm 0 30±3 dBm 0 30±3 dBm 6 31±3 dBm 1 28±3 dBm 1 28±3 dBm 7 29±3 dBm 2 26±3 dBm 2 26±3 dBm 8 27±3 dBm 3 24±3 dBm 3 24±3 dBm 9 25±3 dBm 4 22±3 dBm 4 22±3 dBm 10 23±3 dBm 5 20±3 dBm 5 20±3 dBm 6 18±3 dBm 11 21±3 dBm 6 18±3 dBm 12 19±3 dBm 7 16±3 dBm 7 16±3 dBm 13 17±3 dBm 8 14±3 dBm 8 14±3 dBm 14 15±3 dBm 9 12±4 dBm 9 12±4 dBm 15 13±3 dBm 10 10±4 dBm 10
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2. Cir cuit D escription 2-1. SGH-i750 RF Circuit Description 2-1-1. ANTENNA SWITCH (U101:LMG003S-5091A) → Switching Tx, Rx path for EGSM900, DCS1800 and PCS1900 by logic controlling. VC1 VC2 VC3 Tx Mode (GSM900) L H L Tx Mode (DCS1800/1900) L L H Rx Mode (GSM900) L L L Rx Mode (DCS1800) L L L Rx Mode (PCS1900) H L L 2-1-2. FILTER To convert Electromagnetic Field Wave to Acoustic Wave and then pass the specific frequency band. → - GSM FILTER (F101) For filtering the frequency band b
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Circuit D escription 2-1-4. Power Amplifier Module (PAM101:BGY290E) This chip is a GSM/EDGE compliant quad band Power amplifier module (PAM) with integrated power control loop (PCL). The GSM (GMSK) line up is similar to the EDGE line-up, in the EDGE mode the power control loop is disabled and the EDGE biasing (fine-tuning) control is enabled. In the EDGE mode the device can be considered as a linear constant gain amplifier, the output power adjustment and ramping profiles have to be provided by
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C i rcuit Description A 32.768 kHz crystal oscillator which provides an accurate low clock frequency for the PCF50603 and external circuitry. For the POWER ON, the PHONE_ON pulse signal(logical low) for 200ms from PDA turns on U204(PCF50603). For the POWER OFF, by pressing POWER KEY of the phone application, the PHONE_ON pulse signal(logical low) for 1s from PDA turns off U204(PCF50603) and all phone device. The regulated voltage(U204,+VDD_GSM_CORE) is used in Core block of PCF5213. The regulate
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Circuit D escription In the Wrting process, WEn is fallen to low and it enables writing process to operate. During reading process, OEn is fallen to low and it enables reading process to operate. Each chip select signals in the PCF5213 choose different memories. DPRAM Memory(UME401:70P248L55BYI) - 4Kx16 dual port RAM It is accessed by Phone and PDA, but not accessed simultaneously. Generally, Instructions and data used by Phone and PDA are stored. Clock(TCX101:TCO-5871U 26MHz) This system uses t
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C i rcuit Description VBAT33 via U618(XC6401EE27DR) which is a backup battery charging voltage, VMICBAIS via UCD501(WM9712LEFL) which is a MIC vias voltage, VCAM15,VCAM-8,VCAM30,VCAM18 via U703(BD6020GU) which is a Camera voltage, VCAM31 via U701(BH31FB1WHFV) which is a Camera voltage. Backup Battery(ML1220-TT2) The SGH-i750 has a back-up battery(ML1220-TT2) that stores data of SDRAM when the battery removed or becomes low battery state that is below 2.8V. The low battery state is checked by vol
