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OCPRF100 MP
Server System
®
Supporting Up To Eight Intel
® ™
Pentium III Xeon Processors
Technical Product Specification
Intel Order #753674-001
Revision 1.0
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OPRF100 MP Board Set Technical Product Specification Revision 1.0 Revision History Date Rev. Modifications September, 1999 1.0 Initial release. Disclaimers Except as provided in Intel’s Terms and Conditions of Sale for such products, INTEL DISCLAIMS ALL LIABILITIES AND WARRANTIES (EXPRESS, IMPLIED OR OTHERWISE) ASSOCIATED WITH THE INFORMATION CONTAINED WITHIN THIS DOCUMENT, OR FOR ANY PROD- UCTS OR DEVICES REFERRED TO HEREIN, INCLUDING, WITHOUT LIMITATION, LIABILITY FOR INFRINGEMENT OF ANY PR
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OPRF100 MP Board Set Technical Product Specification Revision 1.0 Only approved software drivers and accessories that are recommended for the revision number of the boards and system being operated should be used with Intel products. Please note that, as a result of warranty repairs or replacements, alternate software and firmware versions may be required for proper operation of the equipment. The hardware vendor remains solely responsible for the design, sale and functionality of its prod- u
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OCPRF100 MP Server System Technical Product Specification Revision 1.0 Table of Contents Introduction ........................................................................................................................... 1 Server System Chassis and Assemblies............................................................................ 3 Front Panel Assembly....................................................................................................... 4 Peripheral Bay.................
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OCPRF100 MP Server System Technical Product Specification Revision 1.0 Fan Connector .......................................................................................................... 47 Peripheral Bay Power Connector.............................................................................. 47 Peripheral Bay Backplane Header ............................................................................ 48 LED Board Connector .............................................................
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OCPRF100 MP Server System Technical Product Specification Revision 1.0 Advanced Menu ........................................................................................................ 78 Security Menu ........................................................................................................... 82 Server Menu.............................................................................................................. 83 Boot Menu................................................
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OCPRF100 MP Server System Technical Product Specification Revision 1.0 Mechanical Description................................................................................................. 111 Board Layout........................................................................................................... 111 Front Panel .............................................................................................................................. 113 Introduction .........................
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OCPRF100 MP Server System Technical Product Specification Revision 1.0 1. Introduction This document provides an overview of the OCPRF100 MP server system and includes informa- tion on cabling, connectors, power supply, and regulatory requirements. Document Structure and Outline This document is organized into ten chapters: Chapter 1: Introduction Provides an overview of this document. Chapter 2: Server System Chassis and Assemblies Provides an overview of the chassis hardware. Chapter 3: System
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OCPRF100 MP Server System Technical Product Specification Revision 1.0 This page intentionally left blank. 2
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OCPRF100 MP Server System Technical Product Specification Revision 1.0 2. Server System Chassis and Assemblies This chapter describes the chassis and assembly pieces that reside within the chassis. This chapter is divided into the following areas: Front panel assembly Peripheral bay Top cover assembly Fan bay Front panel board Processor mezzanine board Processor retention mechanism ® Profusion carrier tray Midplane assembly I/O carrier assembly Power supply OCPRF100 MP s
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OCPRF100 MP Server System Technical Product Specification Revision 1.0 2.1 Front Panel Assembly The front panel assembly consists of an upper and lower bezel. The bezels serve as cosmetic pieces only, and can be integrator specific. Finger grips are provided to make it easy to remove the bezels. Removing the bezels exposes the front side of the fan bay, the front panel controller (FPC) switches (power, reset, and nonmaskable interrupt (NMI)), as well as the indicator lights (power indicator,
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OCPRF100 MP Server System Technical Product Specification Revision 1.0 Figure 2-3: Peripheral Bay 2.3 Top Cover Assembly The top cover assembly is released by removing the two retaining screws located on the top toward the front (E in Figure 2-4: Hot-plug PCI Access Door), between the fan bay assembly and the top cover assembly marked with the AC caution icon. The cover slides toward the rear of the server and then lifts straight up off of the server chassis, exposing the upper portion of the
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OCPRF100 MP Server System Technical Product Specification Revision 1.0 2.3.1 Hot-plug PCI Access Door The hot-plug PCI access door is released by removing the two retaining screws (A in Figure 2-4: Hot-plug PCI Access Door) located on the top, middle area of the server. The cover slides toward the rear of the server and lifts straight up off of the server chassis, exposing the hot-plug PCI cards. The hot-plug PCI access door is designed to maintain a flush surface with the top cover assem- bl
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OCPRF100 MP Server System Technical Product Specification Revision 1.0 The fan bay will operate at high speed on the following conditions: Internal temperature has reached an elevated, but noncritical set-point. Ambient temperate exceeds 30°C. A fan has entered into the predictive failure mode. A fan has failed. If the FPC detects a fan entering the predictive fan failure mode, the speed of all of the fans will be increased to maintain thermal requirements. The individual fans within th
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OCPRF100 MP Server System Technical Product Specification Revision 1.0 Fans are installed with the connector on the left side facing down. The cavities in the fan bay are keyed to prevent a fan from being installed backwards. The fan bay is installed after the Profusion carrier assembly is installed and completely seated into the midplane. The fan bay is lowered into the chassis until it is seated on the flanges of the Profusion tray. Two screw holes, one on each side, should now be aligned o
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OCPRF100 MP Server System Technical Product Specification Revision 1.0 Figure 2-6: Front Panel Board Installation 2.6 Processor Mezzanine Board The base configuration of an OCPRF100 MP server system consists of a single processor mez- ® zanine board. The processor mezzanine board is designed to support one to four Pentium III Xeon™ processors, providing power, ground and other connections to the processor(s) and to the Profusion carrier. The processor mezzanine board incorporates integrated vo
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OCPRF100 MP Server System Technical Product Specification Revision 1.0 A B C Captive Screw Hold-down Air Baffle Strap Figure 2-7: Processor Retention Mechanism A processor/termination card pair is secured with a hold-down strap (B) that hooks into the back of the retention mechanism and is fastened at the front with two captive screws (A). (The reten- tion strap is for a pair of processors or terminators). See Figure 2-7: Processor Ret
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OCPRF100 MP Server System Technical Product Specification Revision 1.0 ® 2.8 Profusion Carrier Tray The processor mezzanine boards plug into the Profusion carrier tray. The Profusion carrier tray serves as a platform to provide power and signals to the processor mezzanine board, route sig- nals through the 1008-pin grand connector, and carry components of the Profusion chip set. Components of the Profusion chip set that reside on the Profusion carrier are the memory access controller (MAC) an
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OCPRF100 MP Server System Technical Product Specification Revision 1.0 then moving back into place for connection to the Profusion carrier board. Place the four lock bars over the protruding tabs and onto the Profusion carrier board (B). The release handles of the lock bars (C) should be pointed to the outside of the board and they should be in the unlocked position. Place the first mezzanine board on the left side of the Profusion carrier board, oriented so the mezzanine board does not exte
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OCPRF100 MP Server System Technical Product Specification Revision 1.0 nectors begin to engage, rotate the levers back until the connectors are fully engaged. Levers should be in an upright or near upright position. Secure the tray and the processor retention mechanism to the sides of the chassis with screws (1) and (2) as indicated in Figure 2-9. 2.9 Midplane Assembly The midplane assembly serves as an interconnect between the power supplies, memory boards, Profusion carrier, and the I/O car