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Circuit D escription DPRAM Memory(UME401:70P248L55) 4Kx16bit dual port RAM ● It is accessed by Phone and PDA, but not accessed simultaneously. ● Generally, Instructions and data used by Phone and PDA are stored. ⑶ LCD part PXA270 has a LCD controller. LCD module ● A transmissive type color active matrix TFT ● It is composed of a TFT LCD module(TFT LCD panel, driver ICs), a Backlight unit and a touch screen panel. ● The resolution of 2.4inch contains 240x320 pixels and can display 65K colors. ⑷ A
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C i rcuit Description Module(MOD800:LBWA1UDBD7-093) The Wi-Fi Module which uses Philips Chip is manufactured by MuRata. It only supports 802.11b Specification and communicates with CPU through SPI Interface. The data throughput is up to 11 Mbps in the abstractly but typically supports 4Mbps in the real field. Modulation method is DSSS(Direct Sequence Spread Spectum). Its channel spacing is 5MHz and bandwidth is 22 MHz. ⑹ Bluetooth Part Antenna(C1103LJ) Antenna receives signal from AP(Access Poin
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Circuit D escription IrDA(HSDL-3002) IrDA Data Compliant 115.2kbit/s with Remote Control Transmission Infrared Transceiver. A small form factor single enhanced infrared transceiver module that provides the combination of Interface between logic and IR signals for through-air, serial, half-duplex IR data link, and IR remote control transmission operating at 940nm for universal remote control applications. USB There is a USB Client in the Phone part and PDA part each. The USB signals are switched
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3. Exploded View and P ar ts L i st 3-1. Exploded View QRF03 QVO03 QCK01 QFR01 QFU01 QCR49 QVO01 QKP02 QKP01 QME03 QME01 QAR01 QCR12 QLC01 QSH01 QPC01 QMO01 QCR12 QSP02 QMP01 QMI03 QSP01 QAN03 QMI01 QAN06 QSR01 QAN04 QCR12 QFL01 QCR05 QAN02 QCA01 QCH01 QST01 QCR26 QRE01 QIF01 QCR21 QSC01 QRF01 QBA01 3-1 SAMSUNG Proprietary-Contents may change without notice This Docu ment can not be used with ou t S am su n g 's authorizatio n
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E xploded vi ew and Part L is t 3-2. Parts List Location No Description SEC CODE QAN02 INTENNA-SGHI750 GH42-00619A QAN03 INTENNA-CHIP INTENNA GH42-00621A QAN04 INTENNA-CHIP INTENNA GH42-00622A QAN06 MEC-RUBBER INT CON GH75-09093A QAR01 AUDIO-RECEIVER 3009-001158 QBA01 BATTERY-1100MAH,BLK,ENG,M GH43-02057A QCA01 UNIT-CAMERA GH59-02704A QCH01 MEC-BRACKET CAMERA GH75-07501A QCR05 SCREW-MACHINE 6001-001478 QCR12 SCREW-MACHINE 6001-001530 QCR21 SCREW-MACHINE 6001-001507 QCR26
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Expl ode d v i ew an d P ar t L is t Description SEC CODE BAG PE 6902-000634 CBF INTERFACE-AV CABLE GH39-00410A CBF INTERFACE-PC DATA LINK CAB GH39-00567A CHARGER-BLK DTC GH44-01153A CHARGER-SGHI750 TC GH44-01193A S/W CD-USER GUIDE CD GH46-00195A S/W CD-COMPANION CD(ENG) GH46-00207A EARPHONE-STEREO EAR PHONE GH59-02236A LABEL(P)-IMEI GH68-01335D LABEL(P)-WATER SOAK GH68-02026A MANUAL USERS-QRG GH68-08984A LABEL(R)-MAIN (EU) GH68-09316A MANUAL USERS-BIZCARD LEAFLET GH68-09551A CUSHION-CASE MAIN(N
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E xploded vi ew and Part L is t 3-3-1. USB JIG Cable 3-3. Test Jig (GH80-03308A) 3-3-2. RF Test Cable 3-3-3. Test Cable 3-3-4. Serial Cable (GH39-00261A) (GH39-00477A) (CSA LL64151-A) 3-3-5. Power Supply Cable 3-3-6. DATA CABLE 3-3-7. TC (GH39-00350A] (GH44-01193A) 3-4 SAMSUNG Proprietary-Contents may change without notice This Docu ment can not be used with ou t S am su n g 's authorizatio n
Inhaltszusammenfassung zur Seite Nr. 16
4. Electrical Parts L ist Ddsign LOC Discription SEC Code STATUS BTC601 HEADER-BATTERY 3711-005897 SA C100 C-CER,CHIP 2203-000233 SA C104 C-CER,CHIP 2203-000233 SA C107 C-CER,CHIP 2203-000425 SA C111 C-CER,CHIP 2203-000233 SA C114 C-CER,CHIP 2203-000278 SA C115 C-CER,CHIP 2203-000233 SA C116 C-CER,CHIP 2203-000233 SA C117 C-CER,CHIP 2203-000696 SA C119 C-CER,CHIP 2203-000425 SA C121 C-CER,CHIP 2203-000386 SA C123 C-CER,CHIP 2203-006260 SA C124 C-CER,CHIP 2203-000254 SA C125 C-CER,CHIP 2203-00081
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El ec tr ic al Par ts L ist Ddsign LOC Discription SEC Code STATUS C220 C-CER,CHIP 2203-006048 SA C221 C-CER,CHIP 2203-006626 SA C222 C-CER,CHIP 2203-006048 SA C223 C-CER,CHIP 2203-000278 SA C224 C-CER,CHIP 2203-006257 SA C225 C-CER,CHIP 2203-000278 SA C226 C-CER,CHIP 2203-006048 SA C227 C-CER,CHIP 2203-006048 SA C228 C-CER,CHIP 2203-006646 SA C229 C-CER,CHIP 2203-006646 SA C230 C-CER,CHIP 2203-000812 SA C232 C-CER,CHIP 2203-006562 SA C234 C-CER,CHIP 2203-000812 SA C235 C-CER,CHIP 2203-006824 SA
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E l ec tr ic al Par ts L ist Ddsign LOC Discription SEC Code STATUS C326 C-CER,CHIP 2203-006423 SA C327 C-CER,CHIP 2203-006423 SA C328 C-CER,CHIP 2203-006423 SA C329 C-CER,CHIP 2203-006423 SA C330 C-CER,CHIP 2203-006423 SA C331 C-CER,CHIP 2203-006423 SA C332 C-CER,CHIP 2203-002709 SNA C333 C-CER,CHIP 2203-002709 SNA C334 C-CER,CHIP 2203-002709 SNA C335 C-CER,CHIP 2203-006423 SA C336 C-CER,CHIP 2203-006423 SA C339 C-CER,CHIP 2203-006562 SA C340 C-CER,CHIP 2203-002709 SNA C341 C-CER,CHIP 2203-0064
Inhaltszusammenfassung zur Seite Nr. 19
El ec tr ic al Par ts L ist Ddsign LOC Discription SEC Code STATUS C537 C-CER,CHIP 2203-000812 SA C538 C-CER,CHIP 2203-000812 SA C539 C-CER,CHIP 2203-000585 SA C543 C-CER,CHIP 2203-002709 SNA C549 C-CER,CHIP 2203-006562 SA C550 C-CER,CHIP 2203-006562 SA C551 C-CER,CHIP 2203-006048 SA C552 C-CER,CHIP 2203-001201 SA C553 C-CER,CHIP 2203-000679 SA C554 C-CER,CHIP 2203-006048 SA C555 C-CER,CHIP 2203-006626 SA C562 C-CER,CHIP 2203-000278 SA C563 C-CER,CHIP 2203-000278 SA C571 C-CER,CHIP 2203-002709 S
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E l ec tr ic al Par ts L ist Ddsign LOC Discription SEC Code STATUS C620 C-CER,CHIP 2203-000138 SA C621 C-CER,CHIP 2203-006048 SA C622 C-CER,CHIP 2203-000254 SA C625 C-CER,CHIP 2203-006562 SA C627 C-CER,CHIP 2203-006562 SA C629 C-CER,CHIP 2203-006824 SA C630 C-CER,CHIP 2203-006048 SA C632 C-CER,CHIP 2203-006562 SA C633 C-CER,CHIP 2203-006646 SA C634 C-CER,CHIP 2203-006474 SA C635 C-CER,CHIP 2203-006562 SA C636 C-CER,CHIP 2203-006562 SA C639 C-CER,CHIP 2203-006646 SA C642 C-CER,CHIP 2203-006824 S
